New Technology– category –
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Onto Innovation Unveils High-Precision, High-Speed Metrology Solution to Accelerate Panel Level Packaging Mass Production
Photonics.com USA Overview Onto Innovation has announced a high-precision metrology solution designed to overcome mass production challenges in Panel Level Packaging (PLP). This new technology enables high-speed measurement of fine struc... -
KLA Unveils AI-Powered High-Speed, High-Precision Defect Inspection Solution to Boost Yield in Advanced Packages like CoWoS
SEMI Global USA Overview KLA has introduced a new AI-powered inspection system for high-speed, high-precision defect detection in high-density RDLs and 3D stacked structures. This solution supports yield management in advanced packaging ... -
Applied Materials Unveils New Hybrid Bonding Platform for High-Volume 3D Stacked Chip Manufacturing, Enabling Ultra-Fine Pitch Integration
Business Wire USA Overview Applied Materials has launched a new hybrid bonding platform designed for high-volume manufacturing of next-generation 3D stacked chips. This innovative system achieves high-precision alignment and high through... -
Resonac Develops Innovative Thermal Management Materials Achieving 30% Thermal Conductivity Improvement for AI/HPC Semiconductor Packages
Chemical Daily Japan Overview Resonac has announced the development of groundbreaking thermal interface materials (TIMs) and encapsulants that boast a 30% improvement in thermal conductivity over conventional products. This innovation di... -
Ibiden Announces Significant Yield Improvement in AI Chip ABF Substrates with New Process Technology, Stabilizing Supply
Nikkei Asia Japan Overview Ibiden has reported a substantial improvement in manufacturing yield for Ajinomoto Build-up Film (ABF) substrates used in AI processors, driven by the introduction of a new process technology. This advancement ... -
Samsung Electro-Mechanics Boosts FC-BGA Substrate Capacity by 20% for AI/HPC, Enhances Competitiveness with Fine-Pitch Wiring
The Korea Economic Daily South Korea Overview Samsung Electro-Mechanics (SEMCO) announced a 20% expansion of its high-end FC-BGA substrate production capacity in South Korea, driven by surging demand from AI/HPC applications. This strate... -
ASMPT to Showcase Advanced Thermocompression and Hybrid Bonding Innovations for HPC and AI at SEMICON Taiwan 2026
ASMPT SEMI Solutions Taiwan Overview Global technology leader ASMPT announced it will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, supporting HPC, AI accelerators, silicon photonics, and Co-Packaged Optics (CPO) appl... -
Rapidus Targets 600mm Panel-Level Packaging and 8-Reticle Interposers by 2030 for Advanced AI/HPC Systems
TrendForce Japan Overview Rapidus announced an accelerated advanced packaging roadmap aiming for 600mm panel-level packaging and 8-reticle interposers by 2030. The company has fully activated its Rapidus Chiplet Solutions (RCS) pilot lin... -
AI Firm Noetik Achieves First Milestone in GSK Collaboration, Deploying OCTO-VC Foundational Model’s Inference and Fine-tuning Capabilities for Oncology Drug Discovery
Business Wire Global Overview AI company Noetik has successfully achieved its first short-term milestone in a five-year strategic collaboration and licensing agreement with GSK. This accomplishment was met by Noetik's delivery and deploy... -
Monod Bio Licenses AI-Designed Protein Technologies to SignalChem Biotech for Accelerated Custom Luminescent Assay Development
The Scientist Global Overview AI-driven protein design company Monod Bio has entered into a non-exclusive licensing agreement with SignalChem Biotech, enabling the integration of Monod Bio's LuxSit de novo luciferase technology and NovoB...
