Semiconductor Back-End– category –
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TSMC Moves to Large-Format Glass Substrates with CoPoS to Address CoWoS Capacity for AI Chips, Targeting 2028-2029 Mass Production
36Kr, Semiconductor Industry Watch, AI Weekly Taiwan Overview TSMC has launched a pilot line for its CoPoS (Chip-on-Panel-on-Substrate) advanced packaging at Taiwan's VisEra, aiming to alleviate the critical CoWoS capacity bottleneck for... -
2.5D Packaging and HBM Integration Accelerate for AI Accelerators: TSMC CoWoS and Samsung I-CubeS Drive Towards 5.5x Reticle Sizes by 2026
Econ Market Research Global Overview The adoption of HBM-integrated 2.5D packaging for AI accelerators is rapidly expanding, with TSMC and Samsung spearheading the technological advancements. TSMC's CoWoS platform now supports silicon in... -
SEMICON West Relocates to Phoenix, Arizona, Bolstering U.S. Semiconductor Hub with TSMC’s $100 Billion Advanced Fab Plans
Arizona Commerce Authority USA Overview SEMI announced the permanent relocation of SEMICON West to Phoenix, Arizona, adopting an annual spring schedule from March 30 – April 1, 2027. This move reflects Arizona's rapid expansion as a semi... -
Intel Accelerates Next-Gen AI Semiconductor Development in U.S. Fabs with Foveros and Enhanced EMIB-T Packaging
Intel USA Overview Intel is aggressively advancing next-generation AI semiconductor development in its U.S. fabs by leveraging cutting-edge advanced packaging technologies such as Foveros stacking, EMIB silicon bridges, and particularly ... -
AI Chip HBM Integration to Drive 29% ABF Substrate Shortage by 2028; $19.1B Expansion Unlikely to Offer Short-Term Relief
Unknown Taiwan Overview The rapid integration of High Bandwidth Memory (HBM) into AI chips is set to drive a 39% Compound Annual Growth Rate (CAGR) in ABF substrate demand between 2025 and 2028. This surge is projected to create a supply... -
ASE Technology Ups 2026 Capex to Record $10.5 Billion, a 23.5% Increase, Driven by Surging AI Packaging Demand
Digitimes Taiwan Overview ASE Technology Holding, the world's largest semiconductor packaging and test provider, increased its 2026 capital expenditure plan by 23.5% to a record $10.5 billion from an initial $8.5 billion, responding to s... -
Intel’s EMIB Dominates AI Packaging with Google Adoption, Prompting TSMC to Develop Similar Tech Amidst CoWoS Constraints
Benzinga USA Overview Intel's EMIB technology is establishing a significant competitive advantage in advanced chip packaging for AI workloads, exemplified by Google's adoption of EMIB-T in its 9th-generation TPUs. Facing CoWoS capacity f... -
Malaysia Invests US$45 Million to Propel Advanced Chip Packaging, Targeting HBM4 Domestic Proof-of-Concept
Asia News Network Malaysia Overview Malaysia announced a 185 million ringgit (approx. US$45 million) investment into semiconductor projects to boost its advanced chip packaging capabilities for AI, data centers, and high-performance comp... -
Besi Achieves Record €292.9M Orders in Q2 2026, Driven by AI Demand and 128.8% Growth in Hybrid Bonding Technology
ET Electronics News Netherlands Overview BE Semiconductor Industries (Besi) reported record Q2 2026 orders of €292.9 million, a 128.8% increase year-over-year, primarily fueled by robust AI-related demand and the surging adoption of its ... -
NCF Evolves into Essential Material for AI Chips, HBM Stacking, and Advanced Packaging, Ensuring Stable Bonding and Enhanced Reliability
LP Information Data Global Overview Non-Conductive Film (NCF) has evolved from an auxiliary adhesive to an indispensable material in advanced packaging, driven by rapid advancements in AI servers, accelerated computing chips, High-Bandwi...
