INSTITUTION PROFILE / ADHESIVES & ENCAPSULANTS
SEMI
The industry association that aligns how semiconductor encapsulation is measured and how panels are sized
SEMI is an industry association for the semiconductor and electronics design and manufacturing supply chain, headquartered in Milpitas, California. It does not make adhesives or encapsulants. It touches the field in two ways. First, it turns test methods and property specifications for semiconductor encapsulation materials into standards that the industry agrees on voluntarily. Second, it provides places, such as the SEMICON exhibitions and technology communities, where advanced packaging is discussed. SEMI standards are voluntary and carry no legal force of their own. This profile covers the kind of influence SEMI has and how far it reaches, limited to what could be confirmed on its official website.
- SEMI in 30 seconds
- What kind of institution: the type of influence
- What SEMI does for adhesives and encapsulants
- Scope of influence: authority and geography
- Related bodies and how standards and events connect
- Outlook
- Glossary / References / Claim-to-source audit
1. SEMI in 30 seconds
A SEMI standard is a voluntary technical agreement reached between suppliers and customers. SEMI itself says its standards are "voluntary technical agreements" that take the form of specifications, guides, test methods, terminology or best practices Sourced. They are drafted by experts from member companies, not by a government body. They still matter for adhesives and encapsulants, because in semiconductor packaging, equipment and materials cannot be reused unless encapsulation properties and panel dimensions are shared. SEMI points to a gap in encapsulation materials for wafer-level and panel-level packaging: resin characteristics are specified for legacy packages, but there was no specification for wafer-level and panel-level packaging, and it is working on standards to fill it Sourced.
2. What kind of institution: the type of influence
The institutions in our adhesives profiles do not make products themselves. They can be sorted into four types according to the route by which they influence the industry. SEMI spans two of them: the "standards" type, through the standards it publishes, and the "convening" type, through trade shows and technology communities.
3. What SEMI does for adhesives and encapsulants
SEMI publishes its standards in a set of 16 to 17 "volumes", including Packaging (G) and 3D IC (3D) Sourced. The main standards that touch adhesives and encapsulants are summarised below, using the titles on the SEMI Store.
| Area | Standard (as titled by SEMI) | What it covers |
|---|---|---|
| Adhesion between leadframes and molding compound | SEMI G69 Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds | How to measure adhesive strength between a leadframe and the molding compound: shear test, pull test and three-point bending. First published September 1996; reapproved August 2023 |
| Basic properties of molding compounds | SEMI G66 and G13 Water Absorption Characteristics for Semiconductor Plastic Molding Compounds / Thermal Expansion Characteristics of Molding Compounds | Test methods for water absorption and thermal expansion of semiconductor molding compounds (see also our explainers on the coefficient of thermal expansion and semiconductor encapsulants) |
| Encapsulants for wafer-level and panel-level packaging | SEMI G98 to G104 Specification for ... of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging | Seven properties: coefficient of thermal expansion (CTE), flowability, gel time, modulus, shear strength, viscosity and wettability. They apply to three forms of encapsulant: liquid, granular and sheet. SEMI says legacy packages had resin specifications but WLP and PLP did not |
| Panel dimensions | SEMI 3D20 Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications | Sets external dimensions, thickness, warpage and mass of panels for PLP. Two panel sizes, 510 x 515 mm and 600 x 600 mm (according to SEMI's activity report). The panel FOUP (transport pod) is SEMI E181 |
The titles of SEMI G98 to G104 all begin "Specification for ...". They align which encapsulant properties are measured, by what method, and how they are reported. They do not set minimum performance values for a material. Instead they let the numbers on suppliers' data sheets be compared under the same conditions Sourced. The panel dimensions discussed in our explainers on molding and panel-level packaging rest on SEMI 3D20. For an encapsulant maker, being able to supply data measured the SEMI way makes it easier to be referenced in dealings with package makers (how often SEMI standards are actually cited in customers' specifications could not be confirmed) Not yet confirmed.
SEMI also runs the Advanced Packaging & Heterogeneous Integration (APHI) technology community. APHI lists among its activities providing a venue for pre-competitive technology development, identifying technology gaps and exploring the need for new, non-duplicative standards Sourced.
4. Scope of influence: authority and geography
| Aspect | What SEMI has | What SEMI does not have |
|---|---|---|
| Authority | It publishes standards based on agreement among member companies, with procedures such as standards ballots. Standards are sold, and the proceeds cover part of the cost of running the program | Power to compel use of its standards or to make law. Standards are "voluntary". No certification scheme appears in the documents checked |
| Geography | Standards committees began in North America, expanded to Europe and Japan in 1985 and now also exist in China, Korea and Taiwan. The SEMICON exhibitions are held in the United States, Europe, Japan, China, Korea, Taiwan, Southeast Asia, India and elsewhere | Legal status in each country. This article did not check how each country treats the standards |
| Scope in adhesives and sealing | Standards for semiconductor encapsulation resins (molding compounds), encapsulants for WLP and PLP, and panel dimensions | General adhesive test methods (the territory of ISO standards). No individual standards for underfill or die-attach materials were found in this check |
| Size | Over 4,000 member companies, about 150 committees and more than 20 technology communities (as stated on the membership page) | Staff numbers, and the number of people on committees relevant to adhesives and encapsulants, were not found in public documents |
SEMI's 2025 press releases say it connects "over 3,000 member companies", while releases from August and September 2026 say "over 4,000" Sourced. The official pages do not show whether membership actually grew in between or whether the way of counting changed (member companies versus companies reached). This article uses the latest figure, "over 4,000", and notes that how many of them work on adhesives and encapsulants is unknown.
5. Related bodies and how standards and events connect
SEMI's page names two fellows, from Intel and from ASE, as chairs of the APHI community Sourced. In Japan, a task force on panel FOUP standards, started in May 2018, is reported by its own activity report to have involved more than 40 participating companies and 95 registered members Sourced. How the adhesive and encapsulant makers in our company profiles take part in writing these standards could not be determined from the materials checked, so this article does not say.
6. Outlook
| What can be read | Primary information behind it | Status |
|---|---|---|
| SEMICON West 2026 is scheduled for 13 to 15 October 2026 (Moscone Center, San Francisco), SEMICON Europa 2026 for 10 to 13 November (Munich) and SEMICON Japan 2026 for 9 to 11 December (Tokyo) | SEMI's APHI page and its press release of 27 August 2026 | Not yet confirmed |
| Standards for WLP and PLP encapsulants are newer than those for conventional packages, so items may be added or revised | The SEMI G102 description (which says no WLP or PLP specification existed) and a 2021 activity report saying the panel FOUP standard would continue to be revised with industry feedback | Inference |
| As panel dimensions are standardised, demand for common evaluation conditions for PLP encapsulants (liquid, granular, sheet) may grow | SEMI 3D20 (which says standard panel dimensions are needed for common equipment) and G98 to G104 (which say properties must be defined for encapsulation of large panels) | Inference |
7. Glossary
- SEMICON
- The series of exhibitions run by SEMI, held in the United States, Europe, Japan and elsewhere in Asia.
- WLP / PLP
- Wafer-level packaging / panel-level packaging: packaging steps carried out on a whole wafer or panel.
- FOUP
- Front Opening Unified Pod, a container for transporting and storing substrates. The panel version is specified in SEMI E181.
- APHI
- Advanced Packaging & Heterogeneous Integration, the name of a SEMI technology community.
- Molding compound
- The general term for the resin that encases a semiconductor. Typically an epoxy resin with fillers (see our explainer on semiconductor encapsulants).
8. References
- SEMI About SEMI (founded 1970, 1.5 million professionals, SEMICON, standards and technology communities). https://www.semi.org/en/about-semi-membership/about-semi
- SEMI Standards (over 1,000 standards, over 5,000 volunteers, list of standards volumes, proceeds from sales covering part of program costs). https://www.semi.org/en/products-services/standards
- SEMI About SEMI Standards (standards as voluntary technical agreements; expansion from North America to Europe, Japan, China, Korea and Taiwan). https://www.semi.org/en/products-services/standards/using-semi-standards
- SEMI Membership (more than 20 technology communities, 150 committees). https://www.semi.org/en/about-semi-membership/membership
- SEMI Press release of 1 September 2026 (registration opens for SEMICON Europa 2026; over 4,000 member companies and 1.5 million professionals). https://www.semi.org/en/semi-press-release/registration-opens-for-semicon-europa-2026-as-industry-leaders-gather-to-navigate-europes-semiconductor-future
- SEMI Press release of 2025 on global semiconductor equipment billings (describes "over 3,000 member companies"). https://www.semi.org/en/semi-press-release/global-semiconductor-equipment-billings-surged-to-117-billion-dollars-in-2024-semi-reports
- SEMI Press release of 27 August 2026 (SEMICON West 2026; datelined Milpitas; 13 to 15 October 2026, San Francisco). https://www.semi.org/en/semi-press-release/semicon-west-2026-to-spotlight-1-trillion-dollars-semiconductor-milestone-and-technologies-powering-the-industrys-next-era
- SEMI APHI Technology Community (advanced packaging and heterogeneous integration; 2026 SEMICON schedule; committee chairs). https://www.semi.org/en/industry-groups/advanced-packaging
- SEMI Japan Panel Level Packaging Panel FOUP Activity Highlights (Standards Watch, June 2021; the two panel sizes in SEMI 3D20; task force size). https://www.semi.org/en/standards-watch-2021June/japan-plp-panel-foup-highlights
- SEMI Store SEMI G69 Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds. https://store-us.semi.org/products/g06900-semi-g69-test-method-for-measurement-of-adhesive-strength-between-leadframes-and-molding-compounds
- SEMI Store SEMI G102 Specification for Shear Strength of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging (and the search results for G98 to G104; the background on missing WLP and PLP specifications). https://store-us.semi.org/products/g10200-semi-g102-specification-for-shear-strength-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packaging
- SEMI Store SEMI 3D20 Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications. https://store-us.semi.org/products/3d02000-semi-3d20-en-specification-for-panel-characteristics-for-panel-level-packaging-plp-applications
- SEMI Store SEMI E181 Specification for Panel FOUP for Panel Level Packaging. https://store-us.semi.org/products/e18100-semi-e181-specification-for-panel-foup-for-panel-level-packaging
- SEMI Store SEMI G66 (water absorption of molding compounds). https://store-us.semi.org/products/g06600-semi-g66-test-method-for-the-measurement-of-water-absorption-characteristics-for-semiconductor-plastic-molding-compounds
- SEMI Store SEMI G13 (thermal expansion of molding compounds). https://store-us.semi.org/products/g01300-semi-g13-standard-test-method-for-expansion-characteristics-of-molding-compounds
- SEMI Store SEMI G75 Standard Test Method of the Properties of Leadframe Tape. https://store-us.semi.org/products/g07500-semi-g75-standard-test-method-of-the-properties-of-leadframe-tape
9. Claim-to-source audit
| Claim in the text | Status | Source |
|---|---|---|
| Founded 1970; industry association connecting 1.5 million professionals; SEMICON, standards and technology communities | Sourced | Reference 1 https://www.semi.org/en/about-semi-membership/about-semi |
| More than 1,000 standards and 5,000 volunteers; list of volumes; sales proceeds fund part of the program | Sourced | Reference 2 https://www.semi.org/en/products-services/standards |
| Standards are voluntary technical agreements; geographic spread of committees; 16-volume structure | Sourced | Reference 3 https://www.semi.org/en/products-services/standards/using-semi-standards |
| More than 20 technology communities and 150 committees | Sourced | Reference 4 https://www.semi.org/en/about-semi-membership/membership |
| Over 4,000 member companies (September 2026) and over 3,000 (2025) | Sourced | References 5 and 6 https://www.semi.org/en/semi-press-release/registration-opens-for-semicon-europa-2026-as-industry-leaders-gather-to-navigate-europes-semiconductor-future |
| Headquarters in Milpitas; SEMICON West 2026 dates | Sourced | Reference 7 https://www.semi.org/en/semi-press-release/semicon-west-2026-to-spotlight-1-trillion-dollars-semiconductor-milestone-and-technologies-powering-the-industrys-next-era |
| APHI activities and chairs; SEMICON Europa and Japan 2026 dates | Sourced | Reference 8 https://www.semi.org/en/industry-groups/advanced-packaging |
| SEMI 3D20 panel sizes (510 x 515 mm and 600 x 600 mm), task force size, plan to keep revising the standard | Sourced | Reference 9 https://www.semi.org/en/standards-watch-2021June/japan-plp-panel-foup-highlights |
| SEMI G69 title, content and revision history | Sourced | Reference 10 https://store-us.semi.org/products/g06900-semi-g69-test-method-for-measurement-of-adhesive-strength-between-leadframes-and-molding-compounds |
| SEMI G98 to G104 titles, the background on WLP and PLP encapsulation, three forms of encapsulant | Sourced | Reference 11 https://store-us.semi.org/products/g10200-semi-g102-specification-for-shear-strength-of-encapsulation-materials-for-wafer-level-packaging-and-panel-level-packaging |
| SEMI 3D20 and E181 titles and content | Sourced | References 12 and 13 https://store-us.semi.org/products/3d02000-semi-3d20-en-specification-for-panel-characteristics-for-panel-level-packaging-plp-applications |
| SEMI G66, G13 and G75 titles and subjects | Sourced | Reference 14 https://store-us.semi.org/products/g06600-semi-g66-test-method-for-the-measurement-of-water-absorption-characteristics-for-semiconductor-plastic-molding-compounds, Reference 15 https://store-us.semi.org/products/g01300-semi-g13-standard-test-method-for-expansion-characteristics-of-molding-compounds, Reference 16 https://store-us.semi.org/products/g07500-semi-g75-standard-test-method-of-the-properties-of-leadframe-tape |
| The four types of institution and the arrangement of Fig. 2 | Our calculation | Classification by this article |
| How often SEMI standards are cited in customers' specifications, staff numbers, individual underfill or die-attach standards, whether a certification scheme exists | Not yet confirmed | Not stated in the official materials checked. This article does not estimate them |
| Expansion of WLP and PLP standards and common evaluation conditions (Section 6) | Inference | This article's reading of References 9, 11 and 12 |
Last updated 3 October 2026 / Troy Technical
Figures and standards information come from SEMI's website and SEMI Store pages. Items marked "Inference" are this article's reading of the primary information.