New Technology– category –
-
Indium Corporation to Unveil High-Reliability Power Device Packaging Solutions, Including SiC and Cu Sintering Pastes, at PCIM Asia 2026
Indium Corporation USA Overview Indium Corporation will showcase its next-generation high-reliability packaging solutions for power electronics at PCIM Asia 2026. Key offerings include InFORCE®MF pressure silver sintering paste for SiC d... -
Epsilon Unveils Advanced Semiconductor Packaging Materials at ASPS 2026 for AI Data Centers: Die Attach Copper Paste Improves Thermal Dissipation and Reduces Cost
The Elec Inc. South Korea Overview Epsilon showcased advanced packaging material solutions at the 2026 Advanced Semiconductor Packaging & Chiplet Show (ASPS 2026), targeting advancements in AI data centers. Exhibited materials includ... -
tesa Introduces ‘tesa 4563’ Adhesive Tape for Industrial Roller Wrapping, Combining Excellent Anti-Adhesion and Anti-Slip Properties for Printing and Web Processing Industries
openPR.com / ABNewswire Germany Overview tesa has launched 'tesa 4563,' a new adhesive tape specifically designed for industrial roller wrapping applications. This product features a specially treated fabric substrate and a silicone rubb... -
3M and BOE Establish Joint Lab to Accelerate Display Technology Innovation, Focusing on ‘Wrinkle-Free’ Foldable Display Reliability
3M News Center USA Overview 3M and BOE have opened a joint laboratory within the BOE Technology Innovation Center to accelerate display technology innovation. This collaborative R&D platform integrates BOE's display innovation with 3... -
Nordson Electronics Solutions Unveils ASYMTEK Vantage® XL Fluid Dispensing System for Panel-Level Packaging at SEMICON Taiwan 2026, Boosting Throughput and Yield for AI/HPC Chips
Morningstar / Nordson Electronics Solutions USA Overview Nordson Electronics Solutions launched the new ASYMTEK Vantage® XL fluid dispensing system at SEMICON Taiwan 2026, specifically engineered to meet the stringent demands of panel-le... -
DELO Unveils Ultra-Low Temperature Curing Adhesives for Consumer Electronics, Achieving Curing at 45°C for Enhanced Productivity and Component Protection
DELO News Germany Overview DELO has introduced a new generation of adhesives enabling ultra-low temperature (SLT) curing from just 45°C for consumer electronics assemblies, a significant reduction from conventional methods. Part of the D... -
YINCAE Unveils UF 88UV Optical Underfill with Near 100% Transparency for Advanced Semiconductor Packaging, Enhancing Inspectability
openPR.com / YINCAE Advanced Materials, LLC USA Overview YINCAE Advanced Materials has launched UF 88UV, an innovative high-transparency optical underfill tailored for advanced semiconductor and optoelectronic packaging, boasting approxi... -
SK hynix’s MR-MUF and Samsung’s TC-NCF Revolutionize Thermal Management in AI Semiconductor HBM: Driving Advanced Packaging Evolution
USD Analytics Global Overview The evolution of AI is driving significant changes in semiconductor packaging and High Bandwidth Memory (HBM) technologies, with SK hynix's Advanced MR-MUF and Samsung's TC-NCF technologies solving critical ... -
AI Advancements Drive New Semiconductor Packaging Paradigm: Panel-Based Technologies Surpass Traditional Silicon Interposer Limits
Facebook (reposting an industry trend) USA Overview The rapid evolution of AI is pushing semiconductor packaging beyond the practical limits of traditional silicon interposers, driving a new paradigm. Panel-based packaging is emerging as... -
Koh Young to Unveil Advanced Packaging Measurement Technologies for AI, Chiplet, and Thermal Management at Electronics Packaging Symposium 2026
I-Connect007 South Korea Overview Koh Young Technology will participate in the 37th Annual Electronics Packaging Symposium (EPS 2026) to address measurement challenges in advanced packaging for AI, chiplet architectures, heterogeneous in...
