New Technology– category –
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EPC Space Unveils Three Rad-Hard GaN Transistors for Spacecraft Processors, Delivering 101A Continuous Current
IN Electronics & Design UK Overview EPC Space has launched three new low-voltage, radiation-hardened Gallium Nitride (GaN) transistors specifically designed for high-current power conversion around processors and accelerators in spacecra... -
Japan’s MMX Mission to Mars Moons Expected to Boost Domestic Space Technology Industry, Including Robotics, New Materials, and AI
Japan Times Japan Overview Japan's Martian Moons eXploration (MMX) mission is poised to significantly stimulate the domestic space technology industry, particularly in robotics, new materials, communication technologies, and artificial i... -
Novel In-Space Manufacturing Method Incorporates Unidirectional Carbon Fibers into Regolith Simulants for Lunar Habitat Shields
MDPI Switzerland Overview A new research study describes an innovative manufacturing process for structural shields for future lunar settlements, involving the embedment of unidirectional carbon fibers into regolith simulants for in-spac... -
Goodfellow Offers High-Performance Materials Macor® and Kapton® for Demanding Space Applications
Goodfellow USA Overview Goodfellow announced enhanced offerings of Macor® and Kapton® to meet the rigorous demands of satellite propulsion and other space technologies. Macor®, a machinable glass ceramic, provides excellent performance i... -
ISRO Unveils Advanced Thermal Protection System for Gaganyaan Crew Module, Withstanding 1800°C Re-entry Temperatures
INSIGHTS IAS India Overview The Indian Space Research Organisation (ISRO) has disclosed details of the Thermal Protection System (TPS) for its Gaganyaan crew module, designed to protect astronauts during Earth re-entry. This advanced abl... -
Glass Substrates in Advanced Packaging Accelerate from Prototype to Mass Production, Emerging as Key Technology for HBM and Chiplet Integration
Solid State Technology USA Overview Advanced packaging technology utilizing glass substrates is rapidly transitioning from R&D to mass production within the semiconductor industry. Glass substrates, superior to conventional organic s... -
STMicroelectronics Unveils Modular SiP Solution for Automotive AI Market, Driving Miniaturization and Performance in Autonomous Driving and ADAS
Electronics Weekly Switzerland/France Overview STMicroelectronics has launched a new modular System-in-Package (SiP) solution specifically designed for automotive AI applications. This solution integrates multiple chips to reduce footpri... -
AT&S Ramps Up HPC Substrate Capacity to Meet Surging Data Center and AI Demand
Business Journal Austria Overview Austrian-based AT&S, a leading package substrate manufacturer, is significantly accelerating its IC substrate capacity expansion, primarily targeting high-performance computing (HPC) applications. Th... -
Fraunhofer IZM Demonstrates High-Density Flexible Hybrid Substrate (FHS) Technology, Opening New Frontiers for Wearable and IoT Devices
Semiconductor Engineering Germany Overview Fraunhofer IZM has demonstrated Flexible Hybrid Substrate (FHS) technology, enabling high-density wiring. This innovative approach integrates diverse semiconductor chips and passive components o... -
imec Pioneers Glass Substrates for Next-Gen 3D Packaging, Accelerating AI/HPC Commercialization
EETimes Belgium Overview imec, the renowned Belgian microelectronics research institute, has announced a significant breakthrough in 3D stacked packaging, leveraging glass substrates as interposers. This innovation is pivotal for next-ge...
