August 2026– date –
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GlobalFoundries Secures $300 Million CHIPS Act Award to Accelerate U.S. Silicon Photonics Leadership for AI Optical Interconnect Demand
Vermont Business Magazine USA Overview GlobalFoundries has signed a $300 million award under the U.S. CHIPS and Science Act, aimed at accelerating the nation's silicon photonics leadership. This substantial investment will support innova... -
Intel and Lens Technology Form Strategic Alliance to Accelerate Glass Substrate-Based Advanced Semiconductor Packaging for AI Era
Intel Newsroom USA Overview Intel and Lens Technology announced a strategic collaboration to accelerate the development of glass substrate-based packaging solutions for advanced semiconductors, critical for the AI era. This partnership a... -
High-Speed Hot Melt Adhesive Systems Advance Carton Sealing in Food & Beverage Packaging: Enhancing Performance & Recyclability in Harsh Environments
The National Law Review USA Overview High-speed hot melt adhesive systems are becoming indispensable in modern food and beverage packaging lines for maintaining reliable carton sealing in challenging high-humidity and low-temperature env... -
Arkema Reports Strong Q2 2026 Results with EBITDA Up 7.4% to €391 Million, Driven by Adhesive Solutions Segment
Business Wire France Overview Arkema announced robust second-quarter 2026 results, achieving an EBITDA of €391 million, a significant 7.4% increase year-on-year. This strong performance was primarily driven by the outstanding contributio... -
Adhesives Identified as Key Input for Composite Can Manufacturing Plants as Demand Rises for Eco-Friendly Packaging
openPR.com International Overview Demand for composite cans is rapidly increasing in the food, beverage, and consumer goods industries due to their eco-friendly properties and versatility. These cans, made from multi-layered structures o... -
Aeluma Secures $30 Million US CHIPS Act Funding to Advance Scalable Non-InP Semiconductor Manufacturing Platform for Photonics
Semiconductor Today USA Overview Aeluma Inc. has signed a Letter of Intent to receive up to $30 million in funding under the U.S. CHIPS and Science Act. This capital will support the research and development of a scalable non-indium phos... -
Dexerials Achieves 7-Year Global Market Leadership for ACF, ARF, and SVR Display Products, Crucial for AI and Autonomous Driving Advancements
Dexerials Japan Overview Dexerials announced its Anisotropic Conductive Film (ACF), Anti-reflection film (ARF), and Optical elastic resin (SVR) have maintained top global market share for seven consecutive years. ACF is essential for IC ... -
Henkel Expands Silicon Valley Application Center to Larger Site, Boosting AI & HPC Material Development in Santa Clara, CA
Henkel USA Overview Henkel has announced the expansion and relocation of its Silicon Valley Application Center for Electronics in Santa Clara, CA, to enhance customer collaboration and accelerate new product development. The upgraded fac... -
ECTC2026 Unveils Future of Semiconductor Packaging: Precision Adhesives and Low-Temperature Hybrid Bonding for HBM Integration
Tech I Japan Overview ECTC2026 highlighted critical R&D in advanced semiconductor packaging, showcasing innovations in chiplet integration, hybrid bonding, and opto-electronic convergence. Key presentations included Mitsui Chemicals ... -
Dymax Launches 9310 Dual-Cure Adhesive for High-Reliability PCB Reinforcement, Streamlining Underfill Alternatives for Advanced Electronics and AI Hardware
PR Newswire USA Overview Dymax has launched its 9310 adhesive, an innovative light and secondary heat-cure solution engineered for reinforcing fine-pitch, leadless components on printed circuit boards in advanced electronics and AI hardw...
