MENU

KLA Corporation | Company Profile

Back to Technology & Company Guides

COMPANY PROFILE / SEMICONDUCTOR BACK-END

KLA Corporation
US$13.6bn of revenue from finding things, not making them

KLA is an equipment maker that specialises in inspection and metrology. With one narrow exception it does not build the tools that create circuits. It looks at what has been built and finds the defects and the dimensional drift. That is the whole business. In the back end, where chips are stacked on top of one another, a defect nobody sees turns the entire finished package into scrap, and the value of that finding work rises sharply as a result. This profile uses published material only to explain why, of the three equipment makers, KLA is the one with the most explicit back-end product line.

Sources: KLA Corporation's filings with the U.S. SEC (FY2026 Form 10-K and the press releases attached to its quarterly 8-K earnings filings), used as primary material. Last updated September 2026.

What this article covers
  1. KLA in 30 seconds
  2. The logo and how the name is written
  3. What the company actually does: the business of process control
  4. Scale: five years of revenue
  5. Company category and position in the back-end industry
  6. Sites and the countries where it manufactures
  7. Leading products and share in semiconductor back-end work
  8. Current investment plans
  9. Major corporate partners
  10. Where the company is heading in this field
  11. The risks this company carries
  12. Glossary, references and claim-to-source audit

1. KLA in 30 seconds

LEGAL NAMEKLA CorporationFormed in April 1997 as KLA-Tencor Corporation. Statutory filings now use KLA Corporation throughout
HEADQUARTERSUnited States (California)One Technology Drive, Milpitas, California 95035
FOUNDEDApril 1997 (by merger)Its predecessors began operating in 1975 (KLA Instruments) and 1976 (Tencor Instruments)
LISTINGNASDAQ
Ticker KLAC
A ten-for-one stock split took effect on 11 June 2026
FY2026 REVENUEUS$13.579bn1 July 2025 to 30 June 2026. Up 12% year on year
EMPLOYEESAbout 17,000Regular employees as of 30 June 2026, plus about 200 non-regular staff, across 18 principal locations
CATEGORYManufacturer
(inspection and metrology)
Three reporting segments, every one of which carries back-end products
LATEST QUARTERUS$3.658bnFourth quarter of FY2026. First-quarter FY2027 guidance is US$4.0bn plus or minus US$200m
The one thing to grasp first

Of the three equipment makers, KLA alone gives "Packaging Manufacturing" a line of its own in its product listing Sourced. Under it sit inspection, metrology and chemical process control tools for wafer-level packaging (WLP), panel-level packaging (PLP) and IC substrates, named model by model. In other words the back end is not something KLA does on the side of its front-end business: it has been a named business area from the start. What is not published is how much revenue it produces Not yet confirmed.

2. The logo and how the name is written

The KLA logo is a registered trademark of the company. This article does not redraw it or generate an imitation. Where it is displayed, the frame above should hold the genuine logo file taken from the official site. A logo traced by an AI model is wrong both as a trademark and as a matter of fact.

A note on style: material published before 2019 uses the old hyphenated name, KLA-Tencor. Statutory filings now use KLA Corporation consistently, but the old name survives in older documents, such as the indentures for notes issued in 2014. The three letters are always said separately, K-L-A, never run together as a word.

Official site: https://www.kla.com/

3. What the company actually does: the business of process control

The tools in a semiconductor plant divide broadly into two kinds.

KindJobDoes it touch the wafer?Examples
Process equipmentDeposits films, removes them, exposes them to light, plates themYesApplied Materials, Lam Research, ASML, Tokyo Electron
Process control equipmentLooks at the result and measures defects and dimensionsNoKLA, Onto Innovation, Hitachi High-Tech

KLA is the leading example of the second kind. It describes its business as process control and yield management solutions Sourced. Wafers, reticles (the masters used in lithography), ICs, IC substrates, printed circuit boards and packages: for every one of them, KLA sells a machine whose job is to find what has gone wrong.

There are three reporting segments Sourced.

SegmentWhat it containsFY2026 revenueShareYear on year
Semiconductor Process ControlSemiconductor inspection, metrology, chemical process control and software. The company properUS$12,244.73m90%+12%
Specialty Semiconductor ProcessVacuum deposition and etch tools under the SPTS brand. The one place where KLA does make thingsUS$584.06m4%-1%
PCB and Component InspectionBoard imaging and inspection under the Orbotech brand, and packaged-IC inspection under the ICOS brandUS$750.42m6%+21%

The shares are this article's own arithmetic Our calculation. Segment revenue excludes internal allocations and currency effects, so the three figures add up to slightly less than consolidated revenue.

One more number shapes this company's character: 23% of revenue is service income Sourced. The company describes it as arising from subscription-like arrangements. A tool is not sold once and forgotten; maintenance revenue keeps arriving for as long as the installed tool runs. FY2026 service revenue was US$3,125.94m, up 16% year on year.

A materials engineer's view: why inspection is worth so much more in the back end

In the front end, a defect found part way through a wafer costs you that one chip. In the back end, the problem surfaces after several already-good chips have been assembled into a single package. On an AI accelerator with two HBM stacks, one bad joint can send a dozen or more expensive known-good dies to the bin. The economics of checking before you stack are of a different order from the front end. The same logic holds on the materials side: voids in the underfill, incomplete mould-compound fill, thickness variation in a plated layer, none of them can be seen from outside once the package is sealed. KLA's chemical monitoring tools (QualiSurf, Quali-Fill Libra and the rest) appear in the product listing as instruments that analyse and monitor the wet chemistries used in WLP, PLP and IC substrates precisely because the demand to measure things before they disappear from view is real Sourced.

4. Scale: five years of revenue

KLA annual revenue (US$ billion) Figures in brackets are the year-on-year change; FY2024 fell as memory investment slowed 15 10 5 0 9.21 (+33%) 10.50 (+14%) 9.81 (-7%) 12.16 (+24%) 13.58 (+12%) FY2022 FY2023 FY2024 FY2025 FY2026 (ended Jun 2022) (ended Jun 2023) (ended Jun 2024) (ended Jun 2025) (ended Jun 2026) The fiscal year ends on 30 June; FY2026 ran from 1 July 2025 to 30 June 2026
Fig. 1 KLA annual revenue, FY2022 to FY2026. Source: the Form 10-K for each year. Note that the fiscal year does not line up with the calendar year; each bar carries the month in which the year ended. The year-on-year percentages in brackets are this article's own arithmetic Our calculation. Revenue fell once, in FY2024, and then grew 38% over the following two years.
Fiscal year (year end)Revenue (US$k)Net income (US$k)R&D expense (US$k)Capex (US$k)
FY2022 (30 June 2022)9,211,8833,321,8071,105,254307,320
FY2023 (30 June 2023)10,496,0563,387,2771,296,727341,591
FY2024 (30 June 2024)9,812,2472,761,8961,278,981277,384
FY2025 (30 June 2025)12,156,1624,061,6431,360,334335,259
FY2026 (30 June 2026)13,579,4764,830,7711,532,118375,945

KLA's income statement carries no operating income line; it runs straight from revenue and costs to income before taxes, so net income is shown here instead. The FY2024 decline includes a US$239.10m impairment of goodwill and intangible assets.

What stands out about this company is how profitable it is. FY2026 gross margin was 61.3% and net margin 35.6% Our calculation. A company that measures earns more than a company that makes, because a measuring tool connects directly to customer yield, a benefit that converts into money without argument. R&D expense ran at 11.3% of revenue and capital expenditure at 2.8%, which next to Applied Materials (capex at 8.0% of revenue) is a notably light footprint in its own plants Our calculation.

How the 17,000 employees break down

DimensionBreakdown
RegionAsia about 50% / United States about 31% / Europe and the Middle East about 19%
FunctionCustomer service about 27% / R&D about 27% / manufacturing about 21% / other about 21% / sales and marketing about 4%
UnionsNo employees are represented by a union, although there is a union delegation in Belgium and works councils at two German business units

As of 30 June 2026. That customer service is the same size as R&D is consistent with service income being 23% of revenue.

5. Company category and position in the back-end industry

The category is a manufacturer, of inspection and metrology equipment. What sets its back-end position decisively apart from Applied Materials and Lam Research is that all three of its segments touch the back end.

FY2026 revenue of US$13.579bn by segment The three segments differ hugely in size, but all three touch the back end Semiconductor Process Control 90% 4% 6% Semiconductor Process Control Back end: inspection, metrology and wet-chemistry control for WLP, PLP and IC substrates Specialty Semiconductor Back end: plasma dicing, plus deposition and etch process tools PCB and Component Back end: direct imaging and inspection of IC substrates, and of packaged ICs All three carry back-end products, but back-end revenue is not disclosed separately The company says only, qualitatively, that its advanced packaging business is growing strongly
Fig. 2 FY2026 revenue by segment, and the back-end products each segment carries. Source: the FY2026 Form 10-K. The shares are this article's own arithmetic Our calculation.
What could not be confirmed

KLA does not disclose its back-end (advanced packaging) revenue Not yet confirmed. The Form 10-K goes no further than three qualitative statements.

  1. "The increasing complexity and value of semiconductor packages, led by AI and HPC, is driving significant growth in our advanced packaging business" Sourced
  2. On the 12% growth of Semiconductor Process Control, the company cites strong customer adoption of its advanced packaging products as one contributing factor Sourced
  3. On the 21% growth of PCB and Component Inspection, it says the main driver was higher demand from customers investing in advanced packaging technology Sourced

Revenue by product category is disclosed, and is given below for reference Sourced. But every one of these categories contains some back-end business, and it cannot be separated out.

Product categoryFY2024FY2025FY2026FY2026 share
Wafer inspection4,333,2966,198,8156,630,81349%
Patterning (reticle and metrology)2,054,4422,196,3472,706,76320%
Service2,329,5682,683,3083,125,93923%
Specialty Semiconductor Process470,565517,201502,5194%
PCB and component inspection291,161355,891460,3203%
Other333,215204,600153,1221%

Figures in US$ thousands. The shares are as stated in the Form 10-K.

6. Sites and the countries where it manufactures

FunctionMain countriesNotes
HeadquartersUnited StatesMilpitas, California
Principal manufacturing sitesUnited States, Singapore, Israel, China, several European countriesUnlike Applied Materials, KLA also manufactures in China
Principal R&D sitesUnited States, United Kingdom, India, China, Singapore, IsraelThe UK site is the home of SPTS, the Specialty Semiconductor Process business
Sales and service sitesEvery major semiconductor manufacturing region27% of employees work in customer service

The company states explicitly that it does not allocate assets to segments, because many of its facilities support several businesses and technologies at once Sourced.

FY2026 revenue by region (US$ million) Classified by where the shipment went. China and Taiwan alone are 57% of revenue China 4,048 (29.8%) Taiwan 3,644 (26.8%) Korea 1,834 (13.5%) North America 1,757 (13.0%) Japan 915 (6.7%) Europe and Israel 727 (5.4%) Rest of Asia 654 (4.8%)
Fig. 3 FY2026 revenue by region. Source: the FY2026 Form 10-K; the shares are as stated there. China was roughly flat, which the company explains by saying that domestic Chinese chip makers kept investing in legacy nodes while export controls affected part of its leading-edge business.
A materials engineer's view: the growth in Taiwan and Korea is back-end growth

What stands out in FY2026 is Taiwan up 13.7% and Korea up 26.2% Sourced. The company attributes the Taiwanese growth to leading-edge investment in foundry and logic, memory and advanced packaging, and the Korean growth to memory customers investing to support their HBM and advanced DRAM roadmaps. Seen from the materials side, both of those are demand around interposers and HBM stacking. China, by contrast, was flat, and the company states why in plain terms. Regional revenue movements can therefore be read directly as a signal of where materials demand is migrating.

7. Leading products and share in semiconductor back-end work

The products listed under "Packaging Manufacturing"

In the product listing of the Form 10-K, KLA places a row called "Packaging Manufacturing" alongside Chip Manufacturing, Wafer Manufacturing and Reticle Manufacturing inside the Semiconductor Process Control segment Sourced. The technologies and products named there are as follows.

TechnologyHow the company describes itProducts
Wafer inspection and metrologyFor advanced wafer-level packaging. Lets packaging houses detect, resolve and monitor excursions, and so manage quality betterKronos series, Micro-SR, CIRCL-AP, irArcher series, PWG5 (with the XT option), eDR7xxxAP, OmniMap RS-xxx series
Chemical process controlAnalyses and monitors the wet chemistries used in WLP (wafer-level packaging), PLP (panel-level packaging) and IC substratesQualiSurf series, Quali-Fill Libra series, QualiLab Elite series
In-situ process controlMeasures the wafer environment, temperature among other things, directly during processingThe SensArray product family

The other two segments carry back-end products as well Sourced.

SegmentRole in the back endProducts
Specialty Semiconductor ProcessWafer processing technologies including etch, plasma dicing and deposition. Plasma dicing separates a wafer with plasma rather than a blade, and is a back-end step outrightSPTS Omega, Sigma, Delta and Osprey series; Primaxx series; Xactix series; SPTS Mosaic series; MVD series
PCB and Component Inspection (PCB side)Direct imaging, inspection, optical shaping and inkjet additive printing for the PCB and IC substrate marketsOrbotech Corus, Infinitum, Nuvogo, Diamond, Sprint and Neos series; Serena; Lumina; the Frontline product family and others
PCB and Component Inspection (component side)Inspection and metrology for quality control and yield improvement in the advanced and traditional semiconductor packaging marketsICOS F26x, ICOS Tx series, Zeta-5xx/6xx

On market share, plainly

What could not be confirmed

No primary source could be found for KLA's share of the process control market or of back-end inspection Not yet confirmed. Figures of the form "X per cent of the world process control market" are research-firm estimates, and this article does not use them. The company's own wording carries no share figure at all: it says that the strength of its competitive position in many of its served markets is primarily attributable to its advanced technology Sourced.

Three things can be stated with confidence from primary sources.

  1. In each of FY2024, FY2025 and FY2026, TSMC was the only customer above 10% of revenue Sourced. KLA is the only one of the three equipment makers that names a customer outright
  2. "Packaging Manufacturing" stands as its own row in the product listing — primary evidence that the company treats the back end as a business area in its own right Sourced
  3. The FY2026 R&D description names the development of process control and process enabling solutions for front-end semiconductors and advanced packaging as a principal activity Sourced

8. Current investment plans

FY2026 R&D EXPENSEUS$1,532.12m11.3% of revenue, up 12.6% year on year
FY2026 CAPEXUS$375.95m2.8% of revenue. Lighter than a company that builds process tools
FY2026 SHAREHOLDER RETURNSUS$3.35bnBuybacks and dividends combined. The quarterly dividend is US$0.230 a share
Q1 FY2027 GUIDANCEUS$4.0bn plus or minus US$200mA quarterly record if achieved. GAAP gross margin is guided at 61.6% plus or minus 1.0 point
This company's "investment" goes to R&D and shareholders, not to factories

Against FY2026 R&D expense of US$1,532.12m, capital expenditure was US$375.95m. Shareholder returns, meanwhile, came to US$3.35bn, more than R&D and capex combined Our calculation. This is a business that does not need large plants of its own, so the cash it earns goes to development and to shareholders. On existing capacity the Form 10-K says that it is sufficient, together with planned expansions and operational improvements, to meet current requirements and anticipated near-term growth Sourced. No plan for a new plant has been published Not yet confirmed.

9. Major corporate partners

A frank note on this section

KLA names almost no specific partners in its statutory filings Not yet confirmed. It discloses in a different style from Applied Materials, which announces named joint-research counterparties every quarter. The table below is the whole of what could be confirmed from primary sources.

CounterpartyKind of relationshipWhat the primary source says
TSMCCustomerNamed outright in the Form 10-K as the only customer above 10% of revenue in each of FY2024, FY2025 and FY2026, chiefly in the Semiconductor Process Control segment. The exact ratio and the transaction value are not disclosed
The former OrbotechAcquired brandThe Orbotech name survives across the product line of the PCB and Component Inspection segment, covering direct imaging and inspection of IC substrates
The former SPTSAcquired brandThe SPTS name carries the product line of the Specialty Semiconductor Process segment, tied to the R&D site in the United Kingdom
The former Tencor InstrumentsMerger counterpartyMerged with KLA Instruments in April 1997 to form KLA-Tencor Corporation. Tencor began operating in 1976

The companies commonly mentioned alongside KLA in the back-end supply chain, meaning the OSATs, the substrate makers and the materials suppliers, do not appear in KLA's own primary material, so this article does not treat them as partnerships Not yet confirmed.

10. Where the company is heading in this field

What is established

FactWhat it implies for the back end
The Form 10-K states that the advanced packaging business is growing significantlyThe company itself positions the back end as a growth area
"Packaging Manufacturing" exists as its own row in the product listingThe back end is a named product line, not an adjunct
PCB and Component Inspection grew 21%, driven mainly by customer investment in advanced packagingDemand for IC substrate and packaged-IC inspection is genuinely rising
Taiwan up 13.7% and Korea up 26.2%, with advanced packaging and HBM cited as the reasonsThe two regions where the back end is fought over are both growing
TSMC has been the only customer above 10% for three years runningThe company is tied directly to the buyer of the most advanced packaging
First-quarter FY2027 revenue is guided at US$4.0bn plus or minus US$200mThe company is planning on growth continuing

Outlook

Not yet confirmed Read plainly, the facts above point towards KLA's presence in the back end strengthening. The logic is simple: the more layers a package contains, the more value is locked inside it, and the more a failure costs. Inspection equipment behaves like insurance, and demand for it rises in proportion to the value of the asset it protects. Chief executive Rick Wallace said as much in the fourth-quarter release: the build-out of AI infrastructure is creating new growth opportunities in advanced packaging, where KLA's market-leading process control portfolio is well positioned Sourced.

Not yet confirmed Inspection equipment also has a structural weakness: inspection is a step you can skip. The company writes as much in its own risk factors: if changing a manufacturing process becomes very costly for customers, they may reduce their process control equipment budgets by lowering the sampling rate of inspection and metrology for certain technologies Sourced. Once yield settles, inspecting everything gives way to inspecting a sample. How far the yield of advanced packaging eventually stabilises is what sets the ceiling on this business.

11. The risks this company carries

RiskSubstanceSupporting figures or wording
Export controls on ChinaRules from the U.S. Commerce Department's Bureau of Industry and Security affect the company's ability to sell to and service Chinese customers. Entity lists, the foreign direct product rule and licensing requirements for advanced-node plants are all listedFY2026 revenue from China was US$4,048.36m, 29.8% of the total. The company states that export controls affected part of its leading-edge business
Tariffs and trade restrictionsTariffs, retaliatory trade measures, and uncertainty about the authority for tariffs, how they are implemented and how refunds work are all listed as risksSet out in the summary risk list at the head of the Form 10-K
Customer concentrationTSMC alone has been above 10% of revenue for three years running. The ratio itself is not disclosedStated in the Form 10-K Not yet confirmed
Inspection being skippedThe company states that if process changes become costly, customers may cut process control budgets by lowering inspection sampling ratesSet out in the Form 10-K risk factors. A risk peculiar to a pure-play inspection company
AI making its own products obsoleteThe company states that AI-driven design, verification and test, chiplets, advanced packaging and new materials could change inspection and metrology requirements and reduce the value of existing product lines and intellectual propertySet out in the Form 10-K risk factors. Notably, advanced packaging appears as a risk as well as an opportunity
Industry cyclicalityRevenue follows customers' capital expenditure plans, and it did fall in FY2024FY2023 US$10.496bn to FY2024 US$9.812bn, down 7% Our calculation
A materials engineer's view: what it means that AI is filed under risk

It is striking that advanced packaging sits inside the same risk paragraph as obsolescence. The company's argument is that AI-driven design and new packaging schemes may change the requirements for inspection and metrology themselves. The same thing happens on the materials side. Move from solder bumps to hybrid bonding and whole steps disappear, flux and underfill among them. A technology shift in the back end brings expanding demand and the extinction of existing products at the same moment, for equipment makers and materials makers alike. That KLA writes this down as a risk factor is, if anything, honest disclosure.

12. Glossary

Process control
Inspecting and measuring what has been manufactured, finding defects and dimensional drift, and feeding that back into the process. It does not touch the wafer.
Yield
The proportion of material put in that comes out as good product. It is the single strongest driver of semiconductor profitability.
WLP
Wafer level packaging. Building the package while the wafer is still whole, before it is diced. Processing happens on the round wafer.
PLP
Panel level packaging. Building packages on a large rectangular substrate rather than a round wafer, so that more units come off each sheet.
IC substrate
The intermediate board that carries the chip and connects it to the printed circuit board. Build-up materials such as ABF film are used in it.
Plasma dicing
Separating a wafer with plasma instead of a rotating blade. It produces less chipping and suits very thin dies.
Reticle
The master pattern loaded into a lithography tool. A defect on it makes every wafer printed from it defective.
Form 10-K
The annual report a U.S.-listed company files with the Securities and Exchange Commission. It is audited and carries legal liability for its contents.
Concept diagram showing inspection and metrology steps between the stages of a stacked package, catching defects before more layers go on (AI-generated concept image)AI-generated concept
Fig. 4 Concept diagram of where inspection and metrology sit in the back end. This is an AI-generated concept image and does not depict actual tools or plants.

13. References

  1. KLA Corporation Form 10-K for the fiscal year ended June 30, 2026 (filed with the U.S. SEC on 6 August 2026). Revenue, net income, R&D expense and capital expenditure; revenue by segment, by product category and by region; headcount and its composition; customer concentration (TSMC); the product listing including Packaging Manufacturing; sites; the stock split; dividends; and risk factors. https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
  2. KLA Corporation Fourth quarter and full year FY2026 earnings release (Form 8-K, Exhibit 99.1, 28 July 2026). Fourth-quarter revenue of US$3.658bn, full-year revenue of US$13.58bn, shareholder returns, first-quarter FY2027 guidance, the chief executive's comments and the ten-for-one stock split. https://www.sec.gov/Archives/edgar/data/319201/000031920126000024/exhibit991earningsrelease7.htm
  3. KLA Corporation Form 10-K for the fiscal year ended June 30, 2025 (filed with the U.S. SEC on 8 August 2025). Revenue, net income, R&D expense and capital expenditure for FY2025 and earlier years. https://www.sec.gov/Archives/edgar/data/319201/000031920125000024/klac-20250630.htm
  4. U.S. SEC EDGAR XBRL company facts API (CIK 0000319201). Revenue, net income, cost of revenue, R&D expense and capital expenditure for FY2022 to FY2026, as tagged in each year's Form 10-K. https://data.sec.gov/api/xbrl/companyfacts/CIK0000319201.json

14. Claim-to-source audit

Claim in the articleCategorySource
Legal name, head office address, Delaware incorporation, NASDAQ listing (KLAC)SourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
Formed in April 1997 by the merger of KLA Instruments and Tencor Instruments, which began operating in 1975 and 1976SourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
The fiscal year ends on 30 June; FY2026 ran 1 July 2025 to 30 June 2026SourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
Revenue, net income, cost of revenue, R&D expense and capex for FY2022 to FY2026SourcedReferences 4 and 3 https://data.sec.gov/api/xbrl/companyfacts/CIK0000319201.json
Year-on-year percentages, 61.3% gross margin, 35.6% net margin, R&D at 11.3% and capex at 2.8% of revenue, and the segment sharesOur calculationDerived from the figures in references 1 and 4 https://data.sec.gov/api/xbrl/companyfacts/CIK0000319201.json
Segment revenue and growth, revenue by product category and its shares, service at 23% of revenueSourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
About 17,000 employees, the regional and functional splits, and the position on unionsSourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
Revenue by region (China 29.8%, Taiwan 26.8% and the rest) and the reasons given for Taiwan up 13.7% and Korea up 26.2%SourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
TSMC as the only customer above 10% of revenue for three years runningSourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
The "Packaging Manufacturing" product listing (Kronos, CIRCL-AP, QualiSurf and the rest)SourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
How the SPTS products (plasma dicing included), the Orbotech products and the ICOS products are positionedSourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
Countries of manufacture and R&D, and the statement that facilities are not allocated to segmentsSourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
The three statements about growth in the advanced packaging businessSourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
The ten-for-one stock split of 11 June 2026 and the quarterly dividend of US$0.230SourcedReferences 1 and 2 https://www.sec.gov/Archives/edgar/data/319201/000031920126000024/exhibit991earningsrelease7.htm
Fourth-quarter revenue of US$3.658bn, shareholder returns of US$3.35bn, first-quarter FY2027 guidance and the chief executive's commentsSourcedReference 2 https://www.sec.gov/Archives/edgar/data/319201/000031920126000024/exhibit991earningsrelease7.htm
The risk factors (BIS rules, tariffs, lower inspection sampling rates, obsolescence through AI, cyclicality)SourcedReference 1 https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/klac-20260630.htm
Revenue from back-end work (advanced packaging)Not yet confirmedNot disclosed. Only qualitative statements exist, so this article states no figure
Share of the process control market or of back-end inspectionNot yet confirmedNo primary source exists, so this article states no figure
The exact share of revenue TSMC represents, and the names of other customersNot yet confirmedThe company says only "more than 10%", and this article does not guess
When the name changed from KLA-Tencor to KLA CorporationNot yet confirmedAbsent from the FY2026 Form 10-K; this article could not confirm it
Plans for new plants and the scale of any capacity expansionNot yet confirmedOnly "planned expansions" is published, with no scale or timing, so this article states no figure
Trading relationships with OSATs, substrate makers and materials suppliersNot yet confirmedAbsent from KLA's own primary material, so this article does not treat them as partnerships
The outlook in section 10Not yet confirmedAn interpretation by this article, drawn from the six items in the facts table

Last updated 21 September 2026 / Troy Technical
Every figure in this article comes from KLA Corporation's statutory filings with the U.S. Securities and Exchange Commission or from the company's own announcements. No research-firm estimates or press-based figures have been used.

🌐 Japanese