New Technology– category –
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SpacePharma Launches Autonomous Lab Platforms to Boost Microgravity Research in Life Sciences and Manufacturing
SatNow Switzerland Overview Swiss-Israeli space biotechnology company SpacePharma has deployed autonomous lab technologies designed for research and manufacturing in microgravity, operating on the International Space Station (ISS), nanos... -
VCU and NASA Develop Flexible Boron Nitride-Based Radiation-Resistant Coating to Protect Artemis Astronauts
VCU News - Virginia Commonwealth University USA Overview A joint research team from Virginia Commonwealth University (VCU) and NASA has developed an innovative radiation-resistant coating to protect future Artemis astronauts from harsh s... -
Redwire Completes On-Orbit Operations for Cancer Therapeutics and Pharmaceutical Crystallization Research on ISS
Redwire USA Overview Redwire, a leader in space infrastructure, successfully completed on-orbit operations for its latest pharmaceutical development research on the International Space Station (ISS). The mission involved four key investi... -
Space Data Centers Poised to Revolutionize AI Infrastructure with 8x Terrestrial Power Generation and Vacuum Cooling
IEEE Computer Society USA Overview Space-based data centers offer a transformative solution for escalating AI infrastructure demands, potentially generating up to eight times more power from solar energy than terrestrial counterparts. Th... -
HBM4E Set to Dominate High-Performance Memory Market by Late 2026-2027 with Up to 4.0 TB/s Single-Stack Bandwidth and 48GB+ Capacity, Accelerating AI Models
Ersa Electronics Global Overview HBM4E is projected to lead the high-performance memory market from late 2026 to 2027, offering a single-stack bandwidth of up to 3.6–4.0 TB/s and capacities exceeding 48GB, significantly boosting ultra-la... -
ATLANT 3D, A*STAR IMRE, and NAMIC Establish AI-Driven Materials Discovery Hub in Singapore to Accelerate Semiconductor and Advanced Packaging Innovation
Yahoo Finance Singapore Overview ATLANT 3D, A*STAR Institute of Materials Research and Engineering (IMRE), and National Additive Manufacturing Innovation Cluster (NAMIC) have signed an MOU to establish an Advanced Materials Development H... -
Applied Materials Unveils New Systems for DRAM and Advanced Packaging to Accelerate AI Chip Manufacturing, Featuring Epitaxy, CMP, and E-beam Inspection Technologies
Barchart.com USA Overview Applied Materials has introduced a suite of new chipmaking systems designed to accelerate the construction of advanced 3D chip architectures powering next-generation AI. This includes epitaxy systems optimizing ... -
Analog Technologies Delivers Specialized Advanced Packaging for Demanding Defense Systems Requiring Superior Thermal Management and Miniaturization
Analog Technologies USA Overview Analog Technologies offers specialized semiconductor packaging and interconnect capabilities for programs demanding advanced thermal management and miniaturized assemblies, particularly in defense systems... -
TSMC’s CoWoS Capacity Dramatically Expands, Eliminating Supply Constraint for NVIDIA B300 Servers and Cutting Lead Times to 8-16 Weeks
Contrary Research Taiwan Overview TSMC's CoWoS (Chip-on-Wafer-on-Substrate) packaging capacity has significantly expanded, effectively resolving a major GPU procurement constraint that had persisted for over six months in 2025. As a resu... -
TSMC and Amkor Technology Forge 10-Year Strategic Partnership to Expand Advanced Chip Packaging Capabilities in the US
Focus Taiwan USA Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to significantly bolster advanced semiconductor packaging and test capacity in the United States. This partnership aims to expand advanced pac...
