Market Trends– category –
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Redwire Partners with Kanematsu to Expand Space Infrastructure and Microgravity Technology Portfolio in Japan
SatNews USA Overview Redwire Corporation announced a strategic teaming agreement with Japan's Kanematsu Corporation to expand Redwire's space infrastructure and microgravity technology portfolio in Japan. Kanematsu will manage market acc... -
US FAA Completes Part 450 Transition for Commercial Space, Office of Space Commerce Advances Mission Authorization Proposal
Nelson Mullins USA Overview The U.S. Federal Aviation Administration (FAA) completed its transition to the performance-based Part 450 launch and reentry licensing for commercial space in March 2026. Concurrently, the Office of Space Comm... -
Beyond SpaceX: Diverse Space Economy Fueled by Satellite, Data, and Microgravity Biotech Growth
American Century Investments USA Overview The space economy is diversifying significantly beyond rocket launches, driven by opportunities in satellites, Earth observation data, and microgravity biotechnology, according to American Centur... -
Global Semiconductor Sales Soar 2.2x to Record $134.5 Billion in June 2026; TSMC Achieves Over 99% CoWoS Yield But Flags HBM and ABF Substrate Bottlenecks
Amiko Consulting Japan Overview Global semiconductor sales reached an unprecedented monthly high of $134.5 billion in June 2026, marking a 2.2-fold increase year-over-year, driven by a dramatic surge in AI data center investments across ... -
Global Semiconductor Capital Investment to Surge 30% to $240 Billion in 2026, Driven by AI Inference Demand; Advanced Packaging Fuels Multi-Year Double-Digit Growth
Soka Technology Unknown Overview The global semiconductor industry is projected to enter an unprecedented capital investment supercycle in 2026, driven by a skyrocketing demand for AI inference capabilities. Industry forecasts estimate t... -
ASMPT’s Advanced Packaging Business Achieves Record H1 2026 Sales Driven by Surging AI Demand; Panel-Level Packaging Positioned as Key Future Growth Driver
ASMPT Corporate (Press Release) Hong Kong Overview ASMPT reported robust interim results for H1 2026, with its Advanced Packaging (AP) business achieving record sales, primarily fueled by the accelerating demand from the AI sector. The c... -
U.S. Commerce Department to Invest Up to $874 Million in Seven Semiconductor Companies Across AI, Advanced Packaging, and Supply Chain Security
AnySilicon USA Overview The U.S. Department of Commerce announced its intent to provide up to $874 million in incentives to seven semiconductor technology companies, targeting critical areas such as AI, advanced computing, semiconductor ... -
Applied Materials Significantly Upscales 2026 Advanced Packaging Growth Forecast to Over 70% as AI Chip Investment Shifts to HBM and Multi-Layer Integration
Xenospectrum USA Overview Applied Materials has substantially elevated its 2026 advanced packaging revenue growth forecast to over 70%, a 20-point jump from its previous 50%+ projection. This revision reflects a critical expansion of AI ... -
Samsung Electro-Mechanics Sees Semiconductor Package Substrate Utilization Rate Soar to 89%, Driven by AI Data Center Demand
연합뉴스 (Yonhap News) South Korea Overview Samsung Electro-Mechanics reported a significant increase in its semiconductor package substrate utilization rate, reaching an average of 89% in the first half of the year—a 19 percentage point... -
HBM Supply Crunch: Long Backlogs for Bonding Equipment and Low Yields Create Bottleneck, Constraining AI Demand Until 2027
AI CERTs News USA Overview HBM stack manufacturing demands Through Silicon Vias (TSV) and high-precision bonding equipment, with low yield tolerance posing an industry challenge. Limited vendors for these specialized tools mean HANMI, a ...
