Market Trends– category –
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Bonafide Research: Global 3D/2.5D IC Packaging Market Accelerates with UCIe Standard, Forecasts Growth Through 2031
Bonafide Research India Overview This article provides an overview of a market research report published by Bonafide Research. According to Bonafide Research's latest report, the global 3D IC and 2.5D IC packaging market is projected to ... -
HBM Supply Crisis of 2026 Projected to Persist Until 2027, Redefining AI Hardware Deployment Bottleneck
EnkiAI USA Overview Explosive growth in the AI sector has triggered a structural HBM supply crisis, making it the primary bottleneck for AI hardware deployment throughout 2026, projected to last until at least 2027. The market has shifte... -
2026 Chip Crisis Sounds Hardware Wake-Up Call: AI Demand Reshaping Semiconductor Supply Chains
Trax Technologies USA Overview The 2026 chip crisis highlighted modern supply chains' deep reliance on semiconductor availability, where chip access dictates the viability and growth of AI accelerators, warehouse robots, autonomous vehic... -
Samsung HBM4 Yield Dramatically Improves from Under 60% to 80%; SK Hynix Labor Talks Stall, Intensifying AI Memory Race
TrendForce Taiwan Overview Samsung's HBM4 yield has dramatically improved from under 60% at launch to 80% within months, according to Seoul Economic Daily. This swift process enhancement by Samsung comes amid tight HBM supply, surpassing... -
SK Hynix Poised to Dominate HBM4 Market with 70% Price Hike and $7B Global Investment for AI Acceleration
SK Hynix South Korea Overview SK Hynix, commanding over 60% of the high-bandwidth memory (HBM) market, projects a nearly 70% price increase for its next-generation HBM4, slated for 2026. To meet soaring AI demand, the company is committi... -
Samsung’s Aggressive HBM4 Investment Targets Top HBM Market Share Next Year, Attracting NVIDIA and AMD Interest
Sammy Fans South Korea Overview According to UBS forecasts, Samsung Electronics is poised to become the world's leading HBM memory manufacturer next year, driven by aggressive investments and expanded production in HBM4. The rapid surge ... -
Micron Initiates Mass Production of 36GB 12-Layer HBM4 for NVIDIA Vera Rubin, Boosts US Semiconductor Investment Over $250 Billion
openPR.com USA Overview Micron Technology commenced mass production of its advanced 36GB 12-layer HBM4 memory in March 2026, shipping to NVIDIA for its Vera Rubin platform. This move underscores the market's rapid shift towards higher-ca... -
TSMC CoWoS & SoIC Packaging Become Primary AI Chip Bottleneck, Forecasting 10-20% Global Supply Shortfall by 2027 Amidst Doubling Demand
Exponential Industry Taiwan Overview TSMC's CoWoS and SoIC packaging technologies are identified as the primary physical constraints in AI GPU and accelerator production. Global CoWoS demand is projected to double from 1.3-1.4 million wa... -
Applied Materials Reports $9.12 Billion in Q3 2026 Revenue, Plans to Double Semiconductor Systems Output by 2028 Amid Surging Demand
GlobeNewswire USA Overview Applied Materials announced Q3 2026 revenue of $9.12 billion, marking a 25% year-over-year increase and slightly exceeding market expectations. The company maintains strong leadership and a pipeline of innovati... -
KLA Forecasts $1.1 Billion in Advanced Packaging Revenue for 2026, Driven by Surging AI and HBM Demand
Quartz USA Overview KLA Corporation anticipates its advanced packaging business revenue will reach approximately $1.1 billion in 2026, representing over 70% year-over-year growth, fueled by increasing AI infrastructure investments and se...
