New Technology– category –
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NASA’s SSPICY Mission Demonstrates Innovative Multi-Jointed Robotic Arm and Propulsion Technologies, Significantly Advancing Autonomous In-Space Servicing and Manufacturing
NASA USA Overview NASA's SSPICY (Small Spacecraft Propulsion and Inspection Capability) mission successfully achieved critical technology demonstrations in a public-private partnership aimed at in-space satellite servicing and inspection... -
Serendipity Space Unveils Stratospheric ‘Alchemy’ System for Advanced Drug Crystallization
Facebook India Overview India's pioneering space-pharma startup, Serendipity Space, has successfully demonstrated its innovative "Alchemy" system for drug crystal manufacturing in the Earth's stratosphere. Leveraging microgravity, this s... -
EPC Space Launches 15V, 25V, and 40V Rad-Hard eGaN FETs with >1 Mrad TID for Next-Gen Space Computing
Semiconductor Today USA Overview EPC Space LLC has announced the release of three new radiation-hardened eGaN power transistors (15V, 25V, 40V) designed for next-generation space computing systems. These devices offer ultra-low on-resist... -
Microgravity Crystallization Poised to Revolutionize In-Space Manufacturing for High-Value Materials, Detailing Challenges and Future Directions
ACS Publications USA Overview A recent review highlights the expanding relevance of microgravity crystallization from structural research to low Earth orbit (LEO) and future in-space manufacturing (ISM) applications. This technique offer... -
Lens Technology Enters Advanced Chip Packaging with Self-Developed Through-Glass Vias (TGV) Substrates and Dedicated 30,000sqm Factory
Chinadaily.com.cn China Overview Chinese smartphone glass screen manufacturer Lens Technology has announced its entry into the advanced chip packaging market, driven by AI chips pushing traditional material limits. The company showcased ... -
Henkel Launches LOCTITE ABLESTIK CDF900 Conductive Die Attach Film with Over 8 W/m-K Thermal Conductivity for High-Power AI Packages
Henkel Germany Overview Henkel has introduced the LOCTITE ABLESTIK CDF900 series conductive die attach film to address thermal management challenges in high-power AI packages. This new product significantly boosts thermal conductivity to... -
Japan’s Shinko Electric Develops 22-Layer Glass Substrates for AI Chips, Resolving Internal Cracking and Delamination Issues
TrendForce Japan Overview As AI chips demand larger packages, intensifying competition in glass substrates, Japan's Shinko Electric Industries has successfully developed 22-layer glass substrates with 11 copper wiring layers on each side... -
Fraunhofer IKTS Achieves Real-Time Detection of 8µm Packaging Seal Defects Using Optical Coherence Tomography (OCT)
Fraunhofer-Gesellschaft Germany Overview Researchers at Fraunhofer IKTS have developed an innovative inspection system based on Optical Coherence Tomography (OCT), successfully enabling continuous, real-time, and non-destructive detectio... -
Advanced Thermal Interface Materials Evolve to Combat AI Chip Heat, Spanning Liquid Metals to Polymer Composites
Exponential Industry USA Overview Thermal Interface Materials (TIMs) are becoming indispensable for semiconductor thermal management, addressing the escalating power density and heat generation in AI processors. Current packaging relies ... -
Amkor Technology Expands U.S. Advanced Packaging Footprint by 67 Acres in Arizona, Bolstering Domestic Manufacturing
Amkor Technology, Inc. USA Overview Amkor Technology has secured an additional 67 acres (approximately 270,000 square meters) adjacent to its existing advanced packaging and test campus in Arizona, significantly expanding its U.S. back-e...
