New Technology– category –
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Hiwin and Qualcomm Integrate Edge AI into Panel-Level Semiconductor Packaging to Enhance Production Accuracy and Throughput
Packnode Taiwan Overview Taiwanese motion control specialist Hiwin Technologies is collaborating with Qualcomm to integrate Dragonwing Q6 Edge AI into panel-level semiconductor packaging (PLP) equipment. This partnership combines machine... -
Dow Showcases Next-Gen AI Thermal Management Technologies at COMPUTEX Taipei 2026, Supporting 400G+ Optical Transceivers
chemXplore USA Overview Dow showcased next-generation thermal management technologies for AI servers and high-speed optical transceivers at COMPUTEX Taipei 2026. The company presented thermal interface materials (TIMs) and silicone-based... -
CEA-Leti Demonstrates 1µm Pitch Die-to-Wafer Hybrid Bonding, Addressing AI Hardware Bottlenecks
Chiplet Marketplace France Overview CEA-Leti announced a significant advancement at ECTC 2026, demonstrating functional test vehicles utilizing die-to-wafer (D2W) hybrid bonding down to 1µm pitch, poised to resolve critical AI hardware b... -
Intel to Build $3.3 Billion Glass Core Substrate Manufacturing Facility in India to Bolster Advanced Packaging Supply
TrendForce USA Overview Intel, in collaboration with 3D Glass Solutions (3DGS), is progressing with plans to invest approximately $3.3 billion in an advanced packaging glass core substrate manufacturing facility in Odisha, India. The pla... -
Imec and EV Group Set New World Record for 3D Chip Stacking Precision with Sub-40nm Wafer Bond Overlay
PR Newswire ベルギー Overview Imec and EV Group have achieved a world-record post-bond overlay accuracy of less than 40 nanometers across a 300mm wafer for 200nm pitch hybrid bonding, a crucial advancement for next-generation 3D ICs. Dem... -
ASMPT Establishes Advanced Packaging Technology Advisory Council to Accelerate AI-Era Innovation
ASMPT Singapore Overview ASMPT has established an Advanced Packaging Technology Advisory Council (TAC) to address the growing importance of advanced packaging for next-generation computing and AI components. The TAC will focus on a broad... -
FDA Grants Breakthrough Therapy Designation to Merck’s Investigational KRAS G12C Inhibitor Calderasib (MK-1084) in Combination with KEYTRUDA for Metastatic NSCLC
BioSpace USA Overview Merck announced that its investigational oral KRAS G12C inhibitor, calderasib (MK-1084), in combination with KEYTRUDA® (pembrolizumab), received FDA Breakthrough Therapy Designation for newly diagnosed metastatic KR... -
Mount Sinai Scientists Discover Hidden Drug-Binding Pocket in Cancer Protein PKMYT1, Highlighting AI Drug Discovery’s Capabilities and Limitations
Mount Sinai - New York USA Overview Mount Sinai scientists discovered a previously overlooked drug-binding pocket in the cancer-related protein PKMYT1. This finding, while highlighting AI drug discovery's capabilities and limitations, op... -
Biogen’s Salanersen Receives FDA Breakthrough Therapy Designation for Spinal Muscular Atrophy (SMA)
PMLiVE USA Overview Biogen's investigational antisense oligonucleotide (ASO), salanersen, has received FDA Breakthrough Therapy Designation for Spinal Muscular Atrophy (SMA). This designation is based on early clinical data showing impro... -
Janssen’s TECVAYLI® (teclistamab) Achieves Superior Progression-Free and Overall Survival Versus Standard of Care as Early as First Relapse in Multiple Myeloma
Janssen USA Overview New data from the MajesTEC-9 study revealed that TECVAYLI® (teclistamab) demonstrated superior progression-free and overall survival compared to standard of care in patients with relapsed/refractory multiple myeloma ...
