June 2026– date –
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U.S. House Demands Space Force Accelerate Commercial Integration to Strengthen Defense Capabilities with Policy Amendments
Air & Space Forces Magazine USA Overview The U.S. House of Representatives formally mandated the Space Force to procure more commercial technologies and services through amendments approved as part of the FY2027 National Defense Authoriz... -
Apex Secures Over $200M in Funding at $2.3B Valuation to Scale High-Rate Satellite Production for Proliferated Constellations
Apex USA Overview Apex announced over $200 million in new funding, elevating its valuation to $2.3 billion, to significantly scale its high-rate satellite production facilities. The capital will enable the expansion of manufacturing infr... -
NASA Awards $300M Johnson Space Center Modernization Contract to Seven Firms, Including Conti Federal, Targeting $43M in Savings
Morningstar USA Overview NASA has awarded a multi-year construction contract worth up to $300 million to seven companies, including Conti Federal Services, LLC, to modernize aging facilities and infrastructure at the Johnson Space Center... -
JAXA’s New H3-30 Rocket Successfully Launches Six Small Satellites, Paving Way for MMX Mission After Previous Failure
The Japan Times Japan Overview JAXA successfully launched its new low-cost H3-30 rocket variant, carrying a VEP-5 test payload and six small satellites into orbit, marking a critical recovery after a previous failure. This configuration,... -
TSMC’s COUPE Platform for Co-Packaged Optics Targets 2026 Mass Production, Integrating Micro LEDs for AI Cluster Performance Boost
The Storm Media Taiwan Overview TSMC has announced the 2026 mass production launch of "COUPE" (Compact Universal Photonic Engine), an innovative platform for co-packaged optics (CPO) interconnects. Utilizing SoIC bonding to stack photoni... -
Apple’s M5 Ultra Pioneers Integration with TSMC’s N3P Process and SoIC-mH Packaging
TrendForce Taiwan Overview Reports indicate Apple's upcoming M5 Ultra chip, expected at WWDC, will likely leverage TSMC's N3P process node and its advanced SoIC-mH (System-on-Integrated-Chips – molded horizontal packaging) technology. So... -
Intel and Tesla Partner on AI6 Data Centers, Tapping Advanced Packaging for Production at Austin’s ‘Terafab’
Jamie's Substack USA Overview Tesla has announced a strategic partnership with Intel Foundry Services to scale its AI6 chip-powered data center clusters, extensively utilizing Intel's advanced packaging technologies. The collaboration wi... -
Advanced Packaging’s Evolution: 2.5D/3D Integration, Chiplets, and Hybrid Bonding Propel AI and HPC
Springer Professional Germany Overview Semiconductor packaging technology has dramatically evolved from 2D to 2.5D and 3D IC integration, a transformation accelerated by the explosive demand from AI and High-Performance Computing (HPC). ... -
Sub-10nm Residual Distortion Achieved in Low-Distortion Fusion Bonding with Pneumatically Curved Wafers for Advanced Semiconductors
arXiv USA Overview A recent arXiv publication reports the development of a novel low-distortion fusion bonding technique that employs pneumatically curved wafers to achieve an exceptionally low residual grid distortion of less than 10 na... -
Glass Substrates: The Next Frontier in AI Packaging and the Race to Mass Production
The Economy South Korea Overview Glass substrates are rapidly emerging as a transformative technology in advanced AI chip packaging, poised to replace conventional organic substrates and silicon interposers by offering superior dimension...
