Market Trends– category –
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Intel’s EMIB-T Advanced Packaging Projected for Significant Contribution by 2029 as CoWoS Constraints Drive Google’s Interest
TrendForce Taiwan Overview Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology, particularly EMIB-T, is attracting strong interest from major tech firms like Google amid persistent TSMC CoWoS supply constraints. Intel projec... -
AI Supply Chain Maxed Out: 40-Week Lead Times Become New Normal as HBM Emerges as Primary Bottleneck Over TSMC CoWoS
Markets Insider USA Overview The AI supply chain faces severe constraints, with 40-week lead times becoming the new norm. High Bandwidth Memory (HBM) has replaced TSMC's CoWoS advanced packaging as the primary bottleneck, driven by NVIDI... -
AI Inference and China’s Strategic Investments Ignite Semiconductor Manufacturing Boom, Propelling Silicon Wafer Recovery
Electronic Device Industry News Japan Overview The semiconductor manufacturing equipment and materials market is experiencing an unexpected boom, fueled by surging demand for inference AI and significant renewed investment from China. Ev... -
AI Boom Spurs China’s Top OSATs to Pour Billions into Advanced Packaging
Digital Today China Overview China's three leading OSAT firms—JCET, Tongfu Microelectronics, and Huatian Technology—have reported significant profit surges in H1 2026, largely due to escalating AI semiconductor demand. In response, these... -
Scientech Forecasts 50% Shipment Growth Driven by AI Demand, Targets Next-Gen CoPoS Market Entry
Taipei Times Taiwan Overview Scientech, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-over-year increase in shipments this year, fueled by robust AI application demand and rapid technol... -
Taiwan and Lithuania Ink €5.6M Tech Pact to Develop Advanced Packaging Machinery for Next-Gen Chips
Taiwan News Taiwan Overview Taiwan and Lithuania have signed an MOU to jointly develop advanced packaging machinery for next-generation chips, committing €5.6 million (approx. $6.5 million USD) over two years in a public-private partners... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
Widespread GLP-1 Agonist Use Reduces US Adult Obesity Rate by 2% (2022-2025); WHO Recognizes Obesity as Chronic Disease
LinkedIn USA Overview Widespread adoption of GLP-1 receptor agonists (Ozempic, Wegovy, Mounjaro, Zepbound) has correlated with a 2% reduction in the US adult obesity rate between 2022 and 2025. This impact is reinforced by ongoing Phase ... -
CDMO Curia Massively Expands Sterile Fill-Finish Capacity in UK, US for Biologics and ADCs
Packaging Digest UK, USA Overview CDMO Curia has significantly expanded its sterile fill-finish manufacturing facilities in Glasgow, UK, and Albuquerque, US, to meet surging demand for biologics and highly potent antibody-drug conjugates...
