June 2026– date –
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SK Group Chairman Deepens AI Alliances with Nvidia and TSMC, Expanding Next-Gen HBM and Advanced Packaging Collaboration
The Korea Herald South Korea Overview SK Group Chairman Chey Tae-won has strengthened alliances with leading AI chipmakers, meeting with Nvidia CEO Jensen Huang and later with TSMC Chairman C.C. Wei in Taiwan. Discussions focused on expa... -
Credo Completes DustPhotonics Acquisition, Bolstering Co-Packaged Optics (CPO) Solutions to Accelerate AI Data Centers
Advanced Packaging News USA Overview Credo has completed its acquisition of DustPhotonics, significantly strengthening its Co-Packaged Optics (CPO) solutions. This acquisition is poised to advance high-bandwidth, low-power interconnect t... -
Marvell Unveils Industry’s First 102.4 Tbps AI Switch, Doubling Bandwidth for AI Data Center Networks
Advanced Packaging News USA Overview Marvell announced the industry's first 102.4 Tbps AI switch, setting a new benchmark for network bandwidth in AI data centers. This innovative switch doubles bandwidth compared to current top-performi... -
Samsung Electronics to Invest $1.5 Billion in Vietnam Semiconductor Test Facility Amid Surging AI Chip Demand
Quintile Reports South Korea Overview Samsung Electronics announced plans to invest approximately $1.5 billion in a semiconductor testing facility in Vietnam to address the memory chip shortage caused by surging AI chip demand. This stra... -
Hybrid Bonding Unlocks New Frontiers in 3D Integration, Driving AI Accelerators and Chiplet Designs
PatSnap UK Overview Hybrid bonding, an innovative 3D integration technology, enables both electrical continuity and mechanical integrity without solder or microbumps by combining metal-to-metal (primarily Cu-Cu) and dielectric-to-dielect... -
Intel Commits to Massive Advanced Packaging Push for Foundry Revival, EMIB Capacity Expansion Key
BusinessKorea USA Overview Intel is committing to a massive expansion of its advanced semiconductor packaging capabilities to accelerate its foundry business revival, with a core focus on expanding its proprietary EMIB (Embedded Multi-di... -
GlobalFoundries Triples Malta Fab Capacity with $16 Billion US CHIPS Act Investment, Targeting 1.5 Million Wafers/Year by late 2028
Tom's Hardware USA Overview GlobalFoundries is advancing a $16 billion US investment plan, bolstered by the CHIPS Act, to triple production capacity at its Malta fab. This includes an 11 billion Euro expansion at its Dresden plant, aimin... -
Hiwin and Qualcomm Integrate Edge AI into Panel-Level Semiconductor Packaging to Enhance Production Accuracy and Throughput
Packnode Taiwan Overview Taiwanese motion control specialist Hiwin Technologies is collaborating with Qualcomm to integrate Dragonwing Q6 Edge AI into panel-level semiconductor packaging (PLP) equipment. This partnership combines machine... -
Dow Showcases Next-Gen AI Thermal Management Technologies at COMPUTEX Taipei 2026, Supporting 400G+ Optical Transceivers
chemXplore USA Overview Dow showcased next-generation thermal management technologies for AI servers and high-speed optical transceivers at COMPUTEX Taipei 2026. The company presented thermal interface materials (TIMs) and silicone-based... -
Amkor Technology Acquires 67 Additional Acres in Arizona, Expanding U.S. Advanced Packaging Footprint
Dataquest Bureau USA Overview Amkor Technology has secured an additional 67 acres adjacent to its existing campus in Peoria, Arizona, to significantly expand its U.S. advanced semiconductor packaging and test capabilities. This strategic...
