New Technology– category –
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New Technology
Inside the 800G to 1.6T to 3.2T Race: AI-Driven Optical Network Speeds Accelerate to Production
Chipstrat USA Overview The optical transceiver industry is rapidly progressing from 800G to 1.6T and towards 3.2T, with 1.6T entering production by late 2026 for companies like Marvell. OFC 2026 showcased significant advancements: Cohere... -
New Technology
Sunyu Photonics Introduces NPO Solutions, Bridging Pluggable and CPO with Enhanced Efficiency for AI Data Centers
Sunyu Photonics China Overview Sunyu Photonics introduces Near-Packaged Optics (NPO) as an innovative optical interconnect technology positioned between traditional pluggable optical modules and Co-Packaged Optics (CPO). NPO achieves sho... -
New Technology
Optech Unveils 1.6T and 800G OSFP224 Transceivers for NVIDIA GB300 / DGX AI Platforms
Optech (歐普科技股份有限公司) Taiwan Overview Optech is introducing 1.6T and 800G OSFP224 transceivers, specifically engineered for next-generation AI data centers utilizing NVIDIA's GB300 and DGX platforms. These AI-optimized optics sup... -
New Technology
Demystifying Optical Interconnects for AI: LPO, NPO, CPO, and XPO Defined for Strategic Investment
Gaetano USA Overview This article defines various optical interconnect technologies crucial for AI data centers, including Linear Pluggable Optics (LPO), Near-Packaged Optics (NPO), Co-Packaged Optics (CPO), and XPO. LPO removes or reduc... -
New Technology
C-LIGHT Outlines High-Speed Interconnect Choices for AI Data Centers: 1.6T OSFP-RHS and Immersion Optics
C-LIGHT China Overview C-LIGHT highlights key high-speed interconnect technologies for the AI Data Center Era, specifically mentioning 1.6T/800G/400G/200G optical modules, with a focus on 1.6T OSFP-RHS and liquid immersion transceivers. ... -
New Technology
EEPROM Accuracy Becomes Critical for Linear Pluggable Optics (LPO) in AI Data Centers as DSPs Are Removed
Vitex LLC USA Overview This article discusses the increasing importance of EEPROM accuracy for Linear Pluggable Optics (LPO) in AI data centers, particularly as LPO modules eliminate the DSP and shift signal conditioning to the host SerD... -
New Technology
MIT’s Tiny Light Chip Revolutionizes LiDAR and Optics, Enabling Compact, Solid-State Devices via Silicon Photonics
YouTube (The Linus Tech Tips effect) USA Overview MIT researchers have developed a novel silicon photonics architecture featuring microscopic curved structures that efficiently beam light from a chip into free space without bulky moving ... -
New Technology
Exciton-Polaritons Enable All-Light Switching, Promising Revolution for Energy-Efficient AI Computing
SciTechDaily USA Overview Researchers at the University of Pennsylvania have developed hybrid light-matter particles called exciton-polaritons, formed by coupling photons with electrons in atomically thin semiconductors, to enable all-li... -
New Technology
Lightmatter Unveils Liquid-Cooled Guide DR Laser NIC, Quadrupling Rack Density for AI Clusters
Lightmatter USA Overview Lightmatter announced Guide® DR, an industry-first liquid-cooled Laser Network Interface Card (LNIC) in an OCP NIC 3.0 form factor, designed to quadruple rack density. This innovation relocates the high-density l... -
New Technology
Silicon Photonics Achieves 800G Data Rates with Clear Roadmap to 1.6T+, Enabling Next-Gen AI Infrastructure
Qishuai-cn.com China Overview Silicon photonics is currently capable of powering real data links at 400G and 800G, with a defined roadmap towards 1.6T and higher performance in advanced interconnects. For AI computing and advanced semico...