New Technology– category –
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pH- and Cellulase-Triggered Bio-Based Adhesive Facilitates Pharmaceutical Blister Pack Recycling
RSC Publishing (Green Chemistry) Unknown Overview Researchers have developed a biodegradable, bio-based adhesive to aid in the recycling of pharmaceutical blister packaging. Composed of cellulose nanocrystals, chitosan, and a bifunctiona... -
German President Visits INM to Witness ‘Living Materials’ and Recyclable Wood Using Bacteria-Derived Bio-Based Adhesives
Leibniz-INM Germany Overview German Federal President Frank-Walter Steinmeier visited INM – Leibniz Institute for New Materials to observe research into "living materials." A highlight was the demonstration of fully recyclable, sustainab... -
Dutch NWO Funds Bio-Based Fast Debonding Adhesives to Halve Composite Repair Times for Aerospace Applications with Ministry of Defense Support
NWO (Netherlands Organisation for Scientific Research) Netherlands Overview The Netherlands Organisation for Scientific Research (NWO), with support from the Ministry of Defense, has launched ten research projects, including the developm... -
New Review Highlights Environmentally Friendly Starch-Based Adhesives for High-Performance Wood Composites
ResearchGate (Journal: Polymers) Unknown Overview A new review paper has been published on the use of environmentally friendly starch-based adhesives for bonding high-performance wood composites. This research evaluates the potential of ... -
Mastering 3D-IC Verification Complexity: Multiphysics Analysis Key to Addressing Thermal, Mechanical Stress, and Reliability Challenges
Semiconductor Engineering USA Overview As the semiconductor industry transitions from 2D to 2.5D and 3D-IC configurations, verification complexity is escalating significantly. This article emphasizes the necessity of multiphysics analysi... -
Samsung Electronics Leads Advanced Packaging with Projected Triple HBM Sales and Thinnest 0.65mm LPDDR DRAM Package Development
Simply Wall St South Korea Overview Samsung Electronics is leading advanced packaging advancements by leveraging extensive in-house expertise to streamline production cycles and reduce lead times. The company projects its High Bandwidth ... -
Comprehensive Review of SiC Power Module Packaging: Silver and Copper Sintering Key to Enhanced Thermal and Electrical Performance
IEEE Xplore Unknown Overview A comprehensive review paper analyzes the latest technologies in SiC power module packaging, focusing on layout, material systems, and integration. The review emphasizes how advanced die-attach techniques, in... -
PCIM Europe 2026 Unveils Innovations in Power Module Reliability and SiC/GaN Power Semiconductor Packaging Technologies
MacDermid Alpha, PCIM Europe Germany Overview PCIM Europe 2026 in Nuremberg, Germany, featured significant innovations in power module reliability and next-generation power semiconductor packaging. MacDermid Alpha unveiled underfills, hi... -
High-Performance Bio-Based Natural Rubber Latex Adhesives Reinforced by Grafting-Coordination Hybrid Networks Developed
ACS Sustainable Chemistry & Engineering Unknown Overview An academic paper details the development of high-performance bio-based adhesives with robust interfacial adhesion and environmental durability, crucial for sustainable composite m... -
Scanning Acoustic Microscopy (SAM) Enables High-Precision Non-Destructive Detection of Internal Defects in Semiconductor Packaging
Infinita Lab USA Overview Scanning Acoustic Microscopy (SAM) is highlighted as a critical non-destructive tool for high-precision evaluation of internal defects in semiconductors, electronic packaging, and material science. SAM excels at...
