New Technology– category –
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AZoM Explains Polyimides’ Indispensable Role in Semiconductor Packaging, Critical for HBM and Chiplet RDLs
AZoM UK Overview AZoM has detailed the indispensable, multifunctional role of polyimides in semiconductor packaging, simultaneously providing insulation, adhesion, pattern definition, and stress control at the thin-film interface between... -
Apple Unveils 2nm iPhone 18; Samsung Cuts Thermal Resistance by 16% with Encapsulant and TIM Innovations, Intensifying Competition with TSMC
BigGo Finance South Korea Overview Following Apple's announcement of the 2nm iPhone 18, Samsung Electronics and TSMC are intensifying their competition in next-generation semiconductor packaging and thermal management. Samsung has achiev... -
HakTak Lays Out Thermal Putty’s Critical Role in Optimizing EV Battery and Inverter Thermal Management
HakTak USA Overview HakTak underscores the indispensable role of thermal putty in optimizing thermal management for electric vehicle (EV) battery and inverter systems. As an ideal thermal interface material (TIM), thermal putty efficient... -
Indium Corporation to Showcase Advanced Materials for AI at SEMICON Taiwan, Including High-Thermal-Conductivity Sintering Pastes and TIMs
Indium Corporation USA Overview Indium Corporation will exhibit innovative materials enabling AI technology at SEMICON Taiwan 2026, including Heterogeneous Integration and Assembly (HIA) products and groundbreaking Thermal Interface Mate... -
CTX Thermal Solutions Expands TIM Portfolio with Thermal Pads, Graphite Foils for 5G, EV, and Medical Applications
SJN (Semiconductor Journal Network) USA Overview CTX Thermal Solutions has expanded its Thermal Interface Material (TIM) portfolio to enhance heat dissipation efficiency in electronic components, addressing thermal management challenges ... -
Automotive Industry Innovates Assembly Efficiency and Durability in 2026 with Structural Adhesives for Aluminum and Composites
B8X Germany Overview In 2026, the automotive industry is dramatically enhancing assembly efficiency and durability through high-performance structural adhesives optimized for aluminum and composite materials, driven by increasing adoptio... -
Smart High Tech Secures $10.5M from Henkel Ventures to Propel Graphene TIM Production for Next-Gen Electronics
Graphene-Info Israel Overview Smart High Tech (SHT) has secured $10.5 million from lead strategic investor Henkel Ventures, earmarked to significantly scale the production of its patented graphene-enhanced Thermal Interface Material (TIM... -
Cambium Unveils ApexFrame 5000, a High-Temperature Laminating Film Adhesive for Aerospace and Defense, Withstanding Over 315°C
PR Newswire (via Cambium) USA Overview Advanced materials developer Cambium has launched ApexFrame™ 5000, a phthalonitrile-based film adhesive specifically designed for demanding high-temperature bonding applications. This new product me... -
Caly Technologies Releases TIM Selection Guide for Power Electronics, Optimizing Thermal Management for SiC and GaN Devices
Alibaba Electronics China Overview Caly Technologies has published a Thermal Interface Material (TIM) selection guide for power electronics, aiding in optimizing thermal management for high-performance devices like SiC half-bridge module... -
Oak Ridge National Lab Develops Reusable Adhesive from Waste Polymers, Effective in Both Wet and Dry Conditions
Adhesives & Sealants Industry USA Overview Researchers at Oak Ridge National Laboratory have developed an innovative, reusable adhesive derived from waste polymers that exhibits superior bonding strength in both aqueous and dry environme...
