June 2026– date –
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Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)... -
Europe Boosts Investment in Advanced Packaging and Chiplet Integration; imec’s FAMES Pilot Line Aims to Mitigate Regional Supply Chain Risks
Astute Group UK Overview Europe is significantly increasing investment in advanced packaging and chiplet integration technologies to diversify its semiconductor supply chain and reduce regional procurement risks, shifting focus from pure... -
NVIDIA Locks Down Multi-Year HBM Supply Deals, Anticipating Persistent Shortages Beyond 2028
gagadget.com USA Overview NVIDIA CEO Jensen Huang recently visited South Korea, securing multi-year agreements with key partners including SK Hynix, SK Telecom, Naver, and Doosan Group for High Bandwidth Memory (HBM) supply, AI cloud inf... -
Amkor Bolsters U.S. Semiconductor Ecosystem with Over $7 Billion Investment in Arizona Advanced Packaging Facility
Amkor USA Overview Amkor Technology is dramatically escalating its commitment to a new advanced packaging and test facility in Peoria, Arizona, increasing its investment from an initial $2 billion to over $7 billion. This strategic expan... -
ASE to Raise Advanced Packaging Prices by Up to 20% by 2026 Amid Soaring AI Demand
AXTEK Technology Company Limited Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, plans to increase its backend wafer packaging prices by 5-20% in 2026, driven by a surge in AI-powered semiconductor demand. With... -
Silicon Box Secures $77.5M to Scale Advanced Packaging and Chiplet Integration
DealStreetAsia Singapore Overview Singapore-based semiconductor packaging and chiplet integration startup, Silicon Box, has secured S$100 million (approximately US$77.5 million) in debt financing from a global consortium of institutional... -
Samsung to Establish Gwangju Advanced Packaging Facility, Eyes Full HBM Hybrid Bonding Transition by 2029
TrendForce South Korea Overview Samsung Electronics is reportedly considering a new advanced semiconductor packaging plant in Gwangju, South Korea, with investment plans potentially announced by June 2026. This strategic facility will fo... -
SK Hynix Boosts HBM4 Production with Major TC Bonder Order from Hanmi Semiconductor
The Korea Herald South Korea Overview SK Hynix has made a significant investment, ordering ₩44.2 billion (approx. $28.7 million USD) worth of advanced 'TC Bonder 4.5 Griffin' thermo-compression bonders from Hanmi Semiconductor. This stra... -
TSMC to Boost CoWoS Capacity Tenfold to 130K Wafers/Month by Late 2026, Accelerates Glass-Substrate CoPoS for AI Chips
Tom's Hardware USA Overview TSMC is aggressively expanding its advanced packaging capacity, projecting a tenfold increase in CoWoS production to over 130,000 wafers per month by the end of 2026 to meet surging AI demand. Despite this, de... -
Reliability of AI Antibody Design Hinges on Training Data: AlphaFold Era Highlights Data Quality Challenge
Drug Discovery News USA Overview Advancements in protein AI, such as AlphaFold, have ushered in a new computational era for antibody discovery, enabling predictions of protein folding and interactions with near-experimental accuracy. How...
