June 2026– date –
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New Technology
Comprehensive Review of SiC Power Module Packaging: Silver and Copper Sintering Key to Enhanced Thermal and Electrical Performance
IEEE Xplore Unknown Overview A comprehensive review paper analyzes the latest technologies in SiC power module packaging, focusing on layout, material systems, and integration. The review emphasizes how advanced die-attach techniques, in... -
New Technology
PCIM Europe 2026 Unveils Innovations in Power Module Reliability and SiC/GaN Power Semiconductor Packaging Technologies
MacDermid Alpha, PCIM Europe Germany Overview PCIM Europe 2026 in Nuremberg, Germany, featured significant innovations in power module reliability and next-generation power semiconductor packaging. MacDermid Alpha unveiled underfills, hi... -
Market Trends
IndexBox Report: EV Battery Bio-Renewable Thermal Films Market to Grow Until 2035, Driven by Thermal Runaway Prevention and Sustainability Goals
IndexBox International Overview This article summarizes a market research report published by IndexBox, forecasting significant growth for the EV Battery Bio-Renewable Thermal Films Market through 2035. Key drivers include increasing dem... -
Business Trends
Henkel North America Facilities Achieve Sustainability Goals with Reduced SMP Adhesive Waste and Energy Efficiency Improvements
Henkel USA Overview Henkel announced significant sustainability advancements across its North American production sites. The Mentor plant implemented material waste reduction measures in silane-modified polymer (SMP) adhesive manufacturi... -
New Technology
High-Performance Bio-Based Natural Rubber Latex Adhesives Reinforced by Grafting-Coordination Hybrid Networks Developed
ACS Sustainable Chemistry & Engineering Unknown Overview An academic paper details the development of high-performance bio-based adhesives with robust interfacial adhesion and environmental durability, crucial for sustainable composite m... -
New Technology
Scanning Acoustic Microscopy (SAM) Enables High-Precision Non-Destructive Detection of Internal Defects in Semiconductor Packaging
Infinita Lab USA Overview Scanning Acoustic Microscopy (SAM) is highlighted as a critical non-destructive tool for high-precision evaluation of internal defects in semiconductors, electronic packaging, and material science. SAM excels at... -
New Technology
Plasma Surface Engineering for Automotive Thermal Management Maximizes TIM Wettability to Minimize Thermal Resistance
KeyLink USA Overview Advanced plasma surface treatment has been introduced to significantly reduce contact thermal resistance in EV powertrain cooling systems. This technology elevates substrate surface energy to over 72 mN/m, achieving ... -
Space Industry
Canadian Space Agency Awards $2M for Lunar In-Situ Resource Utilization (ISRU) Studies: Advancing Self-Sufficiency and Nuclear Power for Moon Bases
SpaceQ Canada Overview The Canadian Space Agency (CSA) has awarded a total of $2 million across four new research contracts for Lunar In-Situ Resource Utilization (ISRU) to explore methods for human survival on the Moon. Canadian Strateg... -
Space Industry
University of Florida Innovates Lunar Construction with Laser ‘Origami’ Technology: 3D Printing Tools and Structures from In-Situ Resources
Universe Today USA Overview Researchers at the University of Florida are exploring innovative methods for constructing structures on the Moon using laser-forming technology, dubbed 'laser origami.' This non-contact process precisely bend... -
Space Industry
Stoke Space Completes Nova Stage 1 Proto-Qualification Testing for Fully Reusable Rocket, Targeting Aircraft-Like Operational Cadence
Stoke Space USA Overview Stoke Space announced the successful completion of proto-qualification testing for the first stage of its fully reusable Nova rocket. This crucial milestone demonstrates the maturity of Nova's hardware, software,...