May 2026– date –
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Henkel Unveils Ultra-Low Viscosity Technomelt PA 6370 for Rugged Electronics Protection and Accelerated Manufacturing
Henkel Germany Overview Henkel has launched Technomelt PA 6370, an ultra-low melt viscosity hot melt material designed for robust protection of challenging electronic device designs. This new polyamide-based material offers a high-speed,... -
Adhesive Type Critically Influences Delamination Risk and Recyclability in High-Stress Applications
PatSnap Eureka Global Overview Adhesive bonding technologies are evolving to join diverse materials with high reliability, though delamination remains a challenge, particularly in high-stress applications. While structural adhesives like... -
H.B. Fuller Unveils VerdaFresh Oxygen Barrier Coating to Enable Fully Recyclable Monomaterial Packaging
StreetInsider USA Overview H.B. Fuller Company has announced a strategic investment in VerdaFresh, an oxygen barrier technology designed to enhance its barrier coating portfolio and accelerate the shift to fully recyclable monomaterial p... -
H.B. Fuller Increases Adhesive and Sealant Prices Citing Geopolitical Instability and Logistics Challenges
Adhesives & Sealants Industry USA Overview H.B. Fuller has implemented price increases across all product lines in response to persistent supply constraints in petrochemicals, elevated energy costs, and continuous pressure on specialty c... -
Graco Acquires Valco Melton for $447 Million, Enhancing Adhesive Dispensing and Quality Assurance Capabilities
Label and Narrow Web USA Overview Graco Inc. has finalized a $447 million acquisition of Valco Melton, a provider of adhesive application and quality assurance systems. This strategic move expands Graco's industrial portfolio, bolstering... -
Dymax’s Hybrid Light-Curing Adhesive Powers Faster, More Reliable Medical Device Assembly
PRNewswire (AAP News経由) USA Overview Dymax has launched HLC-M-1004, a novel low-viscosity hybrid light-curing adhesive engineered to significantly streamline the assembly of complex medical devices. Expanding their HLC™ Adhesives portf... -
AI-Driven Platform Accelerates Sustainable Adhesive Development for Packaging
EIN Presswire USA Overview Silvis Materials has secured a National Science Foundation (NSF) TECP grant to expedite the development of sustainable adhesives using an AI-powered platform. This initiative focuses on optimizing renewable cel... -
AMD Explores Powertech’s FOPLP for Next-Generation Zen 7 CPUs, Eyeing Packaging Diversification
TechPowerUp USA Overview AMD is reportedly exploring Powertech Technology's Fan-Out Panel-Level Packaging (FOPLP) for its upcoming "Zen 7" CPUs, codenamed "Grimlock." This move signals AMD's strategic intent to build increasingly complex... -
Korea Addresses HBM Test Equipment Bottleneck by Fostering Domestic Suppliers
eferix.substack.com South Korea Overview South Korea has identified the HBM test equipment bottleneck, historically dominated by foreign companies like Advantest and Teradyne, as a national supply chain vulnerability. In response, SK Hyn... -
Huawei’s “Tao Law” Proposes 1.4nm-Equivalent Chip Density via Logic Folding and Ultra-Fine Hybrid Bonding
China as a System China Overview Huawei has introduced the "Tao Law," a novel semiconductor process development aiming for 1.4nm-equivalent chip density within five years through "Logic Folding." This method distributes logic gates acros...
