Key Findings
Indium Corporation will showcase a wide array of innovative material solutions at SEMICON Taiwan 2026, designed to support advancements in Artificial Intelligence (AI) technology. The exhibition will highlight products specifically for Heterogeneous Integration and Assembly (HIA) and advanced Thermal Interface Materials (TIMs), presenting essential technologies for enhancing the performance and reliability of AI semiconductors.
Technical / Clinical Details
Key products to be featured include:
- Solder TIMs: These offer superior heat dissipation capabilities and high thermal conductivity (specific figures undisclosed, but targeting industry-leading performance), enabling efficient cooling for high-power AI processors.
- InFORCE®MF Pressure Ag Sintering Paste: Developed for SiC (Silicon Carbide) power device die attach, this paste achieves high reliability and thermal conductivity through its high metal and low organic content. Pressure sintering helps reduce voids and forms robust bonds.
- InBAKE™29 Cu Sintering Paste: A copper sintering paste boasting high thermal conductivity, contributing to improved performance in applications requiring high-temperature operation.
- Heat-Spring® HSx: A compressible, non-reflow metallic TIM capable of handling large dies with warpage exceeding 200 microns. It leverages physical pressure to achieve excellent thermal contact and minimize contact resistance, thereby supporting the stable operation of large-scale AI chips.
These materials are engineered to address the challenges of increased integration and heat generation in AI semiconductors, aiming to eliminate thermal management bottlenecks in complex systems.
Background & Context
The evolution of AI and High-Performance Computing (HPC) has dramatically increased the computational power and power consumption of semiconductor chips. This, in turn, has made chip-level thermal management one of the most critical challenges, as conventional materials struggle to keep pace. Heterogeneous integration (HIA) technology enhances performance by combining multiple dies with different functionalities into a single package, but it presents challenges related to thermal expansion coefficient mismatches and ensuring adequate thermal conductivity between materials. Indium Corporation’s solutions directly tackle these issues, enabling the realization of next-generation AI chips.
Strategic Significance & Outlook
Indium Corporation’s innovative materials have the potential to establish new standards for thermal management and packaging in the AI semiconductor market. The advancements in sintering pastes, in particular, will also contribute to improving the reliability of power electronics and high-frequency devices, with broad adoption expected across various industrial sectors. The exhibition at SEMICON Taiwan underscores the significant impact these technologies will have on the entire AI ecosystem and marks a crucial step in defining future technological innovation.
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