ASMPT– tag –
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Applied Materials Launches New HBM & 3D Packaging Systems, Acquires ASMPT NEXX to Scale AI Compute
Exoswan Insights USA Overview Applied Materials has introduced new CMP, ECD, deposition, and e-beam systems for HBM and 3D packaging, alongside acquiring ASMPT's NEXX business, to capitalize on the escalating demand for AI computing. The... -
ASMPT to Showcase Advanced Thermocompression and Hybrid Bonding Innovations for HPC and AI at SEMICON Taiwan 2026
ASMPT SEMI Solutions Taiwan Overview Global technology leader ASMPT announced it will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, supporting HPC, AI accelerators, silicon photonics, and Co-Packaged Optics (CPO) appl... -
ASMPT’s Advanced Packaging Business Achieves Record H1 2026 Sales Driven by Surging AI Demand; Panel-Level Packaging Positioned as Key Future Growth Driver
ASMPT Corporate (Press Release) Hong Kong Overview ASMPT reported robust interim results for H1 2026, with its Advanced Packaging (AP) business achieving record sales, primarily fueled by the accelerating demand from the AI sector. The c... -
ASMPT’s Advanced Packaging Business Achieves Record Sales in H1 2026, Driven by Surging AI Demand
ASMPT Singapore Overview ASMPT reported robust financial results for the first half of 2026, with its Advanced Packaging (AP) business achieving record sales, significantly propelled by escalating AI demand. Key contributors included The... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
Singapore Semiconductor Testing Equipment Market Projected to Reach $310 Million by 2033, Growing at 7.8% CAGR
ABNewswire Singapore Overview This article provides an overview of a market research report on the Singapore semiconductor testing equipment market, distributed by ABNewswire. The report forecasts the market to reach $310 million by 2033... -
Applied Materials Achieves Record $7.91 Billion Revenue in Q2 2026, Advanced Packaging Business to Accelerate Over 50% for AI
MLQ.ai USA Overview Applied Materials reported record revenue of $7.91 billion in Q2 2026, marking a 13% sequential and 11% year-over-year increase, with non-GAAP gross margin reaching 50%, an 80 basis point improvement. The company anti... -
ASMPT Establishes Advanced Packaging Technology Advisory Council to Accelerate AI-Era Innovation
ASMPT Singapore Overview ASMPT has established an Advanced Packaging Technology Advisory Council (TAC) to address the growing importance of advanced packaging for next-generation computing and AI components. The TAC will focus on a broad...
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