Semiconductor Back-End– category –
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Co-Packaged Optics (CPO) Demand Reshapes AI Chip Supply Chains, Shifting Towards Higher Bandwidth and Lower Power Consumption
Astute Group UK Overview The surging demand for Co-Packaged Optics (CPO) is fundamentally reshaping semiconductor manufacturing priorities across advanced packaging and AI processor supply chains. As AI clusters increasingly require high... -
SK Hynix Reapproves 7.1 Trillion Won Investment for Cheongju P&T7, Significantly Bolstering Advanced Packaging Capacity for HBM and AI Memory
The Elec South Korea Overview SK Hynix has reapproved a 7.1 trillion won (approximately $5.5 billion) investment for its Cheongju P&T7 project, aiming to significantly bolster its advanced packaging capacity for AI memory products, i... -
PM Modi Inaugurates Kaynes Semicon’s ₹33 Billion OSAT Facility in Gujarat, Targeting 2.3 Billion Chips Annually and 5,000 Jobs
YouTube (ANI News) India Overview Indian Prime Minister Narendra Modi announced the inauguration of Kaynes Semicon's OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat, which commenced commercial production on ... -
South Korean Semiconductor Giants Samsung and SK Hynix Plan $518 Billion Mega-Investment to Double DRAM Production, Reshaping AI Chip Market
CoinDesk South Korea Overview South Korean semiconductor giants Samsung Electronics and SK Hynix have announced massive investment plans totaling approximately $518 billion (about 80 trillion JPY) over the next five years. This capital w... -
HBM Shortage Accelerates ‘Chipflation,’ TrendForce Forecasts New Normal Driven by Unabating AI Demand
The Korea Economic Daily South Korea Overview Surging AI infrastructure demand is driving up memory chip prices, straining cloud providers' profit margins. Market research firm TrendForce predicts that the HBM (High-Bandwidth Memory) sho... -
India’s Semiconductor Ecosystem Rapidly Expanding: Government Commits ₹1.275 Trillion for Semicon 2.0, First ATMP/OSAT Facility Operational
Asia Briefing India Overview India's semiconductor manufacturing ecosystem is rapidly expanding in 2026, with 13 approved semiconductor projects currently operational or under development, including the launch of the first ATMP/OSAT faci... -
South Korea’s JNTC and Japan’s TOPPAN Announce Partnership for AI Chip Glass Substrate Technology, Overcoming Organic Substrate Limits for Next-Gen Packaging
Tai (via Semiconductor News) South Korea Overview South Korea's JNTC and Japan's TOPPAN have forged a strategic partnership for next-generation glass substrate technology aimed at AI chips. As advanced packages integrating AI accelerator... -
Indian State of Madhya Pradesh Signs MoU for ₹6,200 Crore OSAT Facility with Paras Semiconductors, Advancing Heterogeneous Integration and 3D Packaging
ET Government India Overview The government of Madhya Pradesh, India, announced a Memorandum of Understanding with Paras Semiconductors to establish an advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly and Test) fa... -
Nvidia Secures $1.5 Billion Advanced Packaging Deal with Amkor, Diversifying Supply Chain and Easing TSMC CoWoS Bottlenecks
TradingKey USA Overview Nvidia and Amkor Technology have signed a multi-year packaging services agreement valued at approximately $1.5 billion. This pivotal deal is a strategic move for Nvidia to reduce its reliance on TSMC's CoWoS packa... -
Powertech Technology and Broadcom Establish $400 Million Singapore FOPLP Joint Venture for AI ASICs Manufacturing
DigiTimes Taiwan Overview Powertech Technology (PTI) has approved a $400 million investment in a joint venture with Broadcom in Singapore to build Fan-Out Panel-Level Packaging (FOPLP) manufacturing capacity. This strategic move aims to ...
