Market Trends– category –
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FAA Proposes Waiving 13 Federal Environmental Laws to Streamline Commercial Space Licensing
HSToday USA Overview The U.S. Federal Aviation Administration (FAA) has proposed a rule change to waive requirements from 13 federal environmental laws, aiming to significantly streamline the commercial space licensing process. This move... -
China’s Commercial Space Sector Surges to 600 Companies Post-2014 Reforms, Reshaping Global Space Economy
Center for Strategic and International Studies (CSIS) Report China Overview China's commercial space sector has rapidly expanded to approximately 600 companies since private investment was opened in 2014. This growth spans launch service... -
Silicon Box Ships Over 500 Million Chiplet Packages from Singapore, Scaling Manufacturing Output
Digital Journal (PR-Zen) Singapore Overview Singapore-based advanced packaging company Silicon Box announced it has shipped over 500 million chiplet packages. This marks a significant milestone demonstrating the company's manufacturing c... -
TrendForce Analyzes: 18 Chinese Enterprises Accelerate Positions in Glass Core Substrate Market
TrendForce Taiwan Overview TrendForce reported that 18 Chinese companies are rapidly enhancing their presence in the glass core substrate market for advanced packaging. This movement is part of China's strategy to achieve supply chain au... -
South Korea Unveils Major Investment Plan to Boost National Competitiveness in Advanced Packaging
Maeil Business Newspaper (MK.co.kr) South Korea Overview The South Korean government announced a large-scale investment plan to enhance national competitiveness in advanced packaging. This strategy aims to meet surging demand for AI and ... -
ASE Technology Raises 2026 CapEx to Record US$10.5 Billion, Targets 2x Advanced Packaging Revenue by 2027
TrendForce Taiwan Overview TrendForce reports that ASE Technology Holding, the world's largest OSAT company, plans to raise its 2026 capital expenditure (CapEx) to a record US$10.5 billion. The company aims to double its revenue from adv... -
TrendForce Reports TSMC Expanding CoWoS Front-End Outsourcing to OSATs Amid Surging NVIDIA ASIC Demand
TrendForce Taiwan Overview TrendForce reports that TSMC is reportedly expanding the outsourcing of key front-end processes for its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging to OSATs (Outsourced Semiconductor Assembly and Test... -
Glass Substrates Emerge as AI Packaging Game-Changer, Igniting Global Race Towards Mass Production as China and Japan Intensify Competition for Yield Stabilization
The Economy South Korea Overview As AI semiconductor competition shifts from process-node miniaturization to advanced packaging, China and Japan are intensifying efforts to lead the glass core substrate market, a cornerstone for next-gen... -
Enzene Unveils New “NeX” Partnership Model to Expand Global Biologics Manufacturing: Cutting Capital Costs and Accelerating Facility Deployment
PharmaSource India Overview Enzene Biosciences Limited has launched "NeX," an end-to-end partnership model designed to help governments, institutions, and biopharmaceutical companies establish local biologics manufacturing capabilities. ... -
Resilience and Eli Lilly Invest $750 Million to Boost U.S. Medicine Supply, Expanding Biologics, Cell Therapy, and Aseptic Manufacturing
Resilience USA Overview Resilience has announced a $750 million investment in new pharmaceutical manufacturing in Ohio, expanding its strategic partnership with Eli Lilly to bolster the U.S. medicine supply. Resilience operates as a comp...
