Adhesives & Sealants Weekly Report May 18, 2026

Chiplet Underfill Dispensing Market to Grow Through 2036 Driven by HBM and C2W Hybrid Bonding Void Reduction Needs

GM Mandates Specialized Adhesives for Corvette C8 Repairs, Signaling Industry Shift in Advanced Material Maintenance

SK Hynix to Launch Advanced Packaging Plant in Indiana, USA by H2 2028 to Meet Surging HBM3 Demand

Silicone Foam for Lithium Battery Packs Market to Grow Through 2035, Driven by Thermal Runaway Regulations; EV Batteries Lead End-Use

Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging

AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace

Lenovo Legion Y70 2026 Gaming Phone Boosts Cooling with 12 W/mK Liquid Metal and High-Conductivity Gel

H.B. Fuller Acquires Advanced Medical Solutions for £660M, Bolstering Medical Adhesives Technology and Global Footprint