August 2026– date –
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EPC Space Launches 15V, 25V, and 40V Rad-Hard eGaN FETs with >1 Mrad TID for Next-Gen Space Computing
Semiconductor Today USA Overview EPC Space LLC has announced the release of three new radiation-hardened eGaN power transistors (15V, 25V, 40V) designed for next-generation space computing systems. These devices offer ultra-low on-resist... -
President Trump Signs National Space Transportation Policy to Support Over 1,000 Annual Launches and Re-entries by 2030
The White House USA Overview President Trump has signed a national space transportation policy aimed at supporting over 1,000 annual space launches and re-entries by 2030. This memorandum directs NASA to facilitate commercial space trans... -
Microgravity Crystallization Poised to Revolutionize In-Space Manufacturing for High-Value Materials, Detailing Challenges and Future Directions
ACS Publications USA Overview A recent review highlights the expanding relevance of microgravity crystallization from structural research to low Earth orbit (LEO) and future in-space manufacturing (ISM) applications. This technique offer... -
Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory
Chinadaily.com.cn China Overview Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased ... -
Henkel Launches LOCTITE ABLESTIK CDF900 Conductive Die Attach Film with Over 8 W/m-K Thermal Conductivity for High-Power AI Packages
Henkel Germany Overview Henkel has introduced the LOCTITE ABLESTIK CDF900 series conductive die attach film to address thermal management challenges in high-power AI packages. This new product significantly boosts thermal conductivity to... -
HANMI Semiconductor Invests $91.4 Million in Largest-Ever 8th Production Facility in Incheon to Meet Soaring AI Chip Demand
Business Wire South Korea Overview HANMI Semiconductor is investing $91.4 million (approximately 130 billion KRW) to establish its largest-ever 8th production facility in Incheon, by acquiring Mercury Co., Ltd.'s factory, to proactively ... -
Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
Morgan Stanley Taps Samsung Electro-Mechanics as Top Korean Tech Pick Amid Surging AI Chip Substrate Demand
Evrim Ağacı Turkey Overview Morgan Stanley has elevated Samsung Electro-Mechanics to its premier Korean tech stock, citing the escalating technical demands of AI chip designs on advanced substrates. As AI processors become larger, multi-... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
Japan’s Shinko Electric Develops 22-Layer Glass Substrates for AI Chips, Resolving Internal Cracking and Delamination Issues
TrendForce Japan Overview As AI chips demand larger packages, intensifying competition in glass substrates, Japan's Shinko Electric Industries has successfully developed 22-layer glass substrates with 11 copper wiring layers on each side...
