New Technology– category –
-
GlobalFoundries Elevates Data Center Energy Efficiency with Strategic 48V Power Delivery Approach
GlobalFoundries USA Overview GlobalFoundries has outlined a strategic approach to 48V power delivery in its Insights blog, aiming to enhance energy efficiency in data centers and high-performance computing (HPC). While not directly photo... -
Optalysys Demonstrates Photonic Hardware for Compute-in-Transit, Revolutionizing AI and Cryptographic Workloads by Eliminating Data Movement Bottlenecks
Quantum Zeitgeist UK Overview Optalysys has demonstrated innovative photonic hardware capable of performing computations directly as data travels from storage. This 'in-transit computing' model addresses the critical data movement bottle... -
Hamamatsu Photonics Europe Enhances Advanced Imaging Solutions with Fairchild Imaging CMOS Sensor Technologies Post-Acquisition
Electronics360 Japan Overview Hamamatsu Photonics Europe is significantly strengthening its advanced imaging solutions by actively promoting Fairchild Imaging's advanced CMOS image sensor technologies, following its 2024 acquisition. Thi... -
imec Revolutionizes Sensing and Imaging with Integrated Photonics Breakthroughs at SPIE Optics + Photonics 2026: CMOS-Compatible SWIR and Real-Time Scattering Compensation
imec Belgium Overview At SPIE Optics and Photonics 2026, imec presented two major integrated photonics advancements. Gökhan Kara unveiled a CMOS-compatible platform for cost-effective SWIR spectral sensing, while Filip Milojković introdu... -
Socionext Expands SoC Roadmap with Intel 18A-P Process, Bolstering Next-Gen Opto-Electronic Device Integration
Design And Reuse Japan Overview Socionext has broadened its System-on-Chip (SoC) roadmap by adopting Intel's advanced 18A-P process technology. This strategic move strengthens the foundation for supporting complex integration required fo... -
Semiconductor Foundries Evolve Role, Driving Industrialization of Silicon Photonics and Advanced Heterogeneous Integration
Design And Reuse USA Overview Semiconductor foundries are shifting their role from pure transistor manufacturing to providing advanced packaging and heterogeneous integration solutions. This evolution is crucial for the burgeoning chiple... -
TIER IV and Renesas Partner to Develop AI-Native Software-Defined Vehicle Platform, Integrating Advanced Sensing and Photonic Computing
Design And Reuse Japan Overview Japanese autonomous driving firm TIER IV and semiconductor giant Renesas Electronics have announced a partnership to co-develop an AI-native Software-Defined Vehicle (SDV) platform. This collaboration aims... -
Arteris Reports High Premium for AI Chip IP, Reflecting Soaring Demand for Specialized Silicon
Design And Reuse USA Overview Arteris has observed a significant premium for AI chip intellectual property (IP) in the market, underscoring the escalating value of specialized IP in AI hardware development. Semiconductor manufacturers ar... -
Alibaba Develops RISC-V Chip Capable of Running 27 Billion Parameter AI Model Without GPU
Design And Reuse China Overview Alibaba has developed a RISC-V-based chip that can execute a 27 billion parameter AI model without relying on a GPU. This achievement signals significant progress in specialized alternative chip architectu... -
Rapidus Targets 8-Reticle Interposers on 600mm Advanced Packaging Panels by 2030, Accelerating Heterogeneous Integration for AI/HPC
Design And Reuse Japan Overview Japanese foundry Rapidus has unveiled an ambitious roadmap to achieve 8-reticle interposers on 600mm advanced packaging panels by 2030. This development is crucial for integrating complex chiplets, includi...
