New Technology– category –
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imec Unleashes High-Density MIMCAP RF Interposer for D-Band Millimeter-Wave and Sub-THz Communications, Accelerating III-V Chiplet Integration
imec ベルギー Overview imec has unveiled a high-density MIMCAP RF interposer specifically engineered for demanding D-band and sub-THz wireless front-ends, alongside hundreds of gigahertz data center links. This innovative platform priori... -
Park Systems and imec Forge Alliance for Next-Gen 3D Packaging and Logic Metrology
imec Official Press Release ベルギー Overview Nano-metrology leader Park Systems has launched a two-year Joint Development Program (JDP) with imec, a global semiconductor research powerhouse. The partnership focuses on creating cutting-e... -
Glass Core Substrates Emerge as Next-Gen AI/HPC Packaging Technology, Face Commercialization Hurdles in Brittleness and TGV Formation
Pandaily China Overview Glass core substrates are garnering significant attention in the semiconductor packaging industry, driven by escalating performance demands in AI chips, HPC, and advanced processor packaging. They offer superior d... -
Henkel Expands Electronics Materials Investment in Korea, Bolstering HBM Packaging Material Development for Surging AI Semiconductor Demand
The Elec Inc. South Korea Overview German materials giant Henkel is expanding its investment in the electronics materials business in South Korea to meet the escalating demand for AI semiconductors. This includes reinforcing R&D pers... -
TSMC Strengthens Glass Substrate Supply Chain for CoWoS, Achieving 16% Warpage Reduction for High-Performance AI GPUs
Wccftech USA Overview TSMC is expanding its glass substrate supply chain for advanced CoWoS packaging, collaborating with Innolux and Ibiden. Glass substrates demonstrate a 16% reduction in package warpage, along with improved thermal ex... -
ABF Substrates Become AI Accelerator Bottleneck, Nvidia’s H100 Requires 12+ Layers; Glass Substrates Emerge as Next-Gen Solution, Commercialization Years Away
Data Gravity USA Overview Ajinomoto Build-up Film (ABF) substrates are a critical component and growing bottleneck in AI accelerators, HBM, and chiplet-based designs. Nvidia's H100 GPU demands over 12 layers of ABF, with the Blackwell B2... -
TSMC’s CoWoS Capacity, Targeting 125K-130K Wafers/Month by 2026, Still Falls Short as Nvidia Reserves 60% of Output
INDmoney India Overview TSMC's CoWoS advanced packaging remains a hidden bottleneck in AI chip supply, despite targeting 125,000-130,000 wafers per month capacity by the end of 2026. Demand continues to outstrip supply, with TSMC's CEO s... -
Novo Nordisk’s Zenagamutide: Dual GLP-1/Amylin Agonist Delivers Significant Metabolic Gains in Type 2 Diabetes
Healio デンマーク Overview Novo Nordisk's novel unimolecular GLP-1/amylin receptor agonist, zenagamutide, has demonstrated significant reductions in HbA1c and body weight in adults with type 2 diabetes during its Phase 2 clinical trial. ... -
Closing the Innovation Gap: Early CMC Risk Management and Robust Conjugation Strategies for ADCs and AOCs
Industry Publication Unknown Overview As Antibody-Drug Conjugates (ADCs) and Oligonucleotide-Drug Conjugates (AOCs) rapidly expand beyond oncology, early identification of Chemistry, Manufacturing, and Controls (CMC) risks and establishi... -
Hongene Biotech Leverages Chemoenzymatic Ligation to Scale CRISPR sgRNA Manufacturing
Industry Publication / Hongene Biotech Unknown Overview Hongene Biotech is pioneering a chemoenzymatic ligation technology to address the critical scalability challenges in producing single-guide RNA (sgRNA) for CRISPR gene editing. This...
