New Technology– category –
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Purdue University & Redwire Launch Second ISS Pharmaceutical Crystallization Experiment, Exploring Microgravity’s Impact on Drug Quality
Davidson School of Chemical Engineering USA Overview Purdue University and Redwire have successfully launched their second series of pharmaceutical crystallization experiments aboard the International Space Station (ISS). This ongoing re... -
iSpace Secures Up to ¥20 Billion JAXA Grant for High-Precision Lunar Polar Landing Technology Development
ispace Japan Overview iSpace has been awarded a grant of up to ¥20 billion (approximately $130 million USD) from JAXA's Space Strategy Fund Program Phase 2 for its "High-Precision Lunar Polar Landing Technology" project. This significant... -
Lunar Quake Analysis Unlocks Potential for Mapping Subsurface Water Ice, Published in Science Advances
ScienceDaily USA Overview New research published in Science Advances suggests that analyzing the propagation patterns of lunar quakes can enable the identification and mapping of hidden subsurface water ice on the Moon. This innovative t... -
Eascra Biotech Demonstrates 40-50% Efficacy Boost in Microgravity-Manufactured Pharmaceuticals on ISS
Mettler Toledo (Balancing the Future Podcast) USA Overview Eascra Biotech, with NASA support, has successfully demonstrated that manufacturing drug delivery technologies in microgravity on the International Space Station (ISS) can enhanc... -
NASA Completes Orion Module Integration for Artemis III, Targets 2027 Launch to Test Commercial Lunar Landers
NASA USA Overview NASA achieved a significant milestone for its Artemis III crewed demonstration mission, completing the integration of the Orion crew and service modules on July 30. Slated for a 2027 launch, Artemis III will test rendez... -
NASA to Launch Two CAPSTONE 02 Probes in 2027 to Test Complex Three-Body Orbits for Lunar Infrastructure
Space USA Overview NASA plans to launch two CAPSTONE 02 maneuverable probes into lunar orbit in 2027 to investigate the effects of complex gravitational environments, specifically "three-body orbits," on spacecraft. This mission aims to ... -
TSMC CoWoS Advanced Packaging Becomes Critical Bottleneck in AI Chip Supply, Sold Out Through 2026
Tech Times USA Overview The bottleneck in AI chip production has shifted from silicon manufacturing to advanced packaging, specifically TSMC's CoWoS technology, with capacity fully booked until the end of 2026. A severe shortage of ABF s... -
Supercomputing News Emphasizes Critical Role of Advanced Packaging (CoWoS, EMIB, T-AI) in AI Accelerators
Supercomputing News Global Overview Supercomputing News published an analytical article emphasizing the critical role of advanced packaging technologies like CoWoS, EMIB, and T-AI in enhancing AI accelerator performance. These technologi... -
Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026 in Suwon, Korea, to Cover Advanced Packaging, Chiplets, and HBM
Advanced Semiconductor Packaging & Chiplet Show (ASPS) South Korea Overview The Advanced Semiconductor Packaging & Chiplet Show (ASPS) will take place from August 26-28, 2026, at the Suwon Convention Center in South Korea. This B2B e... -
IMAPS Device Packaging Conference 2026 PDCs Focus on Advanced Packaging for Chiplets and Heterogeneous Integration, Highlighting Hybrid Bonding
IMAPS USA Overview IMAPS Device Packaging Conference 2026 Professional Development Courses (PDCs) extensively covered "Advanced Packaging for Chiplets and Heterogeneous Integration." The courses defined various 2D to 3.5D IC integrations...
