Market Trends– category –
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BigGo Finance Report: AI Compute Interconnect at Inflection Point, NPO and CPO Reshaping Industry Value Chain
BigGo Finance USA Overview According to a BigGo Finance report, AI compute interconnects are at a critical inflection point, with Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) fundamentally reshaping the industry value chain. C... -
Credo Technology Group Joins Open CPX MSA to Drive Interoperable Optical Interconnect Development for Next-Gen AI Infrastructure
Business Wire USA Overview Credo Technology Group announced its participation in the Open Co-packaged Interface Multi-Source Agreement (Open CPX MSA) to support the development of interoperable near-packaged and Co-Packaged Optics (CPO) ... -
Marvell Predicts Co-Packaged Optics (CPO) Scale-Up from Late 2027, Emphasizing Taiwan and TSMC’s Central Role
digitimes Taiwan Overview Marvell's Senior Vice President and CTO, Radha Nagarajan, announced at SEMICON Taiwan 2026 that the significant commercial scale-up of Co-Packaged Optics (CPO) is anticipated to begin in late 2027. He emphasized... -
iPronics Raises $125 Million Series B Funding, Including Nvidia’s Participation, to Scale Programmable Optical Networking for AI Data Centers
PR Newswire USA Overview iPronics, a pioneer in silicon photonics-based programmable optical circuit switching, has secured $125 million in Series B funding to accelerate its market expansion and commercial deployment for AI data centers... -
Cisco Declares Co-Packaged Optics (CPO) Ready for Mass Deployment Amid Surging AI Data Center Demand
digitimes USA Overview Cisco announced that Co-Packaged Optics (CPO) has transitioned from a laboratory promise to a commercial necessity, as AI data centers confront critical power budget and bandwidth limitations. While the company ant... -
Ciena Predicts AI to Drive Multi-Year Optical Infrastructure Investment Cycle, Accelerating 800G and 1.6T Optical Connectivity Demand
RCR Wireless News USA Overview Ciena projects that the rapid proliferation of artificial intelligence (AI) will fuel a multi-year investment cycle in optical infrastructure, driven by escalating bandwidth demand and network traffic acros... -
TSMC to Begin Chip-Level Co-Packaged Optics (CPO) Production in H2 2026, Foreseeing Silicon Photonics Dominance in AI
Taipei Times Taiwan Overview TSMC Vice President K.C. Hsu announced at SEMICON that silicon photonics will gain dominance by next year, driven by AI demand, enabling chip-level Co-Packaged Optics (CPO) packaging. TSMC is on track to begi... -
Tower Semiconductor’s Silicon Photonics Surge: AI Drives Nearly Half of Revenue, Fueling $3.6 Billion 2028 Forecast Amidst 300mm Wafer Shift
Seeking Alpha Israel, USA Overview Tower Semiconductor is rapidly establishing itself as a dominant force in silicon photonics, with AI-related optical content now driving nearly half of its revenue. Following a record Q2 2026 revenue of... -
Innoviz Bolsters Leadership with Yoav Har-Even as Board Chair, Eyes Accelerated Automotive LiDAR Dominance
Innoviz Israel Overview Innoviz Technologies, a leading provider of high-performance automotive-grade LiDAR sensor platforms, has announced the appointment of Yoav Har-Even as the new Chairperson of its Board of Directors. This strategic... -
TSMC Predicts Silicon Photonics to Dominar Over Half of Optical Transceiver Market by 2027, Driven by Exploding AI Infrastructure Demand
IN Electronics & Design Taiwan Overview TSMC forecasts that silicon photonics will account for over 50% of the optical transceiver market by 2027, propelled by the accelerated adoption of optical links in AI infrastructure. Their CO-UPE ...
