Adhesives & Sealants Weekly Report May 31, 2026

Adhesives & Sealants Weekly Report July 19, 2026

Sheen Technology Releases Optimal Thermal Adhesive Application Guide for Screw-Less AI Edge Sensors and EV Battery Designs

SEMI Advanced Packaging Summit 2026 Highlights HBM and 2.xD Packaging as Key Innovators for AI/HPC Performance and Power Efficiency

New 230°C High-Heat-Resistant Epoxy Encapsulation Material (EME-G785 Series) Boosts SiC Power Module Applications and Thermal Performance

Graphite Proves Essential for NEV Battery Thermal Management, Cutting Peak Temperatures by up to 35%; Sheen Technology Offers Lightweight Graphene Thermal Pads

BYK Acquires Radar Dome Measurement System Company, Bolstering Presence in Autonomous Driving Market and Anticipating Related Adhesive and Sealant Demand

AI and EVs Drive 2026 Semiconductor Market, High-Bandwidth Memory (HBM) and Advanced Manufacturing Nodes Emerge as Key Growth Themes

AI Fuels “Golden Age” of Advanced Packaging: Amkor-TSMC 10-Year CoWoS Deal Strengthens U.S. Supply Chain, ASE Builds 6 New Fabs Globally