August 2026– date –
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ACS Material Recommends ASTM D5470 for TIM Thermal Resistance Measurement, Emphasizing Separation of Bond Line and Contact Resistance for Accurate Performance Prediction
ACS Material USA Overview An ACS Material article highlights the complexity of Thermal Interface Material (TIM) performance, emphasizing that joint thermal resistance comprises both bond line and contact terms. It states that datasheet b... -
iFactory Deploys AI Vision Monitoring for Automotive Adhesive & Sealer Application, Enhancing Quality and Safety by Verifying Bead Dimensions and Continuity in Real-Time
iFactory USA Overview iFactory has implemented AI vision technology for real-time monitoring and verification of adhesive and sealer application in automotive manufacturing. This system precisely inspects the width, height, position, and... -
Delo Launches Photobond SJ4192: A Bio-Based Adhesive with 62% Renewable Content, Offering Enhanced Performance for Automotive Applications
Plastics Today Germany Overview German adhesive manufacturer Delo Industrie Klebstoffe has launched Photobond SJ4192, a bio-based adhesive containing 62% renewable raw materials, specifically for automotive applications. This multi-purpo... -
BRIJ Medical’s BRIJ-SEAL™ Advanced Wound Sealant Earns Breakthrough Technology Designation from Premier, Inc. for Enhanced Post-Operative Care
Morningstar / PR Newswire USA Overview BRIJ Medical's BRIJ-SEAL™ advanced wound sealant has received a Breakthrough Technology designation from Premier, Inc., a leading U.S. healthcare company. This innovative, single-use, sterile, and h... -
Flooring Adhesive Innovations Address Job Site Challenges: Bostik’s Lightweight M800 Lite and SikaBond-5900 Deliver Enhanced Performance and Moisture Resistance
Floor Covering News USA Overview Flooring adhesive manufacturers are releasing innovative products that offer superior strength and moisture resistance to tackle common job site challenges. Bostik's new Hydroment M800 Lite provides a lig... -
L&L Products Unveils Innovative Adhesives Including Heat-Activated Structural Tapes Curing in Automotive E-Coat Ovens for Enhanced Durability and Lightweighting
L&L Products USA Overview L&L Products has introduced a range of innovative adhesive solutions, notably L&L Bond Structural Adhesive Tapes, which are heat-activated and cure simultaneously in the E-coat oven for automotive struct... -
ACS Nano Reports Isotropically Ultrahigh Thermal Conductive Boron Nitride/Polymer Composites, Revolutionizing AI Chip Cooling
ACS Nano USA Overview A breakthrough study published in ACS Nano presents a boron nitride (BN)/polymer composite with a biaxially oriented thermal conductive network, achieving isotropically ultrahigh thermal conductivity for advanced el... -
University of Tokyo Develops CyclicFP-fmoc, a Reversible Adhesive with Strong, Flexible Bonding to Untreated Teflon, Enabling Full Recycling via Ethanol Dissolution
Assembly Magazine Japan Overview Researchers at the University of Tokyo have developed CyclicFP-fmoc, a novel reversible adhesive that forms strong, flexible bonds to untreated Teflon (PTFE) and other fluoroplastics through non-covalent ... -
Exponential Relationship Between Underfill Adhesive Curing and Shear Strength Unveiled for Flip-Chip Micro-interconnections
springerprofessional.de Germany Overview A new study systematically investigated epoxy-based underfill adhesives in flip-chip packaging, establishing an exponential relationship between the degree of curing and shear strength. Researcher... -
Sheen Technology Details Evolving TIM Requirements for AI Chips, Emphasizing High Thermal Conductivity and Low Thermal Resistance for Liquid Cooling
Sheen Technology Taiwan Overview Sheen Technology has published a comprehensive guide outlining the evolving requirements for Thermal Interface Materials (TIMs) in high-performance AI chips. Driven by advanced packaging such as 2.5D/3D s...
