2026– date –
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U.S. Senators Introduce Bipartisan ‘Semiconductor Supremacy Act’ to Include Space-Based Chip Manufacturing in CHIPS Act Tax Credits, Boosting Competitiveness Against China
Ted Budd (Senator's Official Website) USA Overview U.S. Senators Ted Budd and Michael Bennet introduced the bipartisan 'Semiconductor Supremacy Act' on June 11, clarifying that CHIPS and Science Act tax credits will encompass space-based... -
SpaceX Unveils ‘AI1’ Orbital Data Center Satellite and Ambitious 1-Million AI Satellite Constellation Plan
BGR USA Overview SpaceX has announced 'AI1,' the world's first orbital data center satellite designed for in-space AI computation, featuring swappable compute payloads and a 150-kilowatt solar array. CEO Elon Musk detailed plans to integ... -
SpaceX Starship V3 Demonstrates Engine Shutdown Capability in Flight 12 Test, Targets Florida Launches and Booster Reuse by Year-End
OkDiario USA Overview SpaceX's Starship V3 completed its Flight 12 test on May 22, demonstrating crucial engine shutdown capabilities despite a booster anomaly that triggered an FAA investigation. The ambitious roadmap includes Starship ... -
JAXA H3 Rocket Achieves Critical Return-to-Flight Success, Deploying 6 Satellites with Upgraded Engine Configuration; Next Launch Targets QZSS Satellite in August
Space.com Japan Overview The Japan Aerospace Exploration Agency (JAXA) successfully launched its H3 rocket on June 12, deploying six small satellites, including an ocean observation satellite and a space debris removal technology demonst... -
imec Breaks New Ground: III-V Chiplets on RF Silicon Interposer Achieve 100x Capacitance Density Boost and Sub-600nm Precision
OriginBrief ベルギー Overview imec has announced a significant breakthrough in heterogeneous integration, successfully integrating III-V chiplets onto a 300mm RF silicon interposer platform. This achievement delivers a 10-100x increase i... -
Amkor Technology Shifts SiP Production to Vietnam to Enhance High-Value Programs, Driven by Strong Demand for Advanced Packaging in Premium Smartphones
TradingView USA Overview Amkor Technology continues to benefit from robust demand for advanced packaging solutions like flip-chip and System-in-Package (SiP), fueled by increased semiconductor content in premium smartphones. The company ... -
Nokia Announces Major Expansion of U.S. Advanced Semiconductor Test and Packaging Operations in Pennsylvania, Doubling Workforce to Over 500, to Bolster AI Infrastructure
GlobeNewswire USA Overview Nokia has unveiled a major expansion of its Advanced Test and Packaging (ATP) operations in Allentown, Pennsylvania. This investment aims to enhance domestic production capacity for optical networking technolog... -
TSMC Accelerates CoPoS Packaging Development, Standardizing 310x310mm Panel Format; Introduces Glass Core Substrate for CoWoS Towards Late 2028 Mass Production
TrendForce Taiwan Overview TSMC is accelerating the development of its CoPoS (Chip-on-Panel-on-Substrate) packaging architecture, standardizing a 310x310mm panel format, with pilot production targeted for 2027 and mass production in late... -
SK hynix Begins Shipping Next-Gen HBM4E AI Memory Chips with 12-Layer Stack, 48GB Capacity, 16Gbps per Pin, and Over 20% Power Efficiency Boost
Bisinfotech South Korea Overview SK hynix has commenced shipments of its next-generation HBM4E AI memory chips, featuring a 12-layer stack with 48GB capacity, ultra-fast data transfer rates of up to 16Gbps per pin, and over 20% improved ... -
Samsung Considers New HBM-Focused Advanced Semiconductor Packaging Plant in South Korea’s Honam Region to Meet AI Server Demand
SamMobile South Korea Overview Samsung Electronics is exploring the construction of a new advanced semiconductor packaging facility in South Korea's Honam region, with Gwangju emerging as a prime candidate. This project aims to bolster S...
