COMPANY PROFILE / ADHESIVES & ENCAPSULANTS
Master Bond
A U.S. formulator that makes more than 3,000 grades to order and states, grade by grade, which standards each has passed
Master Bond is a privately held U.S. company that formulates adhesives, encapsulants and coatings from epoxies, silicones, UV-curing systems and other chemistries to suit each application. The angle this profile takes is the application (semiconductors, optical communications, medical, space, electrical equipment) and the standards that act as that application's pass mark. Its website covers semiconductor-packaging uses such as underfill, glob top, die attach and lid sealing, and lists, product by product, compliance with NASA low outgassing, ISO 10993 for medical use and UL 94, among others. What it does not publish is revenue, profit, headcount or R&D spending. This article keeps what can be confirmed about products and standards apart from the management figures that cannot be confirmed.
- Master Bond in 30 seconds, and where it stands in adhesives and encapsulants
- The logo and how the name is written
- Where the company sits in the adhesives and encapsulants field
- Company size (financials not disclosed)
- Resources committed to adhesives and encapsulants
- Track record so far
- Plans ahead
- What the company seems to be aiming for
- Partnership map for adhesives and encapsulants
- Technologies, products and services (applications and standards)
- Risks the company faces
- Glossary / References / Claim-to-source audit
1. Master Bond in 30 seconds, and where it stands in adhesives and encapsulants
New Jersey, USAAll products are made and sold from this one site
Semiconductor & electronic materials (secondary)A specialist in application-specific formulations
Adhesive companies fall into three broad types: general adhesives and chemicals, semiconductor and electronic materials, and UV-curing and specialty applications. Master Bond is not a resin maker. It is a formulator that mixes resins, hardeners, fillers and additives in a fixed order to give each application the properties it needs Sourced. Of the three types it sits closest to UV-curing and specialty, and it also serves semiconductor and electronic uses; that is how this article classifies it Our calculation. What the website shows again and again is an accumulation of statements of the form "this product passed this standard". In choosing an adhesive, whether it passed the test that is mandatory for the application often comes before any property figure, and the company presents itself accordingly. Compliance, however, applies to selected grades only, and the company itself warns that compliance in the final product is the user's responsibility.
2. The logo and how the name is written
A note on names: the company's name is Master Bond Inc. The logo image is the one used in the header of the company's own website, and has been placed here as obtained from it. A search for "master bond" by company name on the U.S. Securities and Exchange Commission's EDGAR shows only Master Bond LLC (formerly Master Bond Trust, Delaware), and no filer matching the Hackensack company could be confirmed. These are two organisations with the same name, so please do not confuse them.
Official site: https://www.masterbond.com/3. Where the company sits in the adhesives and encapsulants field
4. Company size (financials not disclosed)
We could not find disclosure by Master Bond as a listed company. Its website also gives no revenue, profit, headcount or R&D spending. The table separates what we could confirm from what we could not.
| Item | What we found | Category |
|---|---|---|
| Founded | 1975 | Sourced |
| Head office and manufacturing site | 154 Hobart Street, Hackensack, NJ 07601 USA. The website says products are made and sold only at its Hackensack, New Jersey site | Sourced |
| Number of products | More than 3,000 grades of formulation. It also offers replacements for competitors' discontinued products | Sourced |
| How it sells | To manufacturers and research laboratories, not for personal use. Products cannot be bought on the website or in retail stores. The standard lead time is 10 to 14 business days after an order | Sourced |
| Packaging | Syringes in standard sizes of 3, 5, 10 and 30 cc, and double-barrel cartridges for two-part systems in a standard 50 cc size. Opaque black syringes for UV-curing systems | Sourced |
| Revenue and profit | Not given on the website | Could not be confirmed |
| Headcount | Not given (only the remark that key personnel have more than 30 years of formulating experience) | Could not be confirmed |
| Listing and shareholders | Not given. No filer matching the company on SEC EDGAR either | Could not be confirmed |
"More than 3,000 grades" is not a measure of sales or market share. It counts formulations, and tells us nothing about the volume shipped per grade. Because no primary source lets us estimate the company's size, this article makes no estimate of revenue or headcount Not yet confirmed. The website also says the company is recognised by many as the preeminent adhesive formulation company in the world, but that is the company's own assessment, not a figure from any third-party survey.
5. Resources committed to adhesives and encapsulants
The table covers people, money, outside investment and links with universities and research institutes, showing whether each could be confirmed.
| Type of resource | What we found | Category |
|---|---|---|
| People | Headcount is not disclosed. The Technical Director is Dr. Walter Brenner, who holds a doctorate in polymer chemistry and, according to the company, was the first to develop electron beam radiation curing (we have not verified this). Every incoming inquiry is assigned to an experienced technical representative | Sourced (numbers not disclosed) |
| Money (R&D and capital investment) | R&D spending, capital investment and plant investment | Not disclosed |
| Facilities and manufacturing set-up | One production site. Each order is compounded to controlled temperature, humidity and order of ingredients, and a process once fixed is not changed. Incoming raw materials are checked, viscosity, density, colour and moisture are controlled lot by lot, and retained samples are kept | Sourced |
| Outside investments, acquisitions, joint ventures, divestments | Not given on the website | Could not be confirmed |
| Joint research with companies | Joint research with STERIS, a maker of sterilisation equipment, on whether epoxies withstand vaporised hydrogen peroxide (VHP) sterilisation, published in the peer-reviewed journal Polymer-Plastics Technology and Materials (2024; the company's release is dated 9 September 2024) | Sourced |
| Use in university research | The company presents, as a case study, a 2023 paper in Polymer Composites in which researchers at Florida International University used EP114 for vacuum infiltration of nanocomposites. It is not described as joint research | Sourced (joint research could not be confirmed) |
| Societies and trade bodies | Member of SAMPE (the Society for the Advancement of Material and Process Engineering), IMAPS (the International Microelectronics and Packaging Society), the Cryogenic Society of America, OIDA (the Optical Industry Development Association) and the Fiber Optic Association | Sourced |
| Public funding and grants | Not given | Could not be confirmed |
A formulator's value lies not in synthesising resin but in tuning the balance of pot life and cure conditions, viscosity, filler dispersion, glass transition temperature (Tg), thermal expansion and the bonding interface to the standards of the application (a general explanation). The website describes inspection of incoming materials, control of viscosity, density, colour and moisture from lot to lot, and the addition of ingredients in a set order, and says the process is not adjusted once established Sourced. Changing a formulation changes its properties, so test results already obtained for a standard would no longer apply, which may be the reason; the company does not say so Not yet confirmed.
6. Track record so far
| When | What happened | Meaning |
|---|---|---|
| 1975 | Founded, specialising in formulating epoxies, silicones, polyurethanes, polysulfides, UV-curing and other specialty adhesive systems | The start as a dedicated formulator |
| July to September 2024 | The paper from the joint research with STERIS was published (July, the date in the Crossref record). The company issued its release on 9 September. Six of the seven epoxies evaluated were compatible with 100 VHP sterilisation cycles | It showed by testing the sterilisation resistance that reusable medical devices need |
| 19 May 2025 | Announced EP3HTSDA-2Med, a one-part silver-filled electrically conductive epoxy. It passes the ISO 10993-5 cytotoxicity test | Electrical conductivity together with biocompatibility |
| 1 May 2026 | Announced EP64, with a Tg of 210 to 215°C and NASA low outgassing (ASTM E595) | A high-Tg grade for space and electronics |
| 5 June 2026 | Announced MasterSil 981-LO, an optically clear addition-cured silicone with NASA low outgassing | Soft encapsulation for optics, optoelectronics and space |
| 10 July 2026 | Announced UV16Med-FD, a UV-curing epoxy with a fluorescent dye, which passes ISO 10993-5 | Visual inspection (for voids and overflow) combined with biocompatibility |
| 27 August 2026 | Announced EP55TCFL, thermally conductive with a low modulus and NASA low outgassing | Heat dissipation combined with stress relief |
| 1 October 2026 | Announced EP62-1HTND, an acid-resistant, non-drip epoxy | Chemically resistant bonding and sealing that can be applied to vertical surfaces |
7. Plans ahead
Because the company is privately held, we could find no published management plans such as a medium-term plan, capital expenditure plan, new plant or revenue target. What the website does show is a statement to the effect that it keeps developing new formulations, and a stream of new-product releases, the latest five running from May to October 2026 Sourced.
None of the following appears on the company's website Not yet confirmed.
Plans for a new plant or expansion; revenue or profit targets; staffing plans; an M&A policy; plans for sites outside the U.S. (it currently has one site in the U.S.); and specific plans for responding to chemical regulation such as PFAS. Statements such as "a new product will be launched soon" cannot be confirmed until a release appears.
8. What the company seems to be aiming for
This part includes points the company has not stated directly. It sets out inferences from what the primary sources say, together with the evidence.
| What can be read from the material | Primary evidence | Category |
|---|---|---|
| It aims to be chosen for tailoring to each use and technical consultation, not for volume or price | The company profile speaks of formulating to the application rather than one size for all, and says each inquiry is assigned a technical representative. Purchase starts with a consultation with an engineer, and products cannot be bought online | Sourced |
| It makes building up grades that comply with standards the centre of its product strategy | The classification on the certifications page (medical, aerospace, military, UL, food and others), and the fact that most of its recent releases lead with compliance such as NASA low outgassing or ISO 10993 | Inference |
| Making to order is a choice that avoids holding stock and keeps shelf life long | The purchase page says products are made when ordered and prepared to maximise shelf life. Lead time is 10 to 14 business days | Inference |
| Compliance is the starting point, and checking in the final product is left to the customer | The USP Class VI and ISO 10993-5 pages say that compliance does not automatically mean a system can be used in a medical device, and that results do not guarantee FDA approval | Sourced |
| Environmental work is done by showing what the products do not contain | The website states solvent free, halogen free, RoHS 3, and no PFOA, PFOS or animal-derived ingredients. No numerical target for reducing or replacing raw materials was found | Sourced |
In the latest five releases (May to October 2026: EP64, MasterSil 981-LO, UV16Med-FD, EP55TCFL and EP62-1HTND), four of the five headline compliance with either NASA low outgassing or ISO 10993-5 Sourced. NASA low outgassing (ASTM E595) checks that gases released in the vacuum of space will not contaminate instruments, and ISO 10993-5 checks that a material is not toxic to cells. Both act as a pass mark for entry into the application. The more formulations that have cleared that mark, the less time a customer needs to select a material. From this, this article reads the range of standards-compliant grades as itself having become a sales strength Not yet confirmed. How much of revenue comes from these standards-compliant products is not disclosed, so it cannot be known.
9. Partnership map for adhesives and encapsulants
10. Technologies, products and services (applications and standards)
Products are organised along two axes: chemistry (epoxy, silicone, UV and LED curing, urethane-modified epoxy, polysulfide-modified epoxy, cyanoacrylate, film adhesives and preforms, silicate-based and others) and performance or application. All figures below are manufacturer's stated values; read them together with the test conditions and grade names. We do not rank grades against one another.
Uses in semiconductor packaging and electronic components
| Use | What the company page says (manufacturer's stated values) | Source |
|---|---|---|
| Underfill | In flip-chip and CSP assemblies it redistributes thermally induced shear stress and so improves reliability. Silicon expands at about 2.6 ppm/°C and organic substrates at 14 to 17 ppm/°C or more; the difference is largest at the die corners, so the shape and volume of the fillet formed around the die edge affect reliability, it says. Flowable and non-flow systems are available. Examples: EP3UF (one-part, thermally conductive and electrically insulating, NASA low outgassing) and EP4UF-80 (low-viscosity one-part, cures at 80°C or above) | Reference 18 |
| Glob top and dam-and-fill | Protect chips and wire bonds from moisture, chemicals and contamination, and reduce the thermal mismatch between chip and substrate. One-part epoxy, two-part epoxy and UV-curing types. Examples: UV15X-2GT (Shore D 65), Supreme 3HTND-2GT (cures quickly at 125 to 150°C) and, for damming, Supreme 3HTND-2DM (NASA low outgassing) | Reference 19 |
| Die attach | One-part heat-curing systems and B-staged epoxy films, both conductive and insulating. Die shear strength (at 75°F, 2 x 2 mm die, measured at an independent laboratory based on MIL-STD-883 Method 2019): for the insulating film FL901AO, 40 to 42 kgf; for the one-part EP17HTDA-1, 24 to 27 kgf; for Supreme 3HTND-2DA, 19 to 21 kgf. Among conductive grades, the film FL901S gives 24 to 26 kgf and the one-part EP3HTSDA-1 and -2 give 20 to 22 kgf. The company notes that the findings are not to be used for specification purposes | References 20 and 21 |
| Lid sealing | Says seam welding, soldering and glass attachment can bring high processing temperatures that damage sensitive parts, metal-particle contamination, and limits on design freedom, and offers epoxy paste and B-staged preforms as alternatives. Stresses low-temperature processing and the avoidance of metal-particle contamination | Reference 22 |
| Optical fibre | Used for sealing fibres into ferrules, bonding fibres into connectors, potting fibre bundles and V-groove array assemblies. Selection criteria it names include long pot life, high Tg, NASA low outgassing, low shrinkage and 1,000 hours at 85°C/85% RH | Reference 23 |
| Potting and encapsulation | For power supplies, switches, ignition coils, modules, motors, connectors, sensors and capacitors, among others. It says it offers formulations that meet UL 94V-0, UL 746A, UL 1203, NASA low outgassing, USP Class VI and FDA 21 CFR 175.300, and states that all products are RoHS compliant | Reference 24 |
A map of standards: which standard checks what
The standards on the certifications page are easier to follow once you see that each application has a different pass mark. The table separates Master Bond's own descriptions from what we could confirm on the official pages of the standards and laws.
| Standard or regulation | What it checks | Master Bond's description (manufacturer's stated) | Official page of the standard itself |
|---|---|---|---|
| ASTM E595 (NASA low outgassing) | How much gas a material releases in vacuum. A guide to contamination in spacecraft, optics and high-vacuum equipment | Total mass loss (TML) and collected volatile condensable materials (CVCM) are measured after 24 hours at 125°C in high vacuum. A material fails if CVCM exceeds 0.1%, or if TML exceeds 1% (after the water-vapour-regain correction) | ASTM E595-15(2021) defines a screening technique that determines TML, CVCM and water vapour regained in vacuum (Reference 38) |
| USP Class VI; ISO 10993-4, -5 and -10 | Biocompatibility (haemocompatibility, cytotoxicity, skin sensitisation). A pass mark for materials in medical devices | Select grades only. USP Class VI compliance does not automatically mean a system can be used in a medical device. ISO 10993-5 results are a guideline and do not guarantee FDA approval | ISO 10993-5:2009 is a test method for cytotoxicity in which cultured cells are put in contact with a device or its extracts (confirmed in 2022) (Reference 39) |
| UL 94V, UL 746A, UL 1203 | Flame retardancy, resistance to arc ignition, and use in explosion-proof equipment | A UL 94V-0 potting compound (for example EP21FRNS-2) and one-part silicones (V-0 or V-1 depending on thickness). EP21AC reached PLC 0 in the UL 746A HAI test (no ignition after more than 150 arcs at 3.0 mm thickness). UL rates these for temperatures up to 90°C | The UL standards are paid documents and we did not check their text. Master Bond's description only (References 9 and 10) |
| FAR 25.853(a); Boeing and Airbus tests | Burning behaviour of aircraft cabin and cargo-compartment materials (vertical and horizontal) | Three products pass the vertical and horizontal burn tests. The list names four grades: EP90FR-V and EP93AOFR (vertical), EP90FR-H and EP90FR-HFL (horizontal) | 14 CFR 25.853(a) is a U.S. federal regulation. We checked Master Bond's description only (Reference 12) |
| MIL-STD-883J (thermal stability, die shear) | Thermal stability: weight loss measured while heating in nitrogen from room temperature to 200°C at 10°C/min. Die shear: the force needed to shear a chip off its substrate | A material passes thermal stability at 1.0% or less weight loss (average of three samples). Tested by TGA per ASTM D3850-12; seven grades pass. Die shear is based on Method 2019 | We did not check the military standard's text. Master Bond's description only (References 11 and 21) |
| 85°C/85% RH (referring to Telcordia GR-1221) | Reliability in high temperature and humidity. An accelerated test for optical-communication and optoelectronic parts | Hardness change after 1,000 hours measured at an independent laboratory; a small change counts in the grade's favour | We did not check the text of Telcordia GR-1221. Master Bond's description only (Reference 15) |
| FDA 21 CFR 175.105 / 175.300 | Requirements for adhesives and resinous coatings on equipment that touches food | 175.105 is for indirect and incidental food contact, and requires every ingredient to be on the FDA's approved list. 175.300 adds an extractables limit (under 0.5 mg/in²) after solvent exposure and a toxicological evaluation of the cured material | We checked the regulation text on eCFR: 175.105 "Adhesives" and 175.300 "Resinous and polymeric coatings" (References 40 and 41). The 0.5 mg/in² figure is the company's description, and we could not confirm it from the regulation text |
| RoHS, halogen free, PFOA and PFOS | Restriction of hazardous substances. Halogen free is defined as chlorine at 900 ppm or less, bromine at 900 ppm or less and total halogens at 1,500 ppm or less (IEC 61249-2-21) | All products said to be RoHS 3 compliant, including the four phthalates added by 2015/863/EU (the certifications page says "almost all"). No PFOA, PFOS or animal-derived ingredients | RoHS is Directive 2011/65/EU (Reference 42), with 2015/863 applied by Member States from 22 July 2019 (Reference 43). IEC 61249-2-21 is in origin a standard for laminates used in printed boards (Reference 44) |
First, Master Bond's statements on RoHS differ from page to page ("all products" and "almost all"). The RoHS page also cites "Directive 2002/95/EC", but that is the former RoHS directive, repealed with effect from 3 January 2013; the current one is Directive 2011/65/EU (recast) (Reference 42). For any particular product, check the technical data sheet Sourced. Second, the halogen-free figures are a definition borrowed from IEC 61249-2-21, a standard for laminates used in printed boards, and not a standard aimed at adhesives themselves Sourced. Third, a pass applies grade by grade and under specific test conditions, and does not carry over to a differently named grade. The company itself writes that USP Class VI and ISO 10993-5 results are a separate matter from approval of a final medical device.
Products announced in 2026 (manufacturer's stated values)
| Product (announced) | Positioning | Manufacturer's stated values (from the release) |
|---|---|---|
| EP64 (1 May 2026) | Two-part epoxy. A high-Tg grade for space and electronics | Tg 210 to 215°C. Meets ASTM E595. Tensile strength 3,000 to 5,000 psi, Shore D 80 to 90, -60°F to +450°F. Cure 4 to 6 hours at 80 to 90°C, then post cure 2 to 4 hours at 120 to 130°C |
| MasterSil 981-LO (5 June 2026) | Two-part addition-cured silicone for optics, optoelectronics and satellites | NASA low outgassing. Shore A 20 to 30, elongation 200 to 300%, refractive index 1.437, volume resistivity above 1014 ohm-cm, -65°F to +400°F. Overnight at room temperature, then 2 to 4 hours at 135 to 165°F |
| UV16Med-FD (10 July 2026) | One-part cationic UV-curing epoxy with a fluorescent dye, for medical devices | Passes ISO 10993-5. Refractive index 1.511, viscosity 250 to 500 cps (75°F). Cured by UV at 320 to 365 nm, 20 to 40 mW/cm² or more. Post cure of 30 minutes at 125°C gives a Tg of 130 to 135°C. -80°F to +400°F |
| EP55TCFL (27 August 2026) | Thermally conductive, electrically insulating, low-modulus epoxy for bonding where heat must escape, and small potting | Thermal conductivity 3.2 to 3.8 W/(m·K), volume resistivity above 1014 ohm-cm (25°C), tensile modulus 8,000 to 12,000 psi, elongation 10 to 20%. NASA low outgassing. Two-part, 100:15; 4 to 6 hours at 50 to 70°C or 3 to 4 hours at 80 to 90°C |
| EP62-1HTND (1 October 2026) | Acid-resistant, non-drip two-part epoxy that can be applied to vertical surfaces | Tg 145 to 155°C, mix ratio 100:5, volume resistivity above 1014 ohm-cm (75°F), -60°F to +450°F. Cure 60 to 70 minutes at 80 to 100°C, or 20 to 30 minutes at 125°C. Post cure 3 to 5 hours at 100 to 150°C |
The EP64 release states that to reach a Tg of 210 to 215°C the epoxy needs 4 to 6 hours at 80 to 90°C followed by a post cure of 2 to 4 hours at 120 to 130°C, and calls that "the key distinguishing characteristic" of the system Sourced. An epoxy goes on cross-linking in the last stage of cure, and post cure raises Tg, so the same formulation gives different values depending on its cure history. EP62-1HTND, by contrast, has a Tg of 145 to 155°C and is designed around a non-drip (thixotropic) paste that does not flow once mixed. In a part that sees thermal cycling, such as an underfill, the combination of modulus, Tg and CTE decides how stress flows. The gap the company cites, about 2.6 ppm/°C for silicon against 14 to 17 ppm/°C for an organic substrate, concentrates stress on the solder joints at the die corners with every thermal cycle. The general explanation is that a design which adds filler to cut thermal expansion and one which adds thermally conductive filler to carry heat away are hard to reconcile in viscosity and flow. In the company's releases, EP55TCFL uses a filler with small particle sizes to give a thin bond line and so lower thermal resistance, and the silver filler in EP3HTSDA-2Med averages 2 to 3 µm with none larger than 25 µm Sourced. This article does not rank products. Instead of comparing values, we suggest reading the conditions under which each value was obtained. See also our explainers on underfill, epoxy resins, glass transition and creep, and coefficient of thermal expansion.
11. Risks the company faces
| Risk | What it means | Category |
|---|---|---|
| A single site | Manufacturing and sales are concentrated in one place, Hackensack in the U.S. The effect of an accident, disaster or regulatory change is not spread | Sourced |
| Little information | Financials, headcount and R&D spending are not disclosed, so continuity of the business and supply capacity cannot be checked from outside | Sourced |
| Raw-material sourcing | It relies on outside suppliers, whose names and shares are not disclosed. Changing a formulation could mean that compliance already obtained no longer applies | Sourced (the effect of a formulation change is an inference) |
| Misreading compliance | Compliance applies to "select grades only". Even where USP Class VI or ISO 10993-5 is met, the company itself cautions that a system cannot necessarily be used as it stands in a medical device | Sourced |
| Inconsistent statements | The scope of RoHS compliance differs between the certifications page (almost all) and the RoHS page (all products), and a reference to the former directive's number remains. Users need to check the individual technical data sheet | Sourced |
| Access | Purchase starts with a consultation with an engineer, and products cannot be bought online. It does not sell for personal use | Sourced |
| Chemical regulation | Rules on PFAS, halogens, plasticisers and similar are advancing, but the company's specific response plans are not disclosed | Not yet confirmed |
12. Glossary
- Formulation
- Mixing resin, hardener, fillers and additives in set proportions and order to give the properties an application needs.
- One-part / two-part
- A one-part system needs no mixing and cures with heat or similar. A two-part system cures when a resin and a hardener are mixed.
- B-stage
- A partly cured state in which the cure reaction has been halted. It is fully cured later by heating.
- Tg (glass transition temperature)
- The temperature at which a material changes from hard to soft. It rises with post cure.
- CTE
- Coefficient of thermal expansion: how much a material lengthens per degree of temperature rise (ppm/°C).
- Underfill / fillet
- Resin that flows beneath a chip and its solder joints. The raised bead around the chip edge is the fillet.
- Glob top / dam-and-fill
- Encapsulation by placing resin over a chip or wires. In dam-and-fill, a retaining wall (dam) is built first.
- Die shear strength
- The force needed to push a chip sideways off its substrate. It is used to evaluate die attach adhesives.
- Low outgassing (ASTM E595)
- A low release of gas from a material in vacuum. A TML of 1% or less and a CVCM of 0.1% or less is the guide.
- USP Class VI / ISO 10993
- Biocompatibility tests for medical materials, including cytotoxicity, haemocompatibility and skin sensitisation.
- UL 94V
- A vertical burn test for plastics. V-0 is the highest flame-retardancy rating.
- VHP sterilisation
- Low-temperature sterilisation with vaporised hydrogen peroxide, repeated for reusable medical devices.
13. References
- Master Bond Inc. Company profile (founded 1975, business, more than 3,000 grades, Technical Director, sustainability and safety, society memberships). https://www.masterbond.com/content/about-master-bond
- Master Bond Inc. "Our Company" (made-to-order production, quality control, order of ingredients, lot control, properties that can be reformulated, technical support). https://www.masterbond.com/content/our-company
- Master Bond Inc. "How to Purchase Our Products" (made and sold only in Hackensack, 10 to 14 business-day lead time, address, no sales for personal use). https://www.masterbond.com/content/how-purchase-our-products
- Master Bond Inc. "Industrial Certifications" (overview of certifications and standards; select grades only; RoHS stated as "almost all"). https://www.masterbond.com/certifications
- Master Bond Inc. "NASA Low Outgassing" (conditions and pass criteria of ASTM E595). https://www.masterbond.com/certifications/nasa-low-outgassing
- Master Bond Inc. "Medical Certifications" (USP Class VI, ISO 10993-4, -5 and -10; resistance to sterilisation). https://www.masterbond.com/certifications/medical-certifications
- Master Bond Inc. "USP Class VI" (the caution that compliance does not automatically mean a system can be used in a medical device). https://www.masterbond.com/certifications/usp-class-vi
- Master Bond Inc. "ISO 10993-5 for Cytotoxicity" (the caution that results are a guideline and do not guarantee FDA approval). https://www.masterbond.com/certifications/iso-10993-5-cytotoxicity-requirement
- Master Bond Inc. "UL 94V for Flame Retardancy" (grades rated UL 94V-0 and V-1). https://www.masterbond.com/certifications/ul-94v-flame-retardancy
- Master Bond Inc. "UL 746A High Amp Arc Ignition Resistance and UL 94HB" (test result for EP21AC). https://www.masterbond.com/certifications/ul-746a-high-amp-arc-ignition-resistance-and-ul-94hb-flame-retardancy
- Master Bond Inc. "MIL-STD-883J for Thermal Stability" (Method 5011, TGA per ASTM D3850-12, 1.0% or less weight loss at 200°C). https://www.masterbond.com/certifications/mil-std-883j-thermal-stability
- Master Bond Inc. "FAR 25.853(a) for Flame Retardancy" (grades passing the vertical and horizontal burn tests). https://www.masterbond.com/certifications/far-25853a-flame-retardancy
- Master Bond Inc. "IEC 61249-2-21 for Halogen Free" (chlorine and bromine at 900 ppm or less each, total 1,500 ppm or less). https://www.masterbond.com/certifications/halogen-free
- Master Bond Inc. "RoHS Compliant Systems" (the statement that all products are RoHS 3 compliant, with a reference to Directive 2002/95/EC). https://www.masterbond.com/certifications/rohs-compliant-systems
- Master Bond Inc. "The Rigors of 85°C + 85% Humidity Testing" (1,000-hour tests referring to Telcordia GR-1221, and hardness change). https://www.masterbond.com/certifications/85c-85humidity-testing
- Master Bond Inc. "Food Grade Certifications" (explanation of FDA 21 CFR 175.105 and 175.300). https://www.masterbond.com/certifications/food-grade-certifications
- Master Bond Inc. "Environmentally Friendly Adhesives" (solvent free, halogen free, no PFOA, PFOS or animal-derived ingredients). https://www.masterbond.com/properties/environmentally-friendly-adhesives
- Master Bond Inc. "Underfill Encapsulants" (CTE mismatch and stress redistribution, fillet shape, EP3UF and EP4UF-80). https://www.masterbond.com/industries/underfill-encapsulants
- Master Bond Inc. "Glob Top Epoxies" (glob top and dam-and-fill product lines). https://www.masterbond.com/industries/glob-top-epoxies
- Master Bond Inc. "Die Attach Epoxy Adhesives" (die shear strength table, product features). https://www.masterbond.com/industries/die-attach-epoxy-adhesives
- Master Bond Inc. Lab report, "Die Shear Strength of Adhesives" (independent laboratory tests based on MIL-STD-883 Method 2019). https://www.masterbond.com/articles/die-shear-strength-adhesives
- Master Bond Inc. "Lid Sealing of Electronic Packages" (comparison with seam welding, soldering and glass attachment; epoxy paste and B-staged preforms). https://www.masterbond.com/industries/lid-sealing-electronic-packages
- Master Bond Inc. "Fiber Optics Adhesive Systems" (sealing fibres into ferrules, connectors, 1,000 hours at 85°C/85% RH). https://www.masterbond.com/industries/fiber-optics-adhesive-systems
- Master Bond Inc. "Potting and Encapsulation" (uses, and compliance with UL, NASA, USP, FDA and other standards). https://www.masterbond.com/applications/potting-and-encapsulation
- Master Bond Inc. News release, "Research Announcement" (9 September 2024). Joint research with STERIS on compatibility with VHP sterilisation. https://www.masterbond.com/newsrelease/research-announcement
- Peer-reviewed paper Peer-reviewed paper, "Material compatibility of epoxies exposed to repeated low temperature vaporized hydrogen peroxide sterilization", Polymer-Plastics Technology and Materials, 2024 (DOI 10.1080/25740881.2024.2376209; bibliographic record checked through the Crossref API). https://doi.org/10.1080/25740881.2024.2376209
- Master Bond Inc. News release, EP64 (1 May 2026). https://www.masterbond.com/newsrelease/ep64
- Master Bond Inc. News release, MasterSil 981-LO (5 June 2026). https://www.masterbond.com/newsrelease/mastersil-981-lo
- Master Bond Inc. News release, UV16Med-FD (10 July 2026). https://www.masterbond.com/newsrelease/uv16med-fd
- Master Bond Inc. News release, EP55TCFL (27 August 2026). https://www.masterbond.com/newsrelease/ep55tcfl
- Master Bond Inc. News release, EP62-1HTND (1 October 2026). https://www.masterbond.com/newsrelease/ep62-1htnd
- Master Bond Inc. News release, EP3HTSDA-2Med (19 May 2025). https://www.masterbond.com/newsrelease/ep3htsda-2med
- Master Bond Inc. "Customer Testimonials" (Source Photonics, Molex, MIJA, Schick Technologies and others). https://www.masterbond.com/content/master-bond-customer-testimonials
- Master Bond Inc. Home page (a testimonial from the Nordson EFD team; source of the logo image). https://www.masterbond.com/
- Master Bond Inc. Case study, "EP114: Utilized to produce nanocomposites via vacuum infiltration" (use in research at Florida International University). https://www.masterbond.com/case-study/ep114-utilized-produce-nanocomposites-vacuum-infiltration
- Peer-reviewed paper Benedetti, Orikasa and Agarwal, "The effect of different GNP/BNNP foam structures in the infiltration of epoxy resin: A fundamental study", Polymer Composites, 2023 (DOI 10.1002/pc.28070; bibliographic record checked through the Crossref API). https://doi.org/10.1002/pc.28070
- U.S. SEC EDGAR company search for "master bond" (only an unrelated entity, Master Bond LLC, formerly Master Bond Trust, Delaware, appears; no filer matching the Hackensack company could be confirmed). https://www.sec.gov/cgi-bin/browse-edgar?company=master+bond&owner=include&count=40&action=getcompany
- ASTM International E595-15(2021) Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment (standard overview page). https://store.astm.org/e0595-15r21.html
- ISO ISO 10993-5:2009 Biological evaluation of medical devices, Part 5: Tests for in vitro cytotoxicity (standard overview page; confirmed in 2022). https://www.iso.org/standard/36406.html
- eCFR (U.S. Code of Federal Regulations) 21 CFR 175.105 Adhesives. https://www.ecfr.gov/current/title-21/chapter-I/subchapter-B/part-175/subpart-B/section-175.105
- eCFR (U.S. Code of Federal Regulations) 21 CFR 175.300 Resinous and polymeric coatings. https://www.ecfr.gov/current/title-21/chapter-I/subchapter-B/part-175/subpart-C/section-175.300
- EUR-Lex (European Union) Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS, recast, 8 June 2011). https://eur-lex.europa.eu/eli/dir/2011/65/oj
- EUR-Lex (European Union) Commission Delegated Directive (EU) 2015/863 of 31 March 2015 (adds four phthalates to the restricted substances; applied by Member States from 22 July 2019). https://eur-lex.europa.eu/eli/dir_del/2015/863/oj
- ANSI Webstore (IEC standard listing) IEC 61249-2-21 Ed. 1.0:2003, Materials for printed boards and other interconnecting structures, non-halogenated epoxide woven E-glass reinforced laminated sheets, copper-clad (description of the standard's scope). https://webstore.ansi.org/Standards/IEC/IEC6124921Ed2003
- Master Bond Inc. "Adhesives, Sealants and Coatings for Semiconductor Applications" (uses and representative products). https://www.masterbond.com/industries/adhesives-sealants-and-coatings-semiconductor-applications
14. Claim-to-source audit
| Claim in the article | Category | Source |
|---|---|---|
| Founded 1975, business, more than 3,000 grades, Technical Director's background, society memberships | Sourced | References 1 and 2 https://www.masterbond.com/content/about-master-bond https://www.masterbond.com/content/our-company |
| Head-office address, made and sold only at that site, no personal-use sales, 10 to 14 business-day lead time | Sourced | Reference 3 https://www.masterbond.com/content/how-purchase-our-products |
| Compounding to order, process not changed, lot-by-lot control of viscosity, density, colour and moisture | Sourced | Reference 2 https://www.masterbond.com/content/our-company |
| Revenue, profit, headcount, R&D spending and capital investment (not given on the website) | Not yet confirmed | Not found in References 1 and 2. This article makes no estimate https://www.masterbond.com/content/about-master-bond |
| No filer matching the company on SEC EDGAR; Master Bond LLC is a separate entity | Sourced | Reference 37 https://www.sec.gov/cgi-bin/browse-edgar?company=master+bond&owner=include&count=40&action=getcompany |
| Joint research with STERIS on VHP sterilisation (six of seven compatible, hardness loss of 2% or less, total weight gain of 2.9% or less) and the paper | Sourced | References 25 and 26 https://www.masterbond.com/newsrelease/research-announcement https://doi.org/10.1080/25740881.2024.2376209 |
| Use of EP114 in research at Florida International University, and the paper | Sourced | References 35 and 36 https://www.masterbond.com/case-study/ep114-utilized-produce-nanocomposites-vacuum-infiltration https://doi.org/10.1002/pc.28070 |
| The Nordson EFD testimonial, and customer testimonials (Source Photonics, Molex, MIJA, Schick) | Sourced | References 33 and 34 https://www.masterbond.com/content/master-bond-customer-testimonials https://www.masterbond.com/ |
| Underfill uses (CTE difference, fillet) | Sourced | Reference 18 https://www.masterbond.com/industries/underfill-encapsulants |
| Glob top and dam-and-fill product lines | Sourced | Reference 19 https://www.masterbond.com/industries/glob-top-epoxies |
| Die attach features and die shear strength (MIL-STD-883 Method 2019) | Sourced | References 20 and 21 https://www.masterbond.com/industries/die-attach-epoxy-adhesives https://www.masterbond.com/articles/die-shear-strength-adhesives |
| Lid sealing, optical fibre and potting and encapsulation uses | Sourced | References 22, 23 and 24 https://www.masterbond.com/industries/lid-sealing-electronic-packages https://www.masterbond.com/industries/fiber-optics-adhesive-systems https://www.masterbond.com/applications/potting-and-encapsulation |
| NASA low outgassing (ASTM E595) conditions and pass criteria, and the standard's definition | Sourced | References 5 and 38 https://www.masterbond.com/certifications/nasa-low-outgassing https://store.astm.org/e0595-15r21.html |
| USP Class VI and ISO 10993 compliance, the company's cautions, and the overview of ISO 10993-5 | Sourced | References 6, 7, 8 and 39 https://www.masterbond.com/certifications/medical-certifications https://www.masterbond.com/certifications/usp-class-vi https://www.masterbond.com/certifications/iso-10993-5-cytotoxicity-requirement https://www.iso.org/standard/36406.html |
| Test results for UL 94V and UL 746A | Sourced | References 9 and 10 https://www.masterbond.com/certifications/ul-94v-flame-retardancy https://www.masterbond.com/certifications/ul-746a-high-amp-arc-ignition-resistance-and-ul-94hb-flame-retardancy |
| MIL-STD-883J thermal stability, FAR 25.853(a) and 85°C/85% RH | Sourced | References 11, 12 and 15 https://www.masterbond.com/certifications/mil-std-883j-thermal-stability https://www.masterbond.com/certifications/far-25853a-flame-retardancy https://www.masterbond.com/certifications/85c-85humidity-testing |
| Description and regulation text of FDA 21 CFR 175.105 and 175.300 | Sourced | References 16, 40 and 41 https://www.masterbond.com/certifications/food-grade-certifications https://www.ecfr.gov/current/title-21/chapter-I/subchapter-B/part-175/subpart-B/section-175.105 https://www.ecfr.gov/current/title-21/chapter-I/subchapter-B/part-175/subpart-C/section-175.300 |
| RoHS (Directive 2011/65/EU and 2015/863), the halogen-free definition, PFOA and PFOS, and the inconsistent RoHS statements | Sourced | References 14, 4, 13, 17, 42, 43 and 44 https://www.masterbond.com/certifications/rohs-compliant-systems https://www.masterbond.com/certifications https://www.masterbond.com/certifications/halogen-free https://www.masterbond.com/properties/environmentally-friendly-adhesives https://eur-lex.europa.eu/eli/dir/2011/65/oj https://eur-lex.europa.eu/eli/dir_del/2015/863/oj https://webstore.ansi.org/Standards/IEC/IEC6124921Ed2003 |
| Figures for five 2026 products (EP64, MasterSil 981-LO, UV16Med-FD, EP55TCFL, EP62-1HTND) | Sourced | References 27, 28, 29, 30 and 31 https://www.masterbond.com/newsrelease/ep64 https://www.masterbond.com/newsrelease/mastersil-981-lo https://www.masterbond.com/newsrelease/uv16med-fd https://www.masterbond.com/newsrelease/ep55tcfl https://www.masterbond.com/newsrelease/ep62-1htnd |
| Figures for EP3HTSDA-2Med (silver filler particle size, thermal conductivity) | Sourced | Reference 32 https://www.masterbond.com/newsrelease/ep3htsda-2med |
| Semiconductor uses and representative products | Sourced | Reference 45 https://www.masterbond.com/industries/adhesives-sealants-and-coatings-semiconductor-applications |
| Master Bond's placement among the three types (UV-curing & specialty primary, semiconductor & electronic materials secondary) | Our calculation | This article's own classification. Companies named are examples from this series |
| Plans for a new plant, expansion, revenue targets, M&A and overseas sites | Not yet confirmed | Not given on the website https://www.masterbond.com/content/about-master-bond |
| M&A, investments, joint ventures, joint research with universities and public funding | Not yet confirmed | Not found in References 1 and 2. This article does not claim they do not exist https://www.masterbond.com/content/our-company |
| The reading that building up standards-compliant grades is the centre of its product strategy | Inference | This article's interpretation of the certifications page and releases https://www.masterbond.com/certifications |
| The reading that making to order avoids holding stock and keeps shelf life long | Inference | This article's interpretation of the purchase page https://www.masterbond.com/content/how-purchase-our-products |
| The reading that changing a formulation could void compliance already obtained | Inference | This article's own interpretation. The company does not give the reason https://www.masterbond.com/content/our-company |
| The reading that the range of standards-compliant grades has itself become a sales strength | Inference | This article's interpretation of the contents of five 2026 releases https://www.masterbond.com/newsrelease/ep64 |
Last updated 3 October 2026 / Troy Technical
The facts in this article rest on Master Bond Inc.'s website (company profile, how to buy, the certification and standards pages, application pages, news releases), the official pages of ASTM, ISO, eCFR and EUR-Lex, and bibliographic records of peer-reviewed papers checked through Crossref. We did not check the text of the UL standards, the military standard, Telcordia GR-1221 or FAR 25.853, and cite Master Bond's descriptions of them. Product performance values are those published by the company (manufacturer's stated values). No research-firm estimates or press-based figures have been used. Passages marked "Inference" are this article's interpretation of primary sources, not statements made by the company.