New Technology– category –
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Zhengzhou Kerton Chemical Highlights Broad Applications of Epoxy Adhesives for High Performance and Reliability Across Industries
Zhengzhou Kerton Chemical Co., Ltd China Overview Zhengzhou Kerton Chemical Co., Ltd. emphasized the critical role of epoxy adhesives across diverse sectors including automotive, aerospace, electronics, construction, and new energy. For ... -
Hoenle Adhesives Launches High-Reliability Underfill ‘Structalit® 8205’ for Miniaturized, High-Density Electronic Assemblies
Adhesives & Sealants Industry (ASI) Germany Overview Hoenle Adhesives has introduced Structalit® 8205, an underfill designed for modern, miniaturized, and high-density electronic assemblies, offering exceptional mechanical stability, the... -
Expanding Applications of Fiber-Reinforced Polymers in Maritime: Epoxy and Vinylester Composites Meet High Strength and Durability Demands
ResearchGate / UTHM Publisher International Overview Composite materials, particularly Fiber-Reinforced Polymers (FRP), offer high strength-to-weight ratios, excelling in constructing complex lightweight structures for the maritime indus... -
Penn State University Awards GAP Funding for Biodegradable UV-Curable Pressure-Sensitive Adhesive Development – Aiming for Environmental Impact Reduction
Penn State University USA Overview Penn State University has awarded GAP funding to 12 research commercialization projects, including the development of a "polypeptide-based biodegradable UV-curable pressure-sensitive adhesive." This nov... -
Henkel Offers Liquid Compression Molding (LCM) Solutions for Wafer-Level and Panel-Level Packaging
Henkel Adhesives Germany Overview Henkel provides encapsulation materials that enable advanced semiconductor packaging technologies where ICs are molded directly on wafers or panels prior to subsequent processing, using Liquid Compressio... -
Henkel Delivers Advanced Semiconductor Packaging Materials to Tackle Thermal and Mechanical Challenges in 2.5D/3D Packaging
Henkel Adhesives Germany Overview Henkel offers a diverse portfolio of advanced semiconductor packaging solutions, including lid and stiffener adhesives, EMI shielding, liquid compression molding solutions, and underfills. These material... -
Novel SCP Nanomaterials and Composite Hydrogel Revolutionize Infected Wound Healing with Photothermal/Photodynamic Dual Phototherapy
ACS Publications USA Overview Bacterial infection hinders wound healing, exacerbated by antibiotic resistance. This study developed three semiconductor conjugated polymer (SCP) nanomaterials (DFPE, DTBA, DTID) using different electron-do... -
JBC Technologies, a 3M™ Preferred Converter, Innovates Custom Dielectric Barriers for EV Battery and BESS Applications
JBC Technologies USA Overview JBC Technologies, as a preferred 3M™ converter, leverages extensive experience in processing flexible materials like pressure-sensitive adhesive tapes and reclosable fasteners into thin, high-strength adhesi... -
On-Chip Photonics Manufacturing Bottleneck: Key Lies in Improving Adhesive and Encapsulant Thermal and Mechanical Stress Resistance
Semiconductor Engineering USA Overview On-chip photonics, while promising faster, lower-power data transmission, faces significant manufacturing infrastructure challenges. Specifically, the material stack—including carrier wafers, tempor... -
Henkel Establishes North American Battery Application Center to Accelerate EV Battery Technology Development
Henkel Adhesives Germany Overview Henkel has launched a dedicated Battery Application Center in North America to provide an agile development approach, enabling the long-term success of the electric vehicle (EV) market. The center offers...
