Semiconductor Back-End– category –
-
Samsung Delays Hybrid Bonding HBM Mass Production to 2029-2030, Aligning with Technical Challenges and NVIDIA’s Next-Gen GPUs
TrendForce South Korea Overview Samsung Electronics is reportedly delaying the full-scale mass production of its hybrid bonding technology for next-generation HBM and logic semiconductors until 2029-2030. The company is currently buildin... -
Besi Semiconductor Reports Doubled Quarterly Orders Driven by Soaring AI and Hybrid Bonding Demand, Expanding Customer Base
WHTC (Reuters) Netherlands Overview BE Semiconductor Industries (Besi) announced a more than twofold increase in quarterly orders year-over-year, driven by robust demand from AI, hybrid bonding, photonics, and data centers. The company's... -
Taiwan’s Grand Process Technology Partners with Germany’s Singulus to Enter Panel-Level Packaging (PLP) Market, Offering AI/HPC Solutions
Taiwan News Taiwan Overview Taiwan's Grand Process Technology Corp. announced its entry into the panel-level packaging (PLP) market through a strategic alliance with its subsidiary Challentech International Corp. and Germany's Singulus T... -
China’s HKC Invests 4 Billion RMB in New Advanced Semiconductor Packaging and Test Line in Shaoxing for Heterogeneous Integration
TrendForce China Overview China's HKC announced a 4 billion RMB ($550 million) investment in an advanced semiconductor packaging and test project in Shaoxing Economic Development Zone. A new subsidiary, Zhejiang Huaxin Advanced Semicondu... -
Yole Group Forecasts Advanced Packaging Market to Double to Over $120 Billion by 2031, Driven by AI and HPC Demand
Yole Group (via advancedpackaging.news) France Overview Yole Group's latest report projects the global advanced packaging market to more than double from $55 billion in 2025 to over $120 billion by 2031, fueled by next-generation AI and ... -
TSMC Pledges Additional $100 Billion for Arizona Fabs, Total U.S. Investment Reaches $265 Billion to Boost Advanced Chip Manufacturing
Supply Chain Dive USA Overview TSMC has committed an additional $100 billion to its semiconductor manufacturing and packaging facilities in Arizona, elevating its total U.S. investment to $265 billion. This expansion includes four new ad... -
AI Chip Packaging Bottleneck Intensifies: NVIDIA Explores Intel EMIB Amid TSMC CoWoS Shortage, Amkor Commits $7B to Arizona
The Economy Japan Overview The burgeoning AI chip market faces a critical bottleneck in advanced packaging, particularly with TSMC's CoWoS technology, prompting NVIDIA to reportedly consider Intel's EMIB for future GPU production. This s... -
Semiconductor Back-End Weekly Report July 19, 2026
▼ ▼ ▼ If the infographic makes you want to read the full report, please click the download button below. ▼ ▼ ▼ 📄 Weekly Report July 19, 2026 (PDF) — Download Weekly Report July 19, 2026 (PDF) — DownloadDownload 🎙 Podcast July 19, 2026 (... -
Samsung Electro-Mechanics Challenges Ibiden in AI Server Package Substrates with FC-BGA and Glass Substrate Push
MK South Korea Overview Samsung Electro-Mechanics is aggressively challenging Ibiden's dominant market share in AI package substrates by enhancing its Flip-Chip Ball Grid Array (FC-BGA) and next-generation glass substrate technologies fo... -
Micron Invests $500M in GlobalWafers Texas Plant, Targets 40% US DRAM Production by 2035
Tom's Hardware USA Overview Micron Technology has committed $500 million to GlobalWafers' Texas wafer plant, aligning with its ambitious goal to manufacture 40% of its DRAM in the United States by 2035, part of a broader $250 billion US ...
