Semiconductor Back-End– category –
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NVIDIA Accelerates Feynman AI Platform; TSMC Ramps SoIC Capacity to 50K Wafers/Month by 2027
Benzinga Taiwan Overview NVIDIA is expediting the roadmap for its next-generation Feynman AI platform, prompting TSMC to significantly boost its advanced packaging capabilities. TSMC is rapidly expanding its SoIC technology production, a... -
TSMC Achieves Over 98% CoWoS Yield; ABF Substrates Emerge as Next Bottleneck for AI Chip Expansion
Xenospectrum Taiwan Overview TSMC has announced that its advanced CoWoS packaging technology, particularly for 5.5x reticle AI chip products, consistently achieves yields exceeding 98%. While CoWoS capacity has doubled annually for three... -
Semiconductor Back-End Weekly Report August 9, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report August 09, 2026 (PDF) — Download Weekly Report August 09, 2026 (PDF) — DownloadDownload 🎙 Podcast August 09, ... -
TSMC CoWoS Advanced Packaging Becomes Critical Bottleneck in AI Chip Supply, Sold Out Through 2026
Tech Times USA Overview The bottleneck in AI chip production has shifted from silicon manufacturing to advanced packaging, specifically TSMC's CoWoS technology, with capacity fully booked until the end of 2026. A severe shortage of ABF s... -
Silicon Box Ships Over 500 Million Chiplet Packages from Singapore, Scaling Manufacturing Output
Digital Journal (PR-Zen) Singapore Overview Singapore-based advanced packaging company Silicon Box announced it has shipped over 500 million chiplet packages. This marks a significant milestone demonstrating the company's manufacturing c... -
Supercomputing News Emphasizes Critical Role of Advanced Packaging (CoWoS, EMIB, T-AI) in AI Accelerators
Supercomputing News Global Overview Supercomputing News published an analytical article emphasizing the critical role of advanced packaging technologies like CoWoS, EMIB, and T-AI in enhancing AI accelerator performance. These technologi... -
TrendForce Analyzes: 18 Chinese Enterprises Accelerate Positions in Glass Core Substrate Market
TrendForce Taiwan Overview TrendForce reported that 18 Chinese companies are rapidly enhancing their presence in the glass core substrate market for advanced packaging. This movement is part of China's strategy to achieve supply chain au... -
South Korea Unveils Major Investment Plan to Boost National Competitiveness in Advanced Packaging
Maeil Business Newspaper (MK.co.kr) South Korea Overview The South Korean government announced a large-scale investment plan to enhance national competitiveness in advanced packaging. This strategy aims to meet surging demand for AI and ... -
ASE Technology Raises 2026 CapEx to Record US$10.5 Billion, Targets 2x Advanced Packaging Revenue by 2027
TrendForce Taiwan Overview TrendForce reports that ASE Technology Holding, the world's largest OSAT company, plans to raise its 2026 capital expenditure (CapEx) to a record US$10.5 billion. The company aims to double its revenue from adv... -
TrendForce Reports TSMC Expanding CoWoS Front-End Outsourcing to OSATs Amid Surging NVIDIA ASIC Demand
TrendForce Taiwan Overview TrendForce reports that TSMC is reportedly expanding the outsourcing of key front-end processes for its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging to OSATs (Outsourced Semiconductor Assembly and Test...
