Scientech Forecasts 50% Shipment Growth Driven by AI Demand, Targets Next-Gen CoPoS Market Entry

Taipei Times Taiwan

Overview

Scientech, a Taiwanese supplier of advanced packaging equipment and reclaimed wafers, anticipates a 50% year-over-year increase in shipments this year, fueled by robust AI application demand and rapid technological shifts. The company’s production lines are projected to operate at full capacity through year-end, with sustained growth expected into next year. This optimistic outlook is underpinned by TSMC’s forecast of an 80% surge in CoWoS packaging capacity from 2022 to 2027, and Scientech is actively pursuing entry into the next-generation CoPoS packaging supply chain.

In Depth

Key Findings: Scientech Projects 50% Shipment Growth from AI Boom, Eyes CoPoS Market

Scientech, a leading Taiwanese supplier of advanced packaging equipment and reclaimed wafers, has announced a projected 50% year-over-year increase in shipments for the current year. This significant growth is primarily driven by the insatiable demand from AI applications and rapid technological advancements in the semiconductor sector. The company anticipates its production lines will run at full capacity through the end of the year, with this growth momentum expected to continue into the next fiscal year.

Technical & Market Details: Contributing to CoWoS Expansion and Strategic Move to CoPoS

Scientech’s optimistic forecast is rooted in TSMC’s projection that its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity will surge by 80% between 2022 and 2027. CoWoS is a pivotal technology for AI accelerators, and its production expansion presents substantial business opportunities for related equipment and material suppliers. Scientech plays a crucial role in this supply chain by providing essential precision equipment for CoWoS manufacturing and supplying reclaimed wafers. These reclaimed wafers, which are reprocessed test wafers, contribute significantly to cost reduction and environmental sustainability, supporting efficient production ecosystems.

Furthermore, Scientech is actively pursuing entry into the supply chain for the next-generation CoPoS (Chip-on-Panel-on-Substrate) packaging technology. CoPoS holds the potential to accommodate larger substrate sizes and integrate an even greater number of chiplets, making it a critical technology for future ultra-high-performance AI chips and HPC semiconductors. The technological evolution from CoWoS to CoPoS introduces new demands for packaging equipment and materials, prompting companies like Scientech to accelerate their R&D and capital investments.

Background & Industry Context: Equipment Manufacturers’ Vital Role in the AI Semiconductor Ecosystem

The current AI boom is fueling unprecedented growth across the semiconductor industry, with advanced packaging identified as a key bottleneck. High-performance AI chips heavily rely on complex 2.5D/3D integrated packaging, necessitating a consistent supply of precise equipment and high-quality materials. Specialized companies like Scientech are playing a decisive role in expanding advanced packaging capacity, and their growth serves as a barometer for the overall health of the AI semiconductor ecosystem.

Strategic Significance & Outlook: Continuous Innovation and Market Expansion

Scientech’s strong shipment projections and proactive push into CoPoS underscore the sustained expansion of the AI semiconductor market and the high appetite for investment in advanced packaging technologies. Through continuous innovation and capacity enhancements, the company is poised to solidify its position as a critical enabler for next-generation AI chips. As AI technology evolves, the market for advanced packaging equipment and related materials is expected to maintain robust growth, with adaptability to new technologies like CoWoS and CoPoS becoming a key determinant of competitive advantage.

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