Scientech Sees 50% Surge in Advanced Packaging Equipment Shipments Driven by AI Demand; TSMC’s CoPoS Production Set for 2027 Launch

Taipei Times Taiwan

Overview

Scientech Corp, a supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-on-year increase in shipments for 2026, fueled by robust AI application demand and rapid technological shifts. Its production lines are fully booked through year-end, with growth expected to continue into 2027. Scientech also noted TSMC is building a pilot line for CoPoS packaging, projecting mass production to commence in another year.

In Depth

Key Findings: Scientech Achieves 50% Surge in Advanced Packaging Equipment Shipments; TSMC CoPoS Mass Production Expected Post-2027

Scientech Corp, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, announced an expected 50% year-on-year increase in equipment shipments for 2026. This growth is driven by robust demand from AI applications and rapid technological transitions in the semiconductor industry. The company’s production lines are operating at full capacity through the end of the year, with sustained growth projected into 2027. This highlights the current high demand and future prospects in the advanced packaging market.

Technical & Market Details: CoPoS Packaging Status and Scientech’s Contribution

• Surging Shipments: Scientech’s advanced packaging equipment is critical for enabling heterogeneous integration and 3D stacking technologies, which are essential for enhancing AI chip performance. The 50% increase in shipments indicates a healthy expansion across the entire semiconductor back-end market.
• TSMC CoPoS Development: Scientech referenced that TSMC, a leader in the semiconductor industry, is currently constructing a pilot line for CoPoS (Chip-on-Package-on-Substrate) packaging. This technology aims to enable more advanced chip integration, with mass production anticipated to take another year. This suggests that cutting-edge packaging technologies are still in the development and optimization phases.
• Reclaimed Wafer Business: The company also provides reclaimed wafers, a crucial business that contributes to cost reduction and environmental footprint minimization in semiconductor manufacturing processes.

Background & Industry Context: AI Revolution Driving Back-End Investment

The rapid advancements in AI, HPC, and autonomous driving necessitate increasingly powerful and energy-efficient chips. Meeting these requirements demands not only conventional miniaturization but also advanced back-end technologies such as chiplet integration and 2.5D/3D packaging. Semiconductor manufacturers worldwide are making significant investments in packaging capabilities to meet this demand, and equipment suppliers like Scientech are major beneficiaries.

Strategic Significance & Outlook: Sustained Growth and Technical Challenges

Scientech’s strong performance reflects the robust growth trend in the advanced packaging market, which is expected to continue its momentum in the coming years. TSMC’s CoPoS like next-generation technologies, once mass-produced, will further generate new demand. However, the complexity of new packaging technologies presents technical challenges such as stabilizing mass production yields and optimizing costs. Scientech aims to maintain its market leadership by providing equipment and solutions that address these evolving challenges.

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