June 2026– date –
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AI Theme Propels Nikkei 225, Driving Significant Gains for Advanced Packaging Material Companies like Resonac and Mitsui Kinzoku
IG Japan Overview The latest Nikkei 225 analysis highlights the significant impact of the AI theme on the market, showing substantial gains for chemical manufacturers like Resonac, a global leader in advanced packaging materials and epox... -
ECTC 2026: Intel Foundry and Amkor Announce Advanced Packaging Technologies for AI/HPC and U.S. Manufacturing Capacity Expansion
Intel Newsroom, Amkor Technology Blog, Semiconductor Engineering USA Overview The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased advanced packaging technologies redefining scalability limits for AI and high-pe... -
pH- and Cellulase-Triggered Bio-Based Adhesive Facilitates Pharmaceutical Blister Pack Recycling
RSC Publishing (Green Chemistry) Unknown Overview Researchers have developed a biodegradable, bio-based adhesive to aid in the recycling of pharmaceutical blister packaging. Composed of cellulose nanocrystals, chitosan, and a bifunctiona... -
DELO Unveils DELO PHOTOBOND LA, a Light-Activatable Adhesive for High-Volume LiDAR Production
Photonics Spectra Germany Overview DELO has launched DELO PHOTOBOND LA, a light-activatable adhesive specifically designed for high-volume LiDAR system production. This adhesive is ideal for critical mirror and cover window bonding in au... -
DiversiTech Acquires Polymer Adhesives, Accelerating Expansion in HVAC-Focused Specialty Adhesives and Sealants Market
Adhesives & Sealants Industry USA Overview DiversiTech Corp. has acquired Polymer Adhesives Holdings LLC, a manufacturer of high-performance duct sealants, adhesives, and fire-stopping materials. This acquisition substantially expands Di... -
German President Visits INM to Witness ‘Living Materials’ and Recyclable Wood Using Bacteria-Derived Bio-Based Adhesives
Leibniz-INM Germany Overview German Federal President Frank-Walter Steinmeier visited INM – Leibniz Institute for New Materials to observe research into "living materials." A highlight was the demonstration of fully recyclable, sustainab... -
Dutch NWO Funds Bio-Based Fast Debonding Adhesives to Halve Composite Repair Times for Aerospace Applications with Ministry of Defense Support
NWO (Netherlands Organisation for Scientific Research) Netherlands Overview The Netherlands Organisation for Scientific Research (NWO), with support from the Ministry of Defense, has launched ten research projects, including the developm... -
New Review Highlights Environmentally Friendly Starch-Based Adhesives for High-Performance Wood Composites
ResearchGate (Journal: Polymers) Unknown Overview A new review paper has been published on the use of environmentally friendly starch-based adhesives for bonding high-performance wood composites. This research evaluates the potential of ... -
Mastering 3D-IC Verification Complexity: Multiphysics Analysis Key to Addressing Thermal, Mechanical Stress, and Reliability Challenges
Semiconductor Engineering USA Overview As the semiconductor industry transitions from 2D to 2.5D and 3D-IC configurations, verification complexity is escalating significantly. This article emphasizes the necessity of multiphysics analysi... -
Samsung Electronics Leads Advanced Packaging with Projected Triple HBM Sales and Thinnest 0.65mm LPDDR DRAM Package Development
Simply Wall St South Korea Overview Samsung Electronics is leading advanced packaging advancements by leveraging extensive in-house expertise to streamline production cycles and reduce lead times. The company projects its High Bandwidth ...
