New Technology– category –
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Polyurethane-Modified Acrylic Resins Achieve Dual High Adhesion and Low Dielectric for Advanced Packaging Solder Resists
ACS Applied Polymer Materials USA Overview This research from ACS Applied Polymer Materials unveils novel polyurethane-modified acrylic resins that concurrently deliver both high adhesion and low dielectric properties crucial for next-ge... -
UV-Curable Adhesives Emerge as Indispensable Solution for Invisible Bonding of Transparent Materials
Craft Resin Blog UK Overview UV-curable adhesives are gaining prominence as the optimal solution for invisibly repairing and bonding transparent materials like glass and acrylic. Unlike cyanoacrylates that cause frosting or epoxies that ... -
Direct Die-Attach Microchannel Cooling with Sintered Silver Boosts SiC Inverter Thermal Performance
PatSnap Eureka USA Overview An innovative thermal management solution combining direct die-attach microchannel cooling with sintered silver bonding is proposed to combat overheating in high-power-density SiC inverters. By directly joinin... -
Henkel Unveils Next-Gen Teroson EP 52 Series: High-Damping Structural Adhesives for Automotive Lightweighting and NVH Reduction
Henkel Germany Overview Henkel has launched the Teroson EP 52 Series, a new high-performance structural adhesive engineered for automotive manufacturing, combining superior bonding strength with advanced vibration damping capabilities. U... -
JSR Fortifies Advanced Semiconductor Material Production and R&D in Taiwan to Meet Surging AI Demand
JSR株式会社 Japan Overview JSR, a leading semiconductor materials manufacturer, announced a significant expansion of its production and R&D capabilities in Taiwan, effective April 2026. This strategic move, driven by key customer req... -
Sumitomo Chemical Develops New Ultra-Low Alpha, High-Thermal-Conductivity Alumina Filler for Advanced Semiconductors
住友化学 Japan Overview Sumitomo Chemical has developed a new 'ELA series' of high-purity alumina, boasting extremely low alpha-particle emissions and enhanced thermal conductivity, specifically for advanced semiconductors. This innovati... -
Henkel Unveils Silicone-Free Thermal Gap Filler and High-Strength Conductive Adhesive for Advanced EV Battery Thermal Management
Henkel Germany Overview Henkel has introduced two new thermal interface materials designed to enhance EV battery thermal management: the Bergquist TGF 2030APS gap filler, which is silicone-free with a thermal conductivity of 1.7 W/m·K, a... -
Plexus Introduces Thermomechanical Polyurethane Adhesives for Integrated Thermal Management and Structural Bonding in EVs and Power Electronics
ITW Performance Polymers (Plexus) USA Overview Plexus has launched a new series of thermomechanical polyurethane structural adhesives, including the DT2630LD, designed to concurrently manage heat and provide robust structural bonding in ... -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai... -
SK Hynix Initiates HBM Packaging Hub Construction in Cheongju to Bolster AI Memory Capacity
専門メディア South Korea Overview SK Hynix has broken ground on a substantial advanced packaging facility in Cheongju Technopolis, signaling a strategic shift in AI semiconductor competition from wafer fabrication to performance-critical...
