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Sumitomo Bakelite Unveils Novel Low-Stress Epoxy Compound for Next-Gen 2.5D/3D Packaging
SEMI Europe Conference News Japan Overview Sumitomo Bakelite has announced a groundbreaking epoxy molding compound (EMC) at SEMI Europe, specifically engineered for the intricate demands of 2.5D and 3D advanced packaging solutions. This ... -
DELO’s Breakthrough UV Adhesive Optimizes LiDAR Performance for Autonomous Vehicles
DELO Industrial Adhesives Press Release Germany Overview DELO has introduced a novel high-precision, UV-curable adhesive designed to revolutionize the assembly of advanced LiDAR sensors for autonomous vehicles. This innovative material f... -
Fraunhofer IPA Engineers a ‘Smart’ Adhesive to Revolutionize Automotive Recycling
Fraunhofer IPA Research Highlights Germany Overview Researchers at Fraunhofer IPA have developed a groundbreaking epoxy-based debondable structural adhesive for automotive applications. This innovation allows for the clean, on-demand dis... -
DuPont Unveils High-Performance, Silicone-Free Thermal Gap Filler for Next-Gen EV Battery Packs
DuPont Transportation & Industrial Press USA Overview DuPont has introduced an advanced silicone-free thermal gap filler material engineered to significantly improve thermal management in next-generation electric vehicle (EV) battery pac... -
Heraeus Unleashes Pressureless Silver Sintering Pastes to Propel High-Power SiC Modules in EV Inverters
Heraeus Electronics News Germany Overview Heraeus has introduced two advanced silver sintering pastes designed to revolutionize die attachment for high-power Silicon Carbide (SiC) modules, particularly within electric vehicle (EV) invert... -
Namics Introduces Ultra-Fine-Pitch Underfill to Bolster HBM Reliability for AI and HPC
Namics News & Events Japan Overview Namics has launched a novel capillary underfill material engineered for the extreme fine-pitch flip-chip interconnections vital to High Bandwidth Memory (HBM) stacks. This innovation addresses critical... -
Henkel Unveils Advanced EMC to Tackle Warpage and Thermal Challenges in Next-Gen AI Processors
Henkel Corporate Press Release Germany Overview Henkel has introduced a novel epoxy molding compound (EMC) engineered specifically for high-performance AI and HPC processors. This innovative material significantly reduces thermal-induced... -
Permatex Launches New Clear RTV Silicone Multi-Purpose Adhesive Sealant with Superior Water Resistance and Flexibility
AutoZone USA Overview Permatex has introduced a 3oz multi-purpose clear RTV silicone adhesive sealant, designed for sealing, bonding, repairing, mending, and securing a wide array of materials including glass, metal, plastics, fabric, vi... -
Henkel Launches LOCTITE ABLESTIK CDF900 Series: Next-Gen Conductive Die Attach Film Achieving Over 8 W/m-K Thermal Conductivity for AI, 5G/6G, and HPC
Henkel Germany Overview Henkel Adhesive Technologies unveiled its LOCTITE ABLESTIK CDF900 series, a next-generation conductive die attach film (cDAF) offering thermal conductivity exceeding 8 W/m-K, at SEMICON Taiwan 2026. This advanced ... -
Advanced Adhesive Sheet Revolutionizes EV Battery Thermal Management for Enhanced Longevity and Safety
Techno-Frontier 2026 Japan Overview A Japanese company has introduced an innovative, highly thermally conductive adhesive sheet engineered to significantly improve electric vehicle (EV) battery cooling performance. This technology ensure...
