Semiconductor Back-End Weekly Report May 31, 2026

AMD Explores Powertech’s FOPLP for Next-Generation Zen 7 CPUs, Eyeing Packaging Diversification

Korea Addresses HBM Test Equipment Bottleneck by Fostering Domestic Suppliers

Huawei’s “Tao Law” Proposes 1.4nm-Equivalent Chip Density via Logic Folding and Ultra-Fine Hybrid Bonding

Heterogeneous Integration Advances with Hybrid Bonding, Tackling Critical Power and Thermal Challenges for AI and 5G/6G

Tokyo Electron and Samsung Boost Capex for Hybrid Bonding Equipment Amid Advanced Packaging Shift

NVIDIA CEO Jensen Huang Projects $150 Billion Annual Investment in Taiwan’s AI Supply Chain

NVIDIA’s CoWoS Bottleneck Eases, HBM Supply Emerges as Primary Constraint for AI Accelerators

Hanmi Semiconductor Forecasts HBM4 TC Bonder Rebound in Q2, Announces US Expansion Plans