EV Group | Company Profile

COMPANY PROFILE / NANOTECHNOLOGY

EV Group (EVG)
A privately held Austrian equipment maker whose tools press nanopatterns into resin and bond wafers together with nanometer-level alignment

EV Group (EVG) is an Austrian equipment maker known for nanoimprint lithography (NIL) and wafer bonding. It was founded in 1980 and says it has more than 1,700 employees. Nothing in its official material points to a stock market listing, and it does not publish financial results; this article treats it as privately held. The company says its SmartNIL process has production-proven resolution down to 40 nm and smaller (company statement). In May 2026, together with imec, it reported wafer-to-wafer hybrid bonding at a 200 nm interconnect pitch (a joint announcement by the company and the research institute). Revenue, sales by customer and the number of tools sold do not appear in the official material this article reviewed. This profile sets out, from the company's website and news releases, what it makes, where it invests, who it works with and which parts are results and which are plans.

Sources: the EVG official website (company profile, technologies, products, research projects) and about 30 official news releases from 2018 to 2026, used as primary material. Last updated October 2026.

What this article covers

EV Group in 30 seconds, and where it stands in nanotechnology
The logo and how the name is written
Where the company sits in the field
Scale (what is disclosed)
Resources committed to nanotechnology
What it has done so far
What comes next
What the company is aiming for in nanotechnology
Map of partnerships in nanotechnology
Technologies, products and services
The risks this company carries
Glossary, references and claim-to-source audit

1. EV Group in 30 seconds, and where it stands in nanotechnology

NAMEEV Group (EVG)The publisher named on the Imprint of the official site is EV Group Europe & Asia/Pacific GmbH (Austria). The group's ownership structure could not be confirmed

HEADQUARTERSSt. Florian am Inn,
AustriaFounded in 1980 by Aya Maria and Erich Thallner, per the company

LISTINGPrivately held (treated as)No listing is mentioned in official material. Members of the founding family sit on the management board (October 2024). The shareholder structure could not be confirmed

CATEGORY IN THIS FIELDNanofabrication & equipmentPrimary: nanoimprint (NIL) and wafer bonding. Secondary: lithography and metrology

REVENUENot disclosedNot stated in the official material reviewed. Not estimated here

EMPLOYEESMore than 1,700Worldwide, per the company (no reference date given)

LOCATIONSWholly owned subsidiaries in the U.S., Japan, Korea, China, Taiwan and SingaporeAlso Germany and a joint venture in Malaysia. A Singapore subsidiary was formed in May 2025

CORE TECHNOLOGIESSmartNIL / hybrid bondingNIL at 40 nm and below (company). A 200 nm-pitch bonding result with imec (May 2026)

The one thing to grasp first

EVG's tools do not "write" patterns with an electron beam or extreme ultraviolet light. They either press a mold (stamp) into resin to copy a nanopattern (NIL), or stack wafers and bond them together (bonding). The company says the former is used for large-area nanostructures such as augmented-reality (AR) waveguides, metalenses (lenses built from nanostructures) and microfluidic chips, and the latter for 3D stacking of chips such as AI processors Sourced. The company calls itself the market-leading NIL equipment supplier, and in bonding claims "the leading position and dominant market share", but no figures support either statement. This article reports them as company claims, not as fact. Because EVG is privately held and publishes no financial figures, the "scale" section here is limited to headcount, facility area and sites that official material confirms.

2. The logo and how the name is written

A note on names: the company is EV Group (abbreviated EVG). Legal entity names differ by country and site; the official Imprint names EV Group Europe & Asia/Pacific GmbH as publisher. SmartNIL, HERCULES, BONDSCALE, LITHOSCALE and ComBond are product and technology names, not company names. The logo was taken from the header of the company's official website (the original is white, a version for dark backgrounds).

Official site: https://www.evgroup.com/

3. Where the company sits in the field

Fig. 1 Four types of company involved in nanotechnology, and where EV Group sits. The categories are this article's own, and the company names are examples from this series Our calculation. Sites, headcount and product information come from EVG's official website and news releases (2018 to 2026).

EVG's main type is nanofabrication & equipment. The company itself lists "nanotechnology devices" among the products its equipment is used to make, and supplies equipment and processes for nanofabrication Sourced (see Reference 3 https://www.evgroup.com/company/rd-projects Reference 6 https://www.evgroup.com/products/nanoimprint-lithography). The table below arranges the processes and technologies that appear in its materials.

Process / technology	Role in nanofabrication	Figures and uses given by the company (company statements)	Type
Nanoimprint (SmartNIL)	A soft stamp presses a nanopattern into UV-curable resin. A room-temperature process; the stamp is reused	Production-proven resolution of 40 nm and below. Wafers up to 300 mm, and panels. Uses: AR waveguides, diffractive optical elements, metalenses, microfluidic chips, wire-grid polarizers	Sourced (company statement)
Step-and-repeat (master fabrication for NIL)	A small master mold is stamped repeatedly to build a large-area master	The EVG770 NT scales to 300 mm wafers and Gen-2 panels. A contract mastering service (S&R Mastering Shop) is also offered	Sourced
Hybrid and fusion bonding	Bonds the dielectric layers and copper pads of two wafers, connecting them mechanically and electrically. A core step in 3D stacking	Alignment better than 100 nm (company description). Connection pitch below 1 µm. In May 2026, with imec, a 200 nm pitch, and post-bond overlay below 40 nm for all dies across a full 300 mm wafer	Sourced (joint release by the company and imec)
IR LayerRelease	An infrared laser releases an ultra-thin layer from a silicon carrier with nanometer precision	Removes the need for glass carriers in advanced packaging, and the company says it can transfer thin layers for next-generation transistor structures such as CFET	Sourced (company statement)
Lithography and metrology (secondary)	Maskless exposure (LITHOSCALE), resist processing, and bonding overlay metrology (EVG40 D2W)	LITHOSCALE XT: up to 5x the throughput of the previous model (company claim). EVG40 D2W measures the shift of every die on a 300 mm wafer	Sourced (company statement)

4. Scale (what is disclosed)

EVG's revenue, profit, total assets and order backlog are not published in the official material this article reviewed Not yet confirmed. The table is therefore limited to indicators that official sources confirm: headcount, facilities and sites.

Indicator	Value	Note
Founded	1980	By Aya Maria and Erich Thallner, per the company
Employees	More than 1,700	Worldwide; no reference date. In October 2024 the company said it planned to hire well over 100 people in the financial year then under way
Financial year	Starts on 1 October	The 24 October 2024 release says the "current financial year began on October 1, 2024"
Production area at headquarters	More than 8,100 m²	The Manufacturing V building, completed in November 2023, added more than 1,200 m² of production floor (total over 8,100 m²) and more than 1,200 m² of warehouse space
Test rooms at headquarters	About 2,800 m²	An existing building was converted at the same time, adding nine test rooms and raising test room area by 30% (also used by customers for acceptance inspection of equipment)
Cleanrooms	About 620 m² added by Cleanroom V	Completed in July 2020; the company said it nearly doubled the cleanroom capacity at headquarters. The investment was €30 million (announced in 2019)
Sites	Wholly owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan and Singapore	U.S. sites in Arizona, New Mexico and Oregon; Japan in Yokohama and Fukuoka. Also Germany (Neuhaus), Malaysia (Penang; joint venture), and sales representatives in places such as Israel and Beijing
Certifications	ISO 9001 (first certified in 2004); environmental management system under ISO 14001	Company statement

A caution

Expressions such as "market-leading" and "dominant share" are the company's own assessments, with no third-party statistics attached. The materials say EVG holds "the leading position and dominant market share" in wafer bonding and is "market-leading" in NIL, but give no share figures Not yet confirmed. The reference date of the headcount, R&D spending and order backlog could not be confirmed either.

5. Resources committed to nanotechnology

Headcount and R&D spending devoted to nanofabrication alone are not disclosed. The table covers what company-wide official material confirms.

Resource	What primary sources confirm	Type
People	More than 1,700 employees. The company planned to hire well over 100 people worldwide in the financial year starting October 2024 (October 2024 release). R&D headcount is not disclosed. The management board includes the founders Erich Thallner and Aya Maria Thallner, Werner Thallner, Paul Lindner, Hermann Waltl, and Alexander Rank (joined in October 2024)	Sourced / partly undisclosed
Money (R&D)	R&D spending is not disclosed. EVG takes part in publicly supported joint research projects (see the last row)	Not found
Money (capex)	Continuing expansion of the headquarters: €30 million announced in 2019 for the Cleanroom V building (completed July 2020); the Manufacturing III building (1,800 m² of production floor) in 2019; Manufacturing V in November 2023; and Manufacturing VI, completed by October 2024. The amounts for V and VI are not disclosed	Sourced / partly undisclosed
Equity stakes, acquisitions, joint ventures, divestments	In May 2023, a joint venture with Dymek Company in Malaysia (EV Group Malaysia Dymek, which handles customer support). In May 2025, a wholly owned subsidiary in Singapore. In 2018, an agreement to license IBM's patented laser release technology. No large acquisition or divestment was found in the material reviewed	Sourced / not found
Universities, research institutes and public funding	Joint bonding work with imec (Belgium; May 2026 release). A strategic partnership with Fraunhofer IZM-ASSID (Germany; June 2024). A memorandum of understanding with Korea's NNFC (National NanoFab Center; September 2022) and with Vietnam's Authority of Information Technology Industry and PTIT (March 2025). The Polish research center CEZAMAT installed a UV-NIL system (April 2026; funded through Poland's national recovery and resilience plan). Research projects: TRANSFORM (SiC), YESvGaN (GaN), ID2PPAC (2 nm generation), HiCONNECTS, 14AMI (CFET) and others. Amounts of public funding received were not found in the material reviewed	Sourced / partly not found

Status of main products and facilities

Product / facility	Site / content	Scale	Stage	Date	Reference
HERCULES NIL 300 mm	A NIL track system combining cleaning, resist coating and baking with SmartNIL	Unit count not disclosed. The company said it had received "multiple orders"	Announced (2019). HERCULES NIL was launched in July 2015 for volume manufacturing	11 June 2019	22, 1
HERCULES NIL 200 mm (Tekscend Photomask Japan)	The Asaka site in Niiza, Saitama. A photomask maker opening a NIL line	Supports 100 to 200 mm substrates	Introduced for prototyping. Production planned from September 2025 (Tekscend Photomask's statement). We could not confirm actual operation	July 2025	20
EVG770 NT (step-and-repeat NIL)	Large-area master fabrication	Scalable to 300 mm wafers and Gen-2 panels	Announced. A contract mastering service was launched separately	8 and 21 June 2021	23, 24
EVG7300	NIL, lens molding and lens stacking in one tool	Wafers up to 300 mm	Announced	18 January 2022	25
EVG6200 NT (CEZAMAT)	Installed at a research center of the Warsaw University of Technology	Research use	Installed	21 April 2026	12
EVG40 D2W	Overlay metrology for die-to-wafer bonding	Measures every die. Up to 15x the throughput of the earlier model (company claim)	Announced. The company says multiple systems are already installed at customers	8 September 2025	33
Manufacturing V / VI (headquarters)	St. Florian, Austria	More than 8,100 m² of production area (after V)	Completed (V in November 2023; VI by October 2024)	2023 to 2024	15, 16

Cumulative unit sales and annual production capacity are not disclosed by product.

6. What it has done so far

When	What happened	Why it matters
1980	Founded by Aya Maria and Erich Thallner	The start of a family-run company
1985 to 1992	In 1985 it developed a double-sided mask aligner with bottom-side microscopes; in 1990 it separated the alignment and bonding steps; in 1992 it introduced a production wafer bonder for volume MEMS manufacturing (all company statements)	The foundation of standard wafer-bonding practice
2007	The world's first fully automated production wafer bonding system for 300 mm wafers (company statement)	Moving to larger wafers
July 2015	Launched HERCULES NIL, taking NIL into volume manufacturing (company statement)	The start of the NIL business in earnest
March 2018	Agreed a technology license with IBM for laser debonding	Bringing in outside patents
June 2019	Unveiled HERCULES NIL 300 mm and announced construction of the Cleanroom V building (€30 million)	NIL at 300 mm; more development and pilot capacity
March to July 2020	Established the Heterogeneous Integration Competence Center (March); completed Cleanroom V (July)	A place for co-development with customers
January 2021	Joint development agreement with ASM Pacific Technology on die-to-wafer bonding	Bonding for chiplets
June 2021	Announced the EVG770 NT (step-and-repeat NIL) and launched a mastering service	Large-area NIL masters
January and September 2022	Announced the EVG7300 (January). Agreed with Toppan Photomask on joint marketing of NIL for photonics (September, non-exclusive). Signed an MoU with NNFC (September)	Developing NIL uses; ties with research institutes
May and November 2023	Formed a joint venture in Malaysia (May). Completed the Manufacturing V building (November)	Wider customer support and manufacturing capacity
June and October 2024	Strategic partnership with Fraunhofer IZM-ASSID (June). Expanded the management board (October)	Bonding for quantum applications; stronger management
March to September 2025	MoU with Vietnam (March). LITHOSCALE XT (May). Singapore subsidiary (May). EVG40 D2W (September)	Wider sites; more metrology and exposure
14 October 2025	Received the "30 Years Nanoimprint Grand Achievement Award" at the NNT conference in the United States, held for the 30th anniversary of the invention of NIL (1995, by Professor Stephen Chou)	An award from the conference organizers: a third-party recognition, though not a customer evaluation
April to September 2026	Installed a UV-NIL system at CEZAMAT (April). Partnership with Xanadu on photonic quantum chips (May). Announced 200 nm-pitch bonding with imec (May). Set out its co-packaged optics work (September). Evaluated high-refractive-index resins with NTT-AT (September)	Expansion toward photonics, quantum and AI

7. What comes next

BONDING WITH IMECIntends to advance the wafer-to-wafer hybrid bonding roadmap furtherMay 2026 release. No target values or dates are given

PARTNERSHIP WITH XANADUFrom prototypes to industrial-scale photonic quantum chipsA company goal, May 2026 release. No timing is given

EVALUATION WITH NTT-ATA white paper on the results to be publishedSeptember 2026 release. To be presented at CIOE 2026 (China International Optoelectronic Exposition)

TRADE SHOWSSEMICON Europa 202610 to 13 November 2026, Munich. A booth (B1241) and two poster presentations at the APC conference

HIRINGWell over 100 hires in the financial year starting October 2024An October 2024 plan. The actual number could not be confirmed

FACILITIESContinued expansionThe company says it keeps investing in production and development capacity. No new building plan was found in the material reviewed

ID2PPAC (JOINT RESEARCH)EUV single-print volume manufacturing for the 2 nm generation by 2025The project's aim. Whether it was achieved could not be confirmed

14AMI (JOINT RESEARCH)Developing CFET for the 14 angstrom generationEVG develops bonding, layer transfer and separation for it (official page). Results could not be confirmed

All of the above are plans or intentions of the company or of joint projects Not yet confirmed. As drivers of growth, EVG names chips for AI and high-performance computing (HPC), and sensors for smartphones, gaming systems and advanced driver assistance systems (ADAS), and says demand for hybrid bonding and other tools is strong (October 2024) Sourced. No figures showing the size of this demand are published.

What we could not confirm

None of the following appears in the official material this article reviewed Not yet confirmed.

Revenue, profit and order backlog / R&D spending / cumulative unit sales and manufacturing capacity of its tools / sales by customer / the number of NIL production lines / whether Tekscend Photomask Japan actually started NIL production / the amount of public funding received / the effect of export controls or other regulation on sales.

8. What the company is aiming for in nanotechnology

This section separates what the company says directly from what this article reads into it. Inference marks this article's own interpretation of primary sources.

What can be read	Primary source behind it	Type
Open markets early by exploring new techniques first	The vision on the official site is "to be the first in exploring new techniques and serving next-generation applications of micro- and nanofabrication technologies"	Sourced (company statement)
It is widening NIL from MEMS, optics and biotech toward semiconductor-related uses (optical I/O, CPO)	The NIL product page lists bioMEMS, microfluidics and optical elements. The September 2026 release says EVG addresses co-packaged optics (CPO) manufacturing challenges by combining NIL and direct bonding	Sourced
It promotes hybrid bonding as a way to keep scaling through 3D stacking for AI and HPC	November 2023 release: demand from AI, HPC and other applications has turned fusion and hybrid bonding into "the new scaling mechanism"	Sourced (company statement)
It draws up roadmaps jointly with research institutes and lets them shape its next-generation tools	The joint release with imec, and participation in projects such as 14AMI (CFET) and ID2PPAC (2 nm generation)	Sourced / Inference (the effect on tool specifications)
It places sites close to customers	The Singapore subsidiary (May 2025), the Malaysian joint venture (May 2023), and the 30th anniversary of its Arizona subsidiary (September 2025)	Sourced

One inference, explained in more detail

The reading that "EVG is moving the uses of NIL toward optics, quantum and semiconductor packaging" rests on the sequence of its 2026 announcements. CEZAMAT in April (UV-NIL for photonic circuits), Xanadu in May (bonding for photonic quantum chips), and NTT-AT (resin for AR waveguides) and CPO (co-packaged optics) in September all tie NIL and bonding to optical device manufacturing Sourced. Meanwhile, the material this article reviewed contains no statement that NIL is used to pattern the circuits of logic chips themselves. This article therefore reads the aim of NIL as large-area nanostructures in optics and photonics, not a replacement for leading-edge logic patterning Inference Not yet confirmed.

9. Map of partnerships in nanotechnology

Fig. 2 Partnerships of EVG in nanotechnology. Sources: EVG's official website and news releases (2021 to 2026). The figure shows only some of the relationships stated in official material; others, such as Toppan Photomask (joint NIL marketing, 2022), IBM (license, 2018), NNFC (MoU, 2022) and CEZAMAT (equipment installation, 2026), are in the tables in Sections 5 and 6. The material reviewed names very few major customers.

10. Technologies, products and services

EVG's products are production equipment installed in customers' cleanrooms, together with process development services at its headquarters and elsewhere Sourced. The table below lists what the company's material says. Performance figures are manufacturer's stated values; where measurement conditions are not published, this article says so.

Product group	What the material says	Reference
Nanoimprint (SmartNIL, HERCULES NIL, EVG7300)	SmartNIL is a full-field UV imprint process using a soft stamp that can be reused many times. It is a room-temperature process, can imprint over topography and supports alignment, and the company calls the materials platform "open". HERCULES NIL is a 300 mm track system that includes cleaning, coating and baking. The EVG7300 combines NIL, lens molding and lens stacking in one tool	5, 22, 25
Hot embossing systems	A heat-and-press method built on the company's wafer bonding technology, described as offering high replication accuracy	6
Hybrid and fusion bonding (GEMINI FB, BONDSCALE)	In fusion bonding, dielectric layers are pre-bonded at room temperature and ambient pressure, then converted to covalent bonds by annealing. Hybrid bonding adds copper pads so that the bond is also electrical. Alignment is better than 100 nm and connection pitch below 1 µm (company description). Main uses: CMOS image sensors, memory and 3D system-on-chip	7, 8
IR LayerRelease (EVG880)	Uses the fact that an infrared laser passes through silicon to release a thin layer from an inorganic release layer with nanometer precision. The company says it avoids glass carriers (organic adhesives are limited to processes below about 300°C)	9
Die-to-wafer bonding and its metrology (EVG40 D2W)	For chiplet and HBM stacking. The company says the EVG40 D2W measures the shift of every die on a 300 mm wafer and delivers up to 15x the throughput of the earlier EVG40 NT2	33
Maskless exposure and resist processing (LITHOSCALE, EVG120 and others)	The company says the LITHOSCALE XT, with up to six exposure units and a dual-wavelength laser source, delivers up to 5x the throughput of the earlier LITHOSCALE. For advanced packaging, interposers and panels	34
Process development services	At the NILPhotonics Competence Center and the Heterogeneous Integration Competence Center, customers validate tools and processes before moving to production. Contract fabrication of large-area masters (S&R Mastering Shop) is also offered	36, 24, 14

A materials engineer's view: stamp and resin release, inorganic release layers, and bond-interface activation

The company's material points to three places where materials matter. (1) NIL stamp and resin: in the evaluation with NTT-AT, a UV-curable high-refractive-index resin (NH762 from the NH700 series) combined with EVG's working stamp material (EVG NIL UV/AS5) replicated 350 nm line-and-space structures with high fidelity, and 45° slanted gratings and meta-optical elements with minimum features of 65 nm, without defects or deformation. After 25 consecutive imprints, the pattern height changed by about 2.2%, given as an indicator of release behavior and dimensional stability Sourced. This is the result for one resin and stamp combination and does not necessarily carry over to other materials. (2) Inorganic release layers: IR LayerRelease releases layers with an infrared laser and an inorganic layer instead of an organic adhesive. The company says organic adhesives are limited to processes below about 300°C, which keeps them to back-end uses Sourced. (3) Bond interfaces: fusion bonding activates functional groups on the surface, pre-bonds through hydrogen bonds, and converts them to covalent bonds by annealing. In hybrid bonding with copper pads, the state of the dielectric and copper surfaces and the copper density (a 25% design density in the imec result) appear to bear on yield Inference. For the basics, see our explainers on self-assembly and nanoimprint, lithography and EUV, and nanometrology.

11. The risks this company carries

Risk	What it involves	Type
Opaque finances	Revenue, profit, debt and order backlog are not published, so financial stability and capacity to invest cannot be assessed from official material. This article does not estimate them	Sourced (not found)
Dependence on AI and HPC demand	The company names AI and HPC chips and sensors (smartphones, ADAS) as growth drivers. If investment in these areas changes, demand for bonding tools can change with it	Sourced / Inference
Pace at which NIL markets develop	The main NIL uses are new markets such as AR waveguides, meta-optics and biotech. The company calls NIL the "most promising and cost-effective" route to nanoscale patterns, but gives no market size figures	Sourced (company claim) / Inference
Limited disclosure of customers and adoption	The customers named in the company's material are mainly research institutes and a photomask maker. The adoption status of production lines could not be confirmed	Sourced (not found)
Reliance on outside technology	Part of its laser release technology draws on a license from IBM (2018). The license terms are not disclosed	Sourced
Geopolitics and regulation	Wholly owned subsidiaries operate in China, Taiwan and South Korea. The specific effects of export controls and similar measures could not be confirmed	Sourced / not found
Concentrated management	Members of the founding family sit on the management board (October 2024). The shareholder structure and succession policy could not be confirmed	Sourced / Inference
Delivery of plans	The imec bonding roadmap, the move to production with Xanadu and the hiring of over 100 people are all plans or intentions of the company, and their achievement has not been confirmed	Not yet confirmed

12. Glossary

Nanoimprint lithography (NIL): A technique that presses a mold (stamp) into resin to transfer a nanopattern. The pattern is copied by a mold rather than drawn with an optical system.

SmartNIL: EVG's NIL technology. It uses a reusable soft stamp and UV-curable resin.

Metalens / meta-optics: A thin lens that bends light through an arrangement of nanostructures. Studied for AR glasses and cameras.

Hybrid bonding: A technique that bonds dielectric layers and embedded copper pads at the same time, joining two wafers mechanically and electrically.

Fusion bonding: A bond made by joining the dielectric layers of wafers directly; annealing turns it into a strong covalent bond.

D2W / W2W: Bonding a die (chip) to a wafer, versus bonding wafer to wafer.

Overlay: The size of the positional shift in bonding or overlay printing. The smaller it is, the better the alignment.

Pitch: The spacing between wires or pads. The smaller the pitch, the higher the density.

CPO (co-packaged optics): Mounting the optical input and output right next to the chip, aiming to improve bandwidth and power use in data centers.

CFET: A next-generation structure that stacks two types of transistor vertically.

Educational illustration: EV Group — **Fig. 3** An image of a nanoimprint process (an AI-generated concept; it does not show actual facilities or products).

13. References

EV Group EVG official site, "About EVG". Company profile, founding, headcount, history, certifications. https://www.evgroup.com/company/about-evg
EV Group EVG official site, "Global Presence". Headquarters and subsidiary locations. https://www.evgroup.com/company/global-presence
EV Group EVG official site, "R&D Projects". International and national research projects EVG takes part in. https://www.evgroup.com/company/rd-projects
EV Group EVG official site, "Imprint". Publisher and commercial register entry. https://www.evgroup.com/imprint
EV Group EVG official site, "Nanoimprint Lithography (NIL) - SmartNIL". Description and features of the technology. https://www.evgroup.com/technologies/nanoimprint-lithography-smartnil
EV Group EVG official site, "Nanoimprint Lithography" (products). UV-NIL and hot embossing systems. https://www.evgroup.com/products/nanoimprint-lithography
EV Group EVG official site, "Hybrid and Fusion Bonding". Description of the bonding technology. https://www.evgroup.com/technologies/fusion-and-hybrid-bonding
EV Group EVG official site, "Bonding" (products). Categories of bonding systems. https://www.evgroup.com/products/bonding
EV Group EVG official site, "IR LayerRelease Technology". Layer release with an infrared laser. https://www.evgroup.com/technologies/ir-layerrelease-technology
EV Group News release "Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy" (28 May 2026). https://www.evgroup.com/company/news/detail/imec-and-ev-group-demonstrate-wafer-to-wafer-hybrid-bonding-with-200nm-interconnect-pitch-and-record-high-overlay-accuracy
EV Group News release "NTT-AT and EVG Demonstrate the Feasibility of Applying High-Refractive-Index Resins to AR Optical Devices Using the SmartNIL Process" (September 2026). https://www.evgroup.com/company/news/detail/ntt-at-and-evg-demonstrate-the-feasibility-of-applying-high-refractive-index-resins-to-ar-optical-devices-using-the-smartnil-process
EV Group News release "CEZAMAT Boosts Advanced Photonics R&D with State-of-the-Art UV Nanoimprint System from EV Group" (21 April 2026). https://www.evgroup.com/company/news/detail/cezamat-boosts-advanced-photonics-rd-with-state-of-the-art-uv-nanoimprint-system-from-ev-group
EV Group News release "Xanadu and EV Group partner to build industrial-scale photonic quantum hardware" (5 May 2026). https://www.evgroup.com/company/news/detail/xanadu-and-ev-group-partner-to-build-industrial-scale-photonic-quantum-hardware
EV Group News release "EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics" (1 September 2026). https://www.evgroup.com/company/news/detail/ev-group-addresses-critical-manufacturing-challenges-for-next-generation-co-packaged-optics
EV Group News release "EV Group Completes Construction of New Manufacturing V Building at Corporate Headquarters to Expand Production Capacity" (28 November 2023). https://www.evgroup.com/company/news/detail/ev-group-completes-construction-of-new-manufacturing-v-building-at-corporate-headquarters-to-expand-production-capacity
EV Group News release "EV Group Announces Management Board Expansion In Light Of Unabated Growth" (24 October 2024). https://www.evgroup.com/company/news/detail/ev-group-announces-management-board-expansion-in-light-of-unabated-growth
EV Group News release "EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria" (24 June 2019). https://www.evgroup.com/company/news/detail/ev-group-invests-30-million-euros-for-capacity-expansion-at-corporate-headquarters-in-austria-1561360823
EV Group News release "EV Group Completes Construction of State-Of-The-Art Cleanroom Facility at Corporate Headquarters" (20 July 2020). https://www.evgroup.com/company/news/detail/ev-group-completes-construction-of-state-of-the-art-cleanroom-facility-at-corporate-headquarters-1595234788
EV Group News release "EVG receives Grand Achievement Award for nanoimprint technology" (14 October 2025). https://www.evgroup.com/company/news/detail/evg-receives-grand-achievement-award-for-nanoimprint-technology
EV Group News item "Tekscend Photomask Japan Launches its new Nanoimprint Lithography line (NIL) Capabilities" (July 2025). Introduction of the HERCULES NIL 200mm. https://www.evgroup.com/company/news/detail/tekscend-photomask-japan-launches-its-new-nanoimprint-lithography-line-nil-capabilities
EV Group News release "EV Group and TOPPAN Photomask Join Forces to Accelerate Market Adoption of Nanoimprint Lithography for Photonics Manufacturing" (19 September 2022). https://www.evgroup.com/company/news/detail/ev-group-and-toppan-photomask-join-forces-to-accelerate-market-adoption-of-nanoimprint-lithography-for-photonics-manufacturing
EV Group News release "EV Group Brings Nanoimprint Lithography to Full-Scale Production with the First Fully Integrated 300-mm Nanoimprint Lithography Track System" (11 June 2019). https://www.evgroup.com/company/news/detail/ev-group-brings-nanoimprint-lithography-to-full-scale-production-with-the-first-fully-integrated-300-mm-nanoimprint-lithography-track-system-1560234873
EV Group News release "EV Group Unlocks Agile and Efficient Production Scaling with Next-generation Step-and-Repeat Nanoimprint Lithography System" (8 June 2021). https://www.evgroup.com/company/news/detail/ev-group-unlocks-agile-and-efficient-production-scaling-with-next-generation-step-and-repeat-nanoimprint-lithography-system
EV Group News release "EV Group Launches First-of-its-kind Step-and-Repeat Mastering Services for Nanoimprint Lithography" (21 June 2021). https://www.evgroup.com/company/news/detail/ev-group-launches-first-of-its-kind-step-and-repeat-mastering-services-for-nanoimprint-lithography
EV Group News release "New Multi-Functional Micro- and Nanoimprint Solution from EV Group Offers Unprecedented Flexibility for High-Volume Optical Device Manufacturing" (18 January 2022). https://www.evgroup.com/company/news/detail/new-multi-functional-micro-and-nanoimprint-solution-from-ev-group-offers-unprecedented-flexibility-for-high-volume-optical-device-manufacturing
EV Group News release "Korea National Nanofab Center (NNFC) and EV Group Sign Memorandum of Understanding on Cooperation in Nanotechnology and IOT Sensors" (23 September 2022). https://www.evgroup.com/company/news/detail/korea-national-nanofab-center-nnfc-and-ev-group-sign-memorandum-of-understanding-on-cooperation-in-nanotechnology-and-iot-sensors
EV Group News release "EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications" (13 June 2024). https://www.evgroup.com/company/news/detail/ev-group-and-fraunhofer-izm-assid-expand-partnership-in-wafer-bonding-for-quantum-computing-applications
EV Group News release "ASM Pacific Technology and EV Group Join Forces to Enable Industry's First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration" (29 January 2021). https://www.evgroup.com/company/news/detail/asm-pacific-technology-and-ev-group-join-forces-to-enable-industrys-first-ultra-precision-die-to-wafer-hybrid-bonding-solutions-for-3d-ic-heterogeneous-integration
EV Group News release "EV Group and IBM Sign License Agreement on Laser Debonding Technology" (14 March 2018). https://www.evgroup.com/company/news/detail/ev-group-and-ibm-sign-license-agreement-on-laser-debonding-technology-1556381389
EV Group News release "EV Group and Dymek Company Form Joint Venture Company in Malaysia to Enhance Regional Customer Support" (23 May 2023). https://www.evgroup.com/company/news/detail/ev-group-and-dymek-company-form-joint-venture-company-in-malaysia-to-enhance-regional-customer-support
EV Group News release "EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support" (19 May 2025). https://www.evgroup.com/company/news/detail/ev-group-forms-subsidiary-in-singapore-to-strengthen-local-customer-support
EV Group News release "EV Group, Vietnam's Authority of Information Technology Industry and PTIT Sign Memorandum of Understanding to Advance Vietnam's Semiconductor Capabilities" (26 March 2025). https://www.evgroup.com/company/news/detail/ev-group-vietnams-authority-of-information-technology-industry-and-ptit-sign-memorandum-of-understanding-to-advance-vietnams-semiconductor-capabilities
EV Group News release "EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration" (8 September 2025). The EVG40 D2W. https://www.evgroup.com/company/news/detail/ev-group-achieves-breakthrough-in-hybrid-bonding-overlay-control-for-chiplet-integration
EV Group News release "EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE XT" (26 May 2025). https://www.evgroup.com/company/news/detail/ev-group-brings-digital-lithography-to-heterogeneous-integration-hvm-applications-with-lithoscaler-xt
EV Group News release "EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025" (30 September 2025). https://www.evgroup.com/company/news/detail/ev-group-highlights-hybrid-bonding-lithography-and-support-for-us-semiconductor-onshoring-at-semicon-west-2025
EV Group News release "EV Group Establishes Heterogeneous Integration Competence Center" (2 March 2020). https://www.evgroup.com/company/news/detail/ev-group-establishes-heterogeneous-integration-competence-center-1583142085
EV Group EVG official website (source of the logo image). https://www.evgroup.com/

14. Claim-to-source audit

Claim in the text	Type	Reference
Founding (1980), headquarters (Austria), more than 1,700 employees, countries with subsidiaries, ISO 9001 and 14001	Sourced	Reference 1 https://www.evgroup.com/company/about-evg Reference 2 https://www.evgroup.com/company/global-presence
Publisher on the Imprint (EV Group Europe & Asia/Pacific GmbH) and the commercial register entry	Sourced	Reference 4 https://www.evgroup.com/imprint
Treating EVG as privately held, and the shareholder structure	Not yet confirmed	This article's reading from the absence of a listing in official material. No statement on the shareholder structure was found within the scope of this article's review.
Revenue, profit, order backlog, R&D spending, manufacturing capacity and cumulative unit sales	Not yet confirmed	No statement found within the scope of this article's review. Not estimated here.
SmartNIL features (production-proven resolution of 40 nm and below, room temperature, reusable soft stamp, open materials)	Sourced	Figures are the company's statement. Measurement conditions are not stated. Reference 5 https://www.evgroup.com/technologies/nanoimprint-lithography-smartnil
The company's statements that it is "market-leading" in NIL and holds the "leading position and dominant market share" in bonding	Sourced	Company claims. No share figures are given. Reference 6 https://www.evgroup.com/products/nanoimprint-lithography Reference 8 https://www.evgroup.com/products/bonding
HERCULES NIL 300 mm (track system, multiple orders) and the launch of HERCULES NIL (July 2015)	Sourced	Reference 22 https://www.evgroup.com/company/news/detail/ev-group-brings-nanoimprint-lithography-to-full-scale-production-with-the-first-fully-integrated-300-mm-nanoimprint-lithography-track-system-1560234873 Reference 1 https://www.evgroup.com/company/about-evg
EVG770 NT (scalable to 300 mm and Gen-2 panels) and the mastering service	Sourced	Reference 23 https://www.evgroup.com/company/news/detail/ev-group-unlocks-agile-and-efficient-production-scaling-with-next-generation-step-and-repeat-nanoimprint-lithography-system Reference 24 https://www.evgroup.com/company/news/detail/ev-group-launches-first-of-its-kind-step-and-repeat-mastering-services-for-nanoimprint-lithography
EVG7300 (NIL, lens molding and lens stacking)	Sourced	Reference 25 https://www.evgroup.com/company/news/detail/new-multi-functional-micro-and-nanoimprint-solution-from-ev-group-offers-unprecedented-flexibility-for-high-volume-optical-device-manufacturing
Installation of the EVG6200 NT at CEZAMAT, and funding from Poland's recovery and resilience plan	Sourced	Reference 12 https://www.evgroup.com/company/news/detail/cezamat-boosts-advanced-photonics-rd-with-state-of-the-art-uv-nanoimprint-system-from-ev-group
Tekscend Photomask Japan's introduction of the HERCULES NIL 200mm and its plan to start production from September 2025	Sourced	The plan is Tekscend Photomask's statement. Actual operation could not be confirmed. Reference 20 https://www.evgroup.com/company/news/detail/tekscend-photomask-japan-launches-its-new-nanoimprint-lithography-line-nil-capabilities
Results of the evaluation with NTT-AT (350 nm line-and-space, minimum 65 nm meta-optics, about 2.2% change over 25 imprints)	Sourced	The evaluation covers one resin and stamp combination. Reference 11 https://www.evgroup.com/company/news/detail/ntt-at-and-evg-demonstrate-the-feasibility-of-applying-high-refractive-index-resins-to-ar-optical-devices-using-the-smartnil-process
200 nm-pitch hybrid bonding with imec, overlay below 40 nm for all dies, 25% copper density	Sourced	Values from the joint release by the company and imec. Reference 10 https://www.evgroup.com/company/news/detail/imec-and-ev-group-demonstrate-wafer-to-wafer-hybrid-bonding-with-200nm-interconnect-pitch-and-record-high-overlay-accuracy
Description of hybrid and fusion bonding (alignment better than 100 nm, connection pitch below 1 µm)	Sourced	Stated values. Measurement conditions are not stated. Reference 7 https://www.evgroup.com/technologies/fusion-and-hybrid-bonding Reference 8 https://www.evgroup.com/products/bonding
Description of IR LayerRelease (infrared laser, inorganic release layer, no glass carrier, nanometer precision)	Sourced	Company description. Reference 9 https://www.evgroup.com/technologies/ir-layerrelease-technology
EVG40 D2W (overlay measurement on every die, up to 15x the earlier model, multiple systems installed at customers)	Sourced	Throughput is a company claim. Reference 33 https://www.evgroup.com/company/news/detail/ev-group-achieves-breakthrough-in-hybrid-bonding-overlay-control-for-chiplet-integration
LITHOSCALE XT (up to six exposure units, up to 5x the throughput of the earlier model)	Sourced	Company claim. Reference 34 https://www.evgroup.com/company/news/detail/ev-group-brings-digital-lithography-to-heterogeneous-integration-hvm-applications-with-lithoscaler-xt
Manufacturing V (more than 8,100 m² of production area, about 2,800 m² of test rooms), Manufacturing VI, Cleanroom V (about 620 m², €30 million)	Sourced	Reference 15 https://www.evgroup.com/company/news/detail/ev-group-completes-construction-of-new-manufacturing-v-building-at-corporate-headquarters-to-expand-production-capacity Reference 16 https://www.evgroup.com/company/news/detail/ev-group-announces-management-board-expansion-in-light-of-unabated-growth Reference 18 https://www.evgroup.com/company/news/detail/ev-group-completes-construction-of-state-of-the-art-cleanroom-facility-at-corporate-headquarters-1595234788 Reference 17 https://www.evgroup.com/company/news/detail/ev-group-invests-30-million-euros-for-capacity-expansion-at-corporate-headquarters-in-austria-1561360823
Composition of the management board, the financial year starting in October, and the hiring plan (over 100 people)	Sourced	Hiring is a company plan. The actual number could not be confirmed. Reference 16 https://www.evgroup.com/company/news/detail/ev-group-announces-management-board-expansion-in-light-of-unabated-growth
The Malaysian joint venture (May 2023) and the Singapore subsidiary (May 2025)	Sourced	Reference 30 https://www.evgroup.com/company/news/detail/ev-group-and-dymek-company-form-joint-venture-company-in-malaysia-to-enhance-regional-customer-support Reference 31 https://www.evgroup.com/company/news/detail/ev-group-forms-subsidiary-in-singapore-to-strengthen-local-customer-support
The license agreement with IBM on laser debonding (March 2018)	Sourced	License terms are not disclosed. Reference 29 https://www.evgroup.com/company/news/detail/ev-group-and-ibm-sign-license-agreement-on-laser-debonding-technology-1556381389
The joint development agreement with ASM Pacific Technology on die-to-wafer bonding (January 2021)	Sourced	Reference 28 https://www.evgroup.com/company/news/detail/asm-pacific-technology-and-ev-group-join-forces-to-enable-industrys-first-ultra-precision-die-to-wafer-hybrid-bonding-solutions-for-3d-ic-heterogeneous-integration
The partnership with Fraunhofer IZM-ASSID (June 2024), the MoU with NNFC (September 2022) and the MoU with Vietnam (March 2025)	Sourced	Reference 27 https://www.evgroup.com/company/news/detail/ev-group-and-fraunhofer-izm-assid-expand-partnership-in-wafer-bonding-for-quantum-computing-applications Reference 26 https://www.evgroup.com/company/news/detail/korea-national-nanofab-center-nnfc-and-ev-group-sign-memorandum-of-understanding-on-cooperation-in-nanotechnology-and-iot-sensors Reference 32 https://www.evgroup.com/company/news/detail/ev-group-vietnams-authority-of-information-technology-industry-and-ptit-sign-memorandum-of-understanding-to-advance-vietnams-semiconductor-capabilities
Joint marketing of NIL with Toppan Photomask (September 2022, non-exclusive)	Sourced	Reference 21 https://www.evgroup.com/company/news/detail/ev-group-and-toppan-photomask-join-forces-to-accelerate-market-adoption-of-nanoimprint-lithography-for-photonics-manufacturing
The partnership with Xanadu (May 2026)	Sourced	The goal is a company plan. No timing is given. Reference 13 https://www.evgroup.com/company/news/detail/xanadu-and-ev-group-partner-to-build-industrial-scale-photonic-quantum-hardware
Work on CPO, the Heterogeneous Integration Competence Center and the NILPhotonics Competence Center	Sourced	Reference 14 https://www.evgroup.com/company/news/detail/ev-group-addresses-critical-manufacturing-challenges-for-next-generation-co-packaged-optics Reference 36 https://www.evgroup.com/company/news/detail/ev-group-establishes-heterogeneous-integration-competence-center-1583142085
Research projects EVG takes part in (TRANSFORM, YESvGaN, ID2PPAC, HiCONNECTS, 14AMI) and their aims	Sourced	The aims are the projects' own. Achievement could not be confirmed. Reference 3 https://www.evgroup.com/company/rd-projects
The "30 Years Nanoimprint Grand Achievement Award" at the NNT conference (14 October 2025)	Sourced	Reference 19 https://www.evgroup.com/company/news/detail/evg-receives-grand-achievement-award-for-nanoimprint-technology
Growth drivers (AI and HPC, sensors, ADAS)	Sourced	Reference 16 https://www.evgroup.com/company/news/detail/ev-group-announces-management-board-expansion-in-light-of-unabated-growth Reference 15 https://www.evgroup.com/company/news/detail/ev-group-completes-construction-of-new-manufacturing-v-building-at-corporate-headquarters-to-expand-production-capacity
Whether Tekscend Photomask Japan actually started NIL production, the amount of public funding received and the effect of regulation	Not yet confirmed	No statement found within the scope of this article's review. Not estimated here.
The reading that EVG is moving NIL toward optics, quantum and packaging, and the absence in the material of any statement that NIL patterns the circuits of logic chips	Inference	This article's interpretation of the statements in the references. Reference 12 https://www.evgroup.com/company/news/detail/cezamat-boosts-advanced-photonics-rd-with-state-of-the-art-uv-nanoimprint-system-from-ev-group Reference 13 https://www.evgroup.com/company/news/detail/xanadu-and-ev-group-partner-to-build-industrial-scale-photonic-quantum-hardware Reference 11 https://www.evgroup.com/company/news/detail/ntt-at-and-evg-demonstrate-the-feasibility-of-applying-high-refractive-index-resins-to-ar-optical-devices-using-the-smartnil-process Reference 14 https://www.evgroup.com/company/news/detail/ev-group-addresses-critical-manufacturing-challenges-for-next-generation-co-packaged-optics
The reading that surface conditions at the bond interface (dielectric and copper, copper density) bear on yield	Inference	This article's interpretation of the statements in the references. Reference 7 https://www.evgroup.com/technologies/fusion-and-hybrid-bonding Reference 10 https://www.evgroup.com/company/news/detail/imec-and-ev-group-demonstrate-wafer-to-wafer-hybrid-bonding-with-200nm-interconnect-pitch-and-record-high-overlay-accuracy
EVG's type (nanofabrication and equipment) and the categories in Fig. 1	Our calculation	This article's own arrangement. Company names are examples drawn from this series.

Last updated 9 October 2026 / Troy Technical
The content of this article is based on EVG's official website (company profile, technologies, products, research projects and Imprint) and its official news releases (2018 to 2026). No research-firm estimates or press-based figures have been used. EVG does not publish financial figures, and this article does not estimate them. Passages marked "Inference" are this article's interpretation of primary sources, not statements made by the company. Company plans and targets (partnership goals, hiring, project aims) are unconfirmed forward-looking statements. Expressions such as "market-leading" are the company's own assessments, not third-party statistics.