New Technology– category –
-
Cerium Boosts Stability of Low-Platinum High-Entropy Alloy Catalysts for Acidic Oxygen Reduction Reaction
ACS Publications (Chemistry of Materials) USA Overview Researchers have significantly enhanced the stability of low-platinum high-entropy alloy (HEA) catalysts for the oxygen reduction reaction (ORR) in acidic media, a critical component... -
ASMC 2026 Convenes Global Semiconductor Leaders to Tackle Advanced Manufacturing Challenges and Accelerate Innovation
SEMI USA Overview The Advanced Semiconductor Manufacturing Conference (ASMC 2026), held from May 11-14, brought together semiconductor manufacturers, equipment and materials suppliers, and academia to discuss innovative strategies and me... -
Heraeus Electronics Unveils Advanced Die-Attach Materials for High-Reliability Power Electronics at PCIM Europe 2026
Heraeus Electronics Germany Overview Heraeus Electronics unveiled cutting-edge material technologies for power electronics at PCIM Europe 2026. New offerings include mAgic® PE340 silver pressure sintering paste for high-density packaging... -
Henkel Japan Unveils Electrically Disassemblable Adhesive and UV-Curing Insulating Coating to Boost EV Battery Repair and Recycling
ヘンケルジャパン Japan Overview Henkel Japan introduced the 'LOCTITE Easy Disassembly Adhesive (Electric Type)' for improved EV battery repair and recyclability, alongside 'LOCTITE UV-Curing Insulating Coating' for enhanced manufacturing... -
Dexerials to Showcase Advanced Functional Materials at AutoSens USA and The Battery Show Europe, Targeting Automotive and EV Markets
Dexerials Corporation Japan Overview Dexerials Corporation announced its participation in AutoSens USA 2026 (Detroit) and The Battery Show Europe (Stuttgart) in May 2026. The company will highlight its functional materials, including Ani... -
Henkel Upgrades Packaging Competence Center to Accelerate Sustainable Packaging Innovation and Circular Economy Transition
Henkel Germany Overview Henkel has modernized its Packaging Competence Center in Düsseldorf, Germany, to accelerate the development of sustainable packaging solutions. Featuring state-of-the-art laminating and coating systems developed i... -
CTE-Gradient Interconnect Technology Drastically Reduces Thermal Cycling Damage in SiC Inverters
PatSnap Eureka USA Overview PatSnap Eureka reveals an innovative approach to mitigate thermal cycling damage in SiC power inverter modules by creating biomimetic interconnects with a Coefficient of Thermal Expansion (CTE) gradient. This ... -
Ziitek Technology Unveils Next-Gen Liquid Cooling Systems and Advanced Thermal Management Materials for Data Centers
Ziitek Technology China Overview Ziitek Technology announced it will showcase two decades of thermal innovation at the 2026 Global Data Center Liquid Cooling Exhibition, presenting full-stack thermal management solutions from advanced th... -
Optical Bonding: The Critical Technology Enhancing Outdoor Readability and Durability of TFT LCD Displays
CHENGHAO Display China Overview Optical bonding technology offers a crucial solution for addressing inherent industrial challenges in TFT LCD displays, including sunlight readability, durability, and moisture resistance. By filling the a... -
TANAKA to Unveil Advanced High-Conductivity Die-Attach Materials for Next-Gen Power Semiconductors at SEMICON Southeast Asia 2026
田中貴金属グループ Japan Overview TANAKA Precious Metals will showcase high-thermal-conductivity and high-reliability silver sintering pastes and AgSn TLP sheets for next-generation SiC and GaN semiconductors at SEMICON Southeast Asia 20...
