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Onto Innovation | Company Profile

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Onto Innovation
Born from a 2019 merger, it builds the eyes of the back end

Onto Innovation makes the inspection and metrology tools that sit on a semiconductor production line. It builds neither chips nor packages. It sells the machines that look at what has been built and judge whether it came out right. The name appears in accounts of the back end because it is one of only a handful of suppliers whose tools can see the structures peculiar to the back end: bumps, redistribution layers and stacked assemblies. It is also the company that came out of the 2019 merger of Rudolph Technologies and Nanometrics.

Sources: Onto Innovation's filings with the U.S. SEC (the FY2025 Form 10-K, the second-quarter 2026 Form 10-Q, the press releases attached to its quarterly 8-K earnings filings, and the 2019 merger 8-K), used as primary material. Last updated September 2026.

What this article covers
  1. Onto Innovation in 30 seconds
  2. The logo and how the name is written
  3. What the company actually does, including how the merger came about
  4. Scale: five years of revenue
  5. Company category and position in the back-end industry
  6. Sites and the countries where it manufactures
  7. Leading products and share in semiconductor back-end work
  8. Current investment plans
  9. Major corporate partners
  10. Where the company is heading in this field
  11. The risks this company carries
  12. Glossary, references and claim-to-source audit

1. Onto Innovation in 30 seconds

LEGAL NAMEOnto Innovation Inc.A Delaware corporation, formerly Nanometrics Incorporated
HEADQUARTERSUnited States16 Jonspin Road, Wilmington, Massachusetts
UNDER THIS NAME SINCE25 October 2019Renamed on completion of the Nanometrics and Rudolph Technologies merger
LISTINGNew York Stock Exchange ONTO49,702,361 shares outstanding as of 5 February 2026
FY2025 REVENUEUS$1,005.26mUp 1.8% year on year. FY2025 was a 53-week year, ending 3 January 2026
EMPLOYEESAbout 1,615As of 3 January 2026, 55% of them in the United States
CATEGORYManufacturer
(inspection and metrology)
Builds neither chips nor packages. It sells tools and software
BACKLOGOver US$1bnAt the end of June 2026. The company calls it a first in its history
The one thing to grasp first

Revenue here is about US$1bn, two orders of magnitude below Applied Materials or ASML in the same equipment industry. It still comes up in every back-end conversation, because the tools are of an unusual kind. In the back end you have to look at bumps, the small metal protrusions that join chips, and at redistribution layers: structures of an entirely different size and shape from a front-end circuit pattern, inspected at very high speed and at close to 100% coverage. Looking for relatively large defects, over a wide area, quickly, is a different technology from front-end inspection, and by the company's own account the competition worldwide narrows to a handful of firms Sourced.

2. The logo and how the name is written

"Onto Innovation" and the product names (Dragonfly, Firefly, JetStep, Discover, NovusEdge, Element and others) are registered trademarks or trademarks of the company; the Form 10-K marks them with the appropriate symbols. This article does not generate an imitation of the logo. Where it is displayed, the frame above should hold the genuine logo file taken from the official site.

A note on style: the name is two words, with the second capitalised, and is not abbreviated in filings. Many people still remember the company by its predecessors, Nanometrics and Rudolph Technologies, and older material appears under those two names.

Official site: https://www.ontoinnovation.com/

3. What the company actually does, including how the merger came about

First, the facts of the merger

The description "a company formed in 2019 by the merger of Rudolph Technologies and Nanometrics" can be checked against the SEC filings as follows Sourced.

DateEventPrimary source
23 June 2019Nanometrics Incorporated, Rudolph Technologies, Inc. and PV Equipment Inc., a wholly owned subsidiary of Nanometrics, entered into an Agreement and Plan of MergerForm 8-K filed 28 October 2019
24 October 2019A special meeting of Nanometrics stockholders approved the issue of shares to Rudolph stockholders and an increase in authorised shares from 47 million to 97 millionForm 8-K dated 24 October 2019
25 October 2019PV Equipment merged into Rudolph, which survived as a wholly owned subsidiary of Nanometrics. At the same moment Nanometrics changed its name to Onto Innovation Inc.As above
25 October 2019Each Rudolph share was exchanged for 0.8042 of an Onto Innovation shareAs above
28 October 2019The listing moved from NASDAQ to the New York Stock Exchange and the ticker changed from NANO to ONTOAs above
As a legal entity, it was Nanometrics that survived

People describe it as a merger of equals, but the entity that continued in law was Nanometrics. In the SEC's own company database the same registration, CIK 704532, is treated as a change of name from "NANOMETRICS INC" (8 September 1995 to 25 October 2019) to "ONTO INNOVATION INC." Sourced. Rudolph was the side absorbed, as a subsidiary. That is why the five years of results in this article connect continuously to the period before 2019.

The founding years of Nanometrics and of Rudolph individually could not be established from the primary sources consulted here Not yet confirmed.

The business today

The company describes itself as a worldwide leader in the design, development, manufacture and support of metrology and inspection tools for the semiconductor industry Sourced. What it sells falls into three parts.

Revenue lineWhat it containsFY2025 (US$k)Share
Systems and softwareInspection tools, metrology tools, packaging lithography systems and yield management software847,83584%
PartsSales of replacement parts84,2008%
ServicesMaintenance contracts, system upgrades and time-and-materials work73,2288%
Totaln/a1,005,263100%

The customers are silicon wafer makers, integrated circuit manufacturers and advanced packaging manufacturers. The company states explicitly that its products are used in both the front end and the back end Sourced.

A materials engineer's view: front-end inspection and back-end inspection are different jobs

Front-end inspection means hunting for a minute defect buried in a circuit pattern a few nanometres across. Back-end inspection means looking at the height, position and shape of bumps tens of micrometres across, breaks in a redistribution layer, warpage and voids after moulding, misalignment in a stack. Three orders of magnitude apart. And in the back end several expensive chips sit in a single package, so one bad part wastes all of them. The company puts it this way: inspection rates through advanced packaging assembly are high, to avoid building a defective chip into an expensive package Sourced. From the materials side, the second half of that sentence is the important part. The company is saying that demand for back-end inspection tools tracks assembly volume, not the shrink cycle. In other words, the number of AI chips shipped translates straight into tool demand.

4. Scale: five years of revenue

Onto Innovation annual revenue (US$ million) Bars show revenue; the figure under each is net income for that year 1,200 900 600 300 0 789 Net 142 1,005 Net 223 816 Net 121 987 Net 202 1,005 Net 137 FY2021 FY2022 FY2023 FY2024 FY2025 Fiscal years end near 1 January: FY2024 ended 28 Dec 2024, and FY2025 was a 53-week year to 3 Jan 2026
Fig. 1 Onto Innovation annual revenue and net income, FY2021 to FY2025. Source: the Form 10-K for each year, retrieved through the SEC's XBRL company facts API. Note that the fiscal year does not line up with the calendar year: each one closes near 1 January, and FY2025 was a 53-week year ending 3 January 2026. FY2022 and FY2025 came out at almost the same revenue by coincidence; what lies inside them is quite different. FY2025 revenue was flat while net income fell 32.2%, on deal costs and inventory write-downs Our calculation.
Fiscal yearRevenue (US$k)Operating income (US$k)Net income (US$k)R&D expense (US$k)Capex (US$k)
FY2021788,899156,407142,34996,11812,039
FY20221,005,183236,714223,334111,95318,405
FY2023815,868116,078121,159104,44222,573
FY2024987,321187,103201,670116,76731,903
FY20251,005,263132,927136,759131,97828,513

FY2025 was a 53-week year. R&D expense rose 37.3% over the five years, taking it from 12.2% to 13.1% of revenue Our calculation.

What happened in FY2025

Revenue was essentially flat, up 1.8%, but net income fell 32.2%, from US$201.67m to US$136.76m Our calculation. The company gives three reasons Sourced.

  1. Gross margin fell from 52.2% to 49.7%, on write-downs of slow-moving and obsolete inventory, restructuring costs tied to an infrastructure transition, and start-up costs for outsourced manufacturing
  2. Operating expenses rose from US$328.21m to US$366.84m, on restructuring costs, transaction costs and intangible amortisation from the Semilab USA acquisition, R&D project costs and higher personnel costs
  3. A change in the revenue mix: NAND and OSAT business grew while foundry and DRAM business shrank
Easy to misread

The shape of it is "advanced packaging for AI is booming, and profits fell". In fact the company attributes the decline in systems and software revenue in FY2025 to fewer shipments of the inspection product line that supports advanced packaging for AI chips Sourced. In the equipment business, years in which customers add capacity alternate with years in which they use up the capacity they added. Strong back-end demand and tools selling every year are two different statements.

Into 2026

MeasureQ2 2025Q2 2026Q3 2026 guidance
Revenue (US$m)253.6343.1380 to 400
Gross margin48.2%53.4%57.3 to 57.8%
Operating margin12.7%18.5%21.4 to 22.4%
Diluted EPS (US$)0.691.211.54 to 1.70

All figures on a GAAP basis. The third-quarter 2026 column is the company's guidance, not an actual result Not yet confirmed. Second-quarter 2026 revenue of US$343.1m was a quarterly record, and the six-month total was US$635.1m.

5. Company category and position in the back-end industry

The category is a manufacturer, of inspection and metrology equipment. It makes no chips, assembles no packages and supplies no materials. In the back-end supply chain it is the party that delivers tools into the plants of the OSATs and the memory makers.

FY2025 revenue by region (US$ thousand) Classified by where the shipment went. Taiwan and Korea together are 60% of the total Taiwan 318,770 (32%) Korea 279,416 (28%) United States 121,072 (12%) Japan 95,428 (10%) China 70,658 (7%) Southeast Asia 64,344 (6%) Europe 55,575 (5%) China fell from 17% of revenue in FY2023 to 7% in FY2025; the company lists export controls as a risk
Fig. 2 FY2025 revenue by region. Source: the FY2025 Form 10-K. Manufacturing is concentrated in the United States, yet more than 80% of revenue goes to Asia.

To be a little more concrete, here is where in the process flow the company's tools sit.

The same company's tools go into both the front end and the back end Product names as given in the FY2025 Form 10-K Front end (wafer fab) Thin-film metrology, OCD, wafer inspection NovusEdge / Element / MBIR and others (measures thickness, dimensions, contamination) Back end (packaging and test) Macro defect inspection, packaging lithography Dragonfly G3 / Firefly / JetStep X500 (looks for defects in bumps, RDL and stacks) Front-end tool demand moves with each shrink generation; the back end moves with assembly volume But the company reports a single segment and does not split revenue front end from back end The company states that Dragonfly and Firefly are installed in both front-end and back-end plants
Fig. 3 Where the products are used. Source: the "Business" section of the FY2025 Form 10-K. All product names are registered trademarks or trademarks of the company Not yet confirmed.

6. Sites and the countries where it manufactures

The footprint has one very clear feature: all manufacturing is inside the United States, and the overseas sites do sales and service only Sourced. The Form 10-K states that substantially all of the company's long-lived assets are located in the United States.

SiteCountryUseFloor area (sq ft)
Wilmington, MassachusettsUnited StatesHeadquarters, engineering, service77,500
Milpitas, CaliforniaUnited StatesEngineering, manufacturing, service, administration. The only owned property134,600
Bloomington, MinnesotaUnited StatesEngineering, manufacturing, service, administration98,700
Tampa, FloridaUnited StatesEngineering, manufacturing, service, administration52,800
Budd Lake, New JerseyUnited StatesEngineering, service, administration48,900
Tucson, ArizonaUnited StatesEngineering, manufacturing, service18,900
North Billerica, MassachusettsUnited StatesEngineering, manufacturing, service14,400
Hillsboro and SnoqualmieUnited States (Oregon and Washington)Engineering, service17,100 / 20,300
TaiwanTaiwanSales, service38,600
KoreaKoreaSales, service37,000
ChinaChinaSales, service, engineering28,600
JapanJapanSales, service12,400
SingaporeSingaporeSales, service11,300

From the principal facilities table of the Form 10-K, as of 3 January 2026. There are leased properties in Germany, the Netherlands, Malaysia and Vietnam as well. The longest lease runs to 30 November 2035.

A materials engineer's view: manufacturing in America, customers in Asia

Eighty-six per cent of revenue goes to Asia (Taiwan 32%, Korea 28%, Japan 10%, China 7% and Southeast Asia 6%), and every manufacturing site is inside the United States Our calculation. A tool is not finished when it ships: installation, recipe tuning and maintenance continue for years. So it makes sense that the overseas sites are sales and service, and that in the headcount breakdown sales, applications and service support come to 739 people, 46% of the 1,615 employees Our calculation. Put the other way round, this company's competitiveness rests not only on how good the tool is but to a large degree on the number and quality of the people who build the recipe inside the customer's plant. Because an inspection recipe has to be rebuilt every time a material or a process condition changes, this is also where a materials supplier ends up dealing with the equipment maker directly.

7. Leading products and share in semiconductor back-end work

The products that touch the back end

Dragonfly G3
The latest macro defect inspection system. It is installed in wafer fabs (front end) and packaging plants (back end) alike. It is fast, and recipes can be created without a wafer.
Firefly
A macro inspection system for panels. It performs high-resolution inspection and passes per-die defect location data to the lithography tool.
JetStep X500
A lithography system for advanced packaging. The technology came originally from the flat panel display market, and it builds redistribution layers on thin organic laminate panels.
StepFAST
The company's own process for handing the defect locations Firefly finds to JetStep, raising lithography throughput.
Discover
Yield management software. It classifies and analyses the large volumes of data inspection produces, and identifies the causes that bear directly on yield.
ADC
Automated defect classification. Full-wafer images taken simultaneously in bright field and dark field are compared with an ideal defect-free image, and the difference is decomposed into mathematical vectors and matched against a library of known defects.

Panels: a big story for this company

The passage in the Form 10-K that goes furthest on the back end concerns the move from round 300mm wafers to rectangular panels Sourced.

What the company says (in summary)

Advanced packaging plants are moving from 300mm wafers to large rectangular panels of up to 650mm by 650mm in order to lower cost of ownership and raise productivity. Free of the constraints of a round wafer, more devices can be processed per pass. Because JetStep X500 came out of the flat panel display market, it transfers to this use directly, and combined with Firefly the company says it can offer a path from wafer-based to panel-based production while holding capital spending down.

A round wafer wastes area at the edge; a rectangular panel can be tiled without gaps. The larger the AI chip package, the more that difference matters. But flatness, warpage and thermal expansion all become harder to control, so the need for inspection goes up, not down. That is why this company welcomes the shift to panels.

On market share, plainly

What could not be confirmed

Onto Innovation officially discloses neither revenue from back-end tools nor market share. It reports as a single segment. Market descriptions such as "Advanced Nodes" and "Specialty Devices and Advanced Packaging" appear in the narrative of its earnings commentary, but no amounts are broken out Not yet confirmed. Figures of the form "X per cent share of advanced package inspection" come from research firms or the press, and this article does not use them.

What primary material does give is the list of competitors the company names itself Sourced. Note that the rival differs from market to market.

MarketPrincipal competitors named by the company
Thin-film and OCD metrology (mainly front end)KLA Corporation, Nova Ltd.
Advanced packaging inspectionKLA Corporation, Camtek Ltd.
Advanced packaging lithographyUshio, Inc., Canon, Inc.
Panel market inspectionGigaVis Co. Ltd.

The company also states that some competitors may have greater financial, research, manufacturing and marketing resources than it does.

Where the customers are concentrated

Customers above 10% of revenueFY2023FY2024FY2025
Customer A14%23%20%
Customer B19%17%15%
Customer Cunder 10%12%14%
Three combinedn/a52%49%

The totals are this article's own arithmetic Our calculation. The company does not name its customers Not yet confirmed. As of 3 January 2026, one customer accounted for about 12% of accounts receivable.

8. Current investment plans

This is not a company that builds factories, so capital expenditure is small (US$28.51m in FY2025) and the spending that drives growth goes into research and development and acquisitions.

FY2025 R&D EXPENSEUS$131.98m13.1% of revenue, against US$96.12m five years earlier in FY2021
FY2025 CAPEXUS$28.51m2.8% of revenue, down from US$31.90m the previous year
SEMILAB USA ACQUISITIONPurchase price US$526.6mAcquired 17 November 2025. The largest use of cash in FY2025
CASH ON HANDUS$1.88bnCash and short-term investments at the end of June 2026, against US$639.6m at FY2025 year end

The Semilab USA acquisition, November 2025

In the fourth quarter of FY2025 the company acquired Semilab USA LLC, a subsidiary of Hungary's Semilab International Zrt., for a total of US$526.6m Sourced. Three product lines came with it.

Product lineWhat it strengthens
FAaSTIn-line wafer contamination monitoring
CnCVSurface charge metrology, an area the company describes as proprietary
MBIRMaterials analysis by infrared reflectometry, for process control of high-aspect-ratio structures, films and epitaxial layers
The numbers worth noting on this acquisition

In the roughly six weeks from the acquisition date to the FY2025 year end on 3 January 2026, Semilab USA contributed US$8.6m of revenue and an operating loss of US$6.2m Sourced. The inventory step-up from the acquisition runs through cost of revenue as a non-recurring charge: US$4.0m was recognised in FY2025, and the remaining US$9.1m or so is expected to be recognised over the year after acquisition. Amortisation of the intangible assets brings with it a deferred tax liability of US$46.6m. The company itself states that the purchase price allocation is provisional and may change during the measurement period, which runs up to twelve months from the acquisition date Not yet confirmed.

This acquisition was not a back-end move. All three added product lines address wafers and materials, which reads as a sign that the company does not intend to rest on the back end alone.

9. Major corporate partners

What could not be confirmed

Neither the FY2025 Form 10-K nor the second-quarter 2026 Form 10-Q names a single customer. Customers above 10% of revenue are disclosed anonymously, as Customer A, Customer B and Customer C. This article therefore records no relationship of the form "which company's plants hold Onto Innovation tools" Not yet confirmed.

The corporate relationships that primary sources do establish are these.

KindCounterpartySubstancePrimary source
Merger (2019)Rudolph Technologies, Inc.Absorbed as a wholly owned subsidiary of Nanometrics at an exchange ratio of 0.8042, with Nanometrics renamed Onto Innovation at the same momentForm 8-K of 28 October 2019 Sourced
Acquisition (2025)Semilab USA LLC, a subsidiary of Semilab International Zrt.Acquired for a total of US$526.6m, bringing the FAaST, CnCV and MBIR product linesFY2025 Form 10-K, note 3 Sourced
CompetitorsKLA, Nova, Camtek, Ushio, Canon, GigaVisNamed outright by the company, market by market (section 7)FY2025 Form 10-K Sourced
CustomersNot disclosed (A 20% / B 15% / C 14%)FY2025. The three together are 49% of revenueFY2025 Form 10-K, note 15 Sourced

10. Where the company is heading in this field

What is established

FactWhat it implies for the back end
Backlog passed US$1bn at the end of June 2026, which the company calls a first in its historyIt entered the second half of 2026 holding orders worth roughly a full year of revenue
Second-quarter 2026 revenue of US$343.1m was a quarterly recordAdvanced nodes and advanced packaging are growing at the same time
The company says advanced package demand is supported by 2.5D logic, HBM and silicon photonicsAll three are structurally complex in the back end, with many inspection steps
The company states that advanced package tool demand tracks assembly volumeDemand arrives without waiting for a shrink generation. But if volume stops, so does demand
The move from 300mm wafers to panels of up to 650mm square is under wayA direct tailwind for a company that owns JetStep X500 and Firefly
The Semilab USA acquisition added front-end and materials product linesThe company is deliberately reducing its dependence on the back end alone

Outlook

Not yet confirmed Read plainly, the facts above point towards this company holding its place in back-end inspection and metrology for now. There are two reasons. One is that the competitors it names in advanced packaging inspection number just two, KLA and Camtek. The other is that the more complex a package becomes, the more inspection steps it needs, while an inspection tool, unlike a process tool, is not really a contest of how many wafers one machine can run, so rising volume translates fairly directly into more tools sold.

Not yet confirmed The weaknesses have to be held in view as well. At about US$1bn of revenue, this company is an order of magnitude smaller than KLA. R&D spending of US$131.98m a year is less than one division of a large rival. Strong in a specific domain, vulnerable to being outspent is exactly the structure the company itself writes into its risk factors, in the line about competitors that may have greater resources Sourced.

11. The risks this company carries

RiskSubstanceSupporting figures
Customer concentrationThe top three customers are 49% of revenue. One of them pausing its capital spending moves the results substantiallyFY2025: A 20%, B 15%, C 14% Our calculation
Cyclicality of tool demandFY2023 revenue fell 18.8% year on year, and operating income more than halvedFY2022 1,005,183 to FY2023 815,868 (US$k) Our calculation
Falling China business and export controlsChina went from 17% of revenue in FY2023 to 7% in FY2025. The company states that tariffs and export controls have already adversely affected, and may continue to affect, its competitive position with customers in China and elsewhereThe Form 10-K risk factors and segment information
A gap in resources against competitorsThe company itself states that some competitors may have greater financial, research, manufacturing and marketing resourcesThe Form 10-K risk factors
The barrier to switching tool vendorsThe company lists as a risk that because switching equipment vendors is costly, it can be difficult to win new customers from competitors even when its tools are superior. The barrier to entry points at the company tooThe Form 10-K risk factors
Integrating the acquisitionSemilab USA ran an operating loss of US$6.2m in its first six weeks. The purchase price allocation is provisional and may change within the twelve-month measurement periodFY2025 Form 10-K, note 3
Inventory valuation and restructuringIn FY2025, write-downs of slow-moving and obsolete inventory and restructuring costs took 2.5 points off gross margin52.2% to 49.7% Our calculation
A materials engineer's view: what to watch in this company

Look at backlog before you look at revenue. A tool takes several quarters from order to acceptance, so revenue always reflects past demand. The company said in its second-quarter 2026 release that backlog had passed US$1bn for the first time, and that figure tells you about demand now Sourced. The second thing to watch is gross margin. It fell to 49.7% in FY2025, recovered to 53.4% in the second quarter of 2026, and is guided to the high 57s in the third quarter. Whether that recovery arrives is what will settle whether the FY2025 profit decline was a one-off Not yet confirmed.

12. Glossary

Metrology
Measuring dimensions, film thickness, shape or composition as numbers. It produces the value itself, rather than a pass or fail verdict.
Inspection
Finding out whether a defect is present. Most approaches compare images and look for the difference.
Macro defect inspection
Searching at high speed across a whole wafer or panel for relatively large defects, from microns to sub-millimetre. It matters particularly in the back end.
OCD metrology
Optical critical dimension. A non-destructive method that infers the cross-sectional shape and dimensions of a repeating pattern from the spectrum of reflected light.
RDL
Redistribution layer. A thin wiring layer that routes the chip's pads out to positions where they can connect to the package substrate.
Panel level packaging
Building packages on a large rectangular panel, up to 650mm by 650mm, rather than a round 300mm wafer. Area utilisation improves.
Heterogeneous integration
Joining dissimilar chips, logic and memory for instance, side by side and vertically with copper pillars and bumps, into one package.
Backlog
Orders received but not yet recognised as revenue. In the equipment industry it is read as a leading indicator of future sales.
Concept diagram showing an optical system scanning packages laid out across a large rectangular panel (AI-generated concept image)AI-generated concept
Fig. 4 Concept diagram of panel-level inspection. This is an AI-generated concept image and does not depict actual tools or products.

13. References

  1. Onto Innovation Form 10-K for the fiscal year ended January 3, 2026 (filed with the U.S. SEC on 24 February 2026). Revenue, operating income, net income, R&D expense and capital expenditure; the revenue split by line; revenue by region; customer concentration; headcount and its composition; the principal facilities table; the description of products and markets; the named competitors; the Semilab USA acquisition; and risk factors.https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
  2. Onto Innovation Second quarter 2026 earnings release (Form 8-K, Exhibit 99.1, 6 August 2026). Second-quarter and six-month results, backlog above US$1bn, the trend in advanced nodes and advanced packaging, and third-quarter guidance.https://www.sec.gov/Archives/edgar/data/704532/000119312526337990/onto-ex99_1.htm
  3. Onto Innovation (then Nanometrics Incorporated) Form 8-K (filed with the U.S. SEC on 28 October 2019). Completion of the merger with Rudolph Technologies, the 0.8042 exchange ratio, the change of name to Onto Innovation Inc., and the move from NASDAQ to the NYSE with the change of ticker.https://www.sec.gov/Archives/edgar/data/704532/000119312519275593/d823487d8k.htm
  4. U.S. SEC EDGAR XBRL company facts API (CIK 0000704532). Revenue, operating income, net income, R&D expense and capital expenditure for FY2021 to FY2025, as tagged in each year's Form 10-K.https://data.sec.gov/api/xbrl/companyfacts/CIK0000704532.json
  5. U.S. SEC EDGAR submissions API (CIK 0000704532). The record of the former name "NANOMETRICS INC" (8 September 1995 to 25 October 2019), the listing venue (NYSE), the ticker (ONTO) and the head office address.https://data.sec.gov/submissions/CIK0000704532.json
  6. Onto Innovation (then Nanometrics Incorporated) Form 8-K (filed with the U.S. SEC on 24 October 2019). Approval of the merger proposals at the special meeting of stockholders, and the increase in authorised shares from 47 million to 97 million.https://www.sec.gov/Archives/edgar/data/704532/000119312519273698/d823625d8k.htm

14. Claim-to-source audit

Claim in the articleCategorySource
Legal name, head office address (16 Jonspin Road, Wilmington, MA), listing venue (NYSE ONTO), shares outstandingSourcedReferences 1 and 5https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
That the former name was Nanometrics Incorporated and that it changed on 25 October 2019SourcedReferences 5 and 3https://data.sec.gov/submissions/CIK0000704532.json
The merger agreement of 23 June 2019, completion on 25 October 2019, the 0.8042 exchange ratio, and Rudolph surviving as a wholly owned subsidiarySourcedReference 3https://www.sec.gov/Archives/edgar/data/704532/000119312519275593/d823487d8k.htm
The approval at the special meeting of 24 October 2019 and the increase in authorised sharesSourcedReference 6https://www.sec.gov/Archives/edgar/data/704532/000119312519273698/d823625d8k.htm
The move from NASDAQ to the NYSE and the ticker change from NANO to ONTO on 28 October 2019SourcedReference 3https://www.sec.gov/Archives/edgar/data/704532/000119312519275593/d823487d8k.htm
FY2025 revenue of US$1,005,263k, operating income of US$132,927k and net income of US$136,759kSourcedReferences 1 and 4https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
Revenue, operating income, net income, R&D expense and capex for FY2021 to FY2024SourcedReference 4, from each year's Form 10-Khttps://data.sec.gov/api/xbrl/companyfacts/CIK0000704532.json
The 1.8% increase, the 32.2% fall in net income, R&D up 37.3% over five years and from 12.2% to 13.1% of revenue, and the 18.8% decline in FY2023Our calculationDerived from the figures in references 1 and 4https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The reasons for the FY2025 profit decline (inventory write-downs, restructuring costs, acquisition costs, product mix)SourcedThe MD&A of reference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
Gross margin of 49.7% (FY2025), 52.2% (FY2024) and 51.5% (FY2023)SourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The revenue split by line (systems and software 847,835 / parts 84,200 / services 73,228, US$k)SourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
Revenue by region (Taiwan 318,770 / Korea 279,416 / United States 121,072 / Japan 95,428 / China 70,658 / Southeast Asia 64,344 / Europe 55,575, US$k)SourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The 86% total for AsiaOur calculationThe regional shares of reference 1, added togetherhttps://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
About 1,615 employees, the breakdown (R&D 419, operations 263, administration 194, sales, applications and service 739), and 55% United States, 40% Asia-Pacific, 5% EuropeSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
Sales and service staff at 46% of the totalOur calculationDerived from the headcount breakdown in reference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The location, use and floor area of the principal facilities, Milpitas as the only owned site, and substantially all long-lived assets being in the United StatesSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
Customer concentration (FY2025 A 20% / B 15% / C 14%; FY2024 23 / 17 / 12%; FY2023 14 / 19 / under 10%) and one customer at 12% of receivablesSourcedReference 1, note 15https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The top three at 49% combined (FY2025) and 52% (FY2024)Our calculationThe disclosed shares of reference 1, added togetherhttps://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The product names (Dragonfly G3, Firefly, JetStep X500, Discover, NovusEdge, Element, MBIR and others) and their usesSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The move from 300mm wafers to panels of up to 650mm by 650mm, and the description of StepFASTSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The company's statement that advanced package tool demand tracks assembly volumeSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The named competitors (KLA, Nova, Camtek, Ushio, Canon, GigaVis) and which market each belongs toSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The Semilab USA acquisition (US$526.6m purchase price, acquired 17 November 2025, FAaST / CnCV / MBIR, US$8.6m of contributed revenue and a US$6.2m operating loss, US$4.0m of inventory step-up with about US$9.1m remaining, a US$46.6m deferred tax liability)SourcedReference 1, note 3https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
That the purchase price allocation is provisionalNot yet confirmed (the company says so)Reference 1, note 3https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The second-quarter 2026 results (revenue US$343.1m, gross margin 53.4%, operating margin 18.5%, EPS US$1.21) and the six-month total of US$635.1mSourcedReference 2https://www.sec.gov/Archives/edgar/data/704532/000119312526337990/onto-ex99_1.htm
Backlog passing US$1bn at the end of June 2026, and cash on hand of US$1.88bnSourcedReference 2https://www.sec.gov/Archives/edgar/data/704532/000119312526337990/onto-ex99_1.htm
The third-quarter 2026 guidance (revenue US$380m to US$400m, gross margin 57.3% to 57.8% and the rest)Not yet confirmed (company guidance)Reference 2https://www.sec.gov/Archives/edgar/data/704532/000119312526337990/onto-ex99_1.htm
The fall in China revenue (17% to 7%) and the export control risk wordingSourcedReference 1https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
Revenue from back-end tools, and the amounts behind the market descriptions (Advanced Nodes, Advanced Packaging and so on)Not yet confirmedNot disclosed, because there is a single reporting segment, so this article states no figure
Market share in advanced packaging inspectionNot yet confirmedNo primary source exists, so this article states no figure
The names of Customers A, B and CNot yet confirmedAbsent from references 1 and 2, and this article does not guesshttps://www.sec.gov/Archives/edgar/data/704532/000119312526066937/onto-20260103.htm
The founding years of Nanometrics and of Rudolph TechnologiesNot yet confirmedThe primary sources this article consulted do not establish them
The outlook in section 10Not yet confirmedAn interpretation by this article, drawn from the six items in the facts table

Last updated 21 September 2026 / Troy Technical
Every figure in this article comes from the statutory filings that Onto Innovation Inc., and Nanometrics Incorporated before the merger, submitted to the U.S. Securities and Exchange Commission. No research-firm estimates or press-based figures have been used.

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