New Technology– category –
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Henkel Unveils Silicone-Free Thermal Gap Filler and High-Strength Conductive Adhesive for Advanced EV Battery Thermal Management
Henkel Germany Overview Henkel has introduced two new thermal interface materials designed to enhance EV battery thermal management: the Bergquist TGF 2030APS gap filler, which is silicone-free with a thermal conductivity of 1.7 W/m·K, a... -
Plexus Introduces Thermomechanical Polyurethane Adhesives for Integrated Thermal Management and Structural Bonding in EVs and Power Electronics
ITW Performance Polymers (Plexus) USA Overview Plexus has launched a new series of thermomechanical polyurethane structural adhesives, including the DT2630LD, designed to concurrently manage heat and provide robust structural bonding in ... -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai... -
SK Hynix Initiates HBM Packaging Hub Construction in Cheongju to Bolster AI Memory Capacity
専門メディア South Korea Overview SK Hynix has broken ground on a substantial advanced packaging facility in Cheongju Technopolis, signaling a strategic shift in AI semiconductor competition from wafer fabrication to performance-critical... -
TSMC Unveils SoIC 3D Stacking Roadmap: Achieving 4.5µm Pitch by 2029, Enabling Face-to-Face Chiplet Integration for Fujitsu Monaka CPU
専門メディア Taiwan Overview TSMC has revealed its SoIC (System on Integrated Chips) 3D stacking roadmap, targeting a 4.5-micron pitch by 2029, down from today's 6 microns. This advanced face-to-face (F2F) chiplet stacking technology, pa... -
TSMC Accelerates Advanced Packaging Capacity Expansion to Meet Exploding AI Demand
専門メディア Taiwan Overview TSMC is rapidly scaling its advanced CoWoS and SoIC packaging capacity to address the surging demand for AI chips. With 18 new fabs and advanced packaging facilities under construction globally, this expansio... -
EktaH Reveals Promising Early-Phase Data for Novel Obesity Drug NKS-3, Targeting Fat Loss with Muscle Retention
European Biotechnology Global Overview EktaH has released early clinical trial data for its novel obesity drug candidate, NKS-3, demonstrating promising results in both fat reduction and muscle preservation. Preclinical mouse data indica... -
OpenBind Launches First Open Dataset and AI Model to Enhance Drug-Target Interaction Prediction, Applied to EV-A71 Virus
University of Oxford UK Overview Researchers at the University of Oxford, as part of the OpenBind consortium, have released the first open dataset and predictive AI model specifically designed for drug discovery. This dataset comprises d... -
Isomorphic Labs Secures $2.1 Billion for AI Drug Discovery, Scaling AlphaFold-Driven Platform for Diverse Modalities
Pharmaceutical Technology UK Overview Isomorphic Labs, an Alphabet-backed AI drug discovery company, has closed a monumental $2.1 billion Series B funding round to accelerate its AI-driven drug development efforts. The investment will pr... -
Lithium-Sulfur Cathodes Advance with Hybrid Solid-State Electrolytes, Promising Ultra-High Energy Density and Enhanced Safety for Automotive Scale
PatSnap Eureka Global Overview Lithium-sulfur (Li-S) batteries, with a theoretical energy density of ~2,600 Wh/kg, are gaining attention as a next-generation power source, despite historical challenges like sulfur's low conductivity, the...
