New Technology– category –
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University of Tennessee Secures $20M NSF Grant for ATHENA: Pioneering AI-Driven Autonomous Materials Discovery
University of Tennessee, Tickle College of Engineering USA Overview The University of Tennessee (UT) has been awarded a $20 million NSF grant to establish ATHENA, an Advanced Testbed for High-throughput Experimentation in Nano- and Atomi... -
Argonne Lab’s ‘DONUT’ AI Accelerates X-ray Data Analysis Tenfold for Real-Time Materials Discovery
Argonne National Laboratory News Room USA Overview Argonne National Laboratory has developed DONUT, a physics-aware machine learning tool that enables real-time X-ray data analysis at the Advanced Photon Source (APS). DONUT allows materi... -
Deep Intelligent Pharma Expands AI Platform, Drastically Shortening Advanced Materials Discovery Cycle
FinancialContent (Deep Intelligent Pharma) USA Overview Deep Intelligent Pharma (DIP) has significantly expanded its AI for materials science platform to accelerate the discovery and optimization of advanced materials across diverse fiel... -
Adhesive Materials Science Evolves to “Smart Bonding”: Breakthroughs in High-Strength, Recyclable Polyurethane and Bio-Based Hot Melt Adhesives
chinatensan.com China Overview In 2026, the adhesives industry is undergoing a profound transformation from "functional materials" to "system solutions." A significant academic breakthrough has been achieved in polyurethane adhesives for... -
2026 ECTC Highlights: Applied Materials and Partners Pioneer Hybrid Bonding with Fine-Pitch Copper and Ultra-Low Temperature Annealing
Semiconductor Digest USA Overview The 2026 Electronic Components Technology Conference (ECTC) showcased significant advancements in hybrid bonding by Applied Materials, EV Group, imec, and Leti. Key breakthroughs include improved bonding... -
UC Berkeley Joins Applied Materials’ EPIC Center to Accelerate Chip Innovation, Focusing on Advanced Packaging and Materials R&D
Stock Titan USA Overview UC Berkeley is partnering with Applied Materials' EPIC Center to accelerate chip innovation through enhanced R&D collaboration and talent development. This partnership will concentrate on advancing semiconduc... -
Lam Research to Invest Over $3 Billion in Global Lab Expansion, Accelerating Advanced Packaging for AI Era
Lam Research USA Overview Lam Research announced plans to invest over $3 billion in expanding its global lab network to significantly increase innovation velocity for the AI era. This substantial investment is aimed at accelerating produ... -
Fraunhofer IAP Unveils Next-Gen Display Materials and Room-Temperature Pressure-Activated Microencapsulated Adhesives for Enhanced Industrial Safety
Fraunhofer Institute for Applied Polymer Research (IAP) Germany Overview Fraunhofer IAP presented research on next-generation display materials at IMID 2026 and is developing microencapsulated adhesives to simplify industrial bonding pro... -
Indium Corporation Unveils Next-Gen Copper Sintering Paste for High-Power Semiconductors, Achieving Gold/Silver-Free High Reliability Die-Attach
Indium Corporation USA Overview Indium Corporation presented a next-generation copper sintering paste for high-power semiconductor applications at ICEPT 2026. This innovative paste provides high reliability, exceptional thermal and elect... -
Fraunhofer IFAM Drives High-Performance Adhesive and Sealant Innovation for Electromobility: Revolutionizing Battery Modules and Fuel Cells
Fraunhofer-Gesellschaft Germany Overview Fraunhofer IFAM is actively developing adhesive bonding technologies for electromobility, focusing on thermally and electrically conductive joints in battery modules. The institute's research enco...
