August 2026– date –
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STMicroelectronics Maintains $2 Billion Investment Amid Net Loss, Bolstering SiC, 300mm Fabs, and Advanced Packaging
Seeking Alpha Switzerland Overview Despite reporting a net loss in the first half of 2026, STMicroelectronics (STM) plans to maintain its net capital expenditure near the upper end of the $2-2.2 billion range for the year, focusing on Si... -
Fraunhofer IKTS Achieves Real-Time Detection of 8µm Packaging Seal Defects Using Optical Coherence Tomography (OCT)
Fraunhofer-Gesellschaft Germany Overview Researchers at Fraunhofer IKTS have developed an innovative inspection system based on Optical Coherence Tomography (OCT), successfully enabling continuous, real-time, and non-destructive detectio... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
SK Hynix Breaks Ground on $3.87 Billion Advanced Packaging Plant in Indiana for HBM Production
The Korea Herald South Korea Overview SK Hynix is set to hold a groundbreaking ceremony this month for a $3.87 billion advanced chip packaging plant in Indiana, intensifying its U.S. presence in AI chip production. The facility, near Pur... -
Applied Materials Raises Advanced Packaging Revenue Forecast to Over 70% Growth on AI Demand, Unveils New HBM Systems
TrendForce USA Overview Applied Materials has significantly revised its advanced packaging revenue forecast for 2026 to over 70% year-over-year growth, a 20-percentage-point increase in just three months, driven by soaring AI semiconduct... -
Advanced Thermal Interface Materials Evolve to Combat AI Chip Heat, Spanning Liquid Metals to Polymer Composites
Exponential Industry USA Overview Thermal Interface Materials (TIMs) are becoming indispensable for semiconductor thermal management, addressing the escalating power density and heat generation in AI processors. Current packaging relies ... -
PackCon 2026 to Discuss How Sustainable Packaging Drives Business Value
EuroCham Singapore Singapore Overview Scheduled for August 26, 2026, in Singapore, PackCon 2026 is an international event dedicated to exploring how sustainable packaging drives business value. Industry leaders, policymakers, sustainabil... -
JCET Achieves 79.4% YoY Net Profit Growth in H1 2026, Accelerates Advanced Packaging to Meet AI Demand
PR Newswire China Overview JCET Group, a leading global outsourced semiconductor assembly and test (OSAT) provider, reported impressive financial results for the first half of 2026, with net profit attributable to shareholders surging by... -
Amkor Technology Expands U.S. Advanced Packaging Footprint by 67 Acres in Arizona, Bolstering Domestic Manufacturing
Amkor Technology, Inc. USA Overview Amkor Technology has secured an additional 67 acres (approximately 270,000 square meters) adjacent to its existing advanced packaging and test campus in Arizona, significantly expanding its U.S. back-e...
