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Hot Chips 2026: OpenAI Unveils ‘Jalapeño’ AI ASIC, Claiming 30% Efficiency & Throughput Gains Over Nvidia Blackwell
Tom's Hardware USA Overview At Hot Chips 2026, OpenAI unveiled 'Jalapeño,' an AI-developed custom AI ASIC, claiming up to 30% efficiency and throughput improvements over Nvidia's high-performance Blackwell GPUs. Jalapeño utilizes a NUMA-... -
Atomica Unveils ‘AI Photonic Integration Platform’ to Overcome Integration Bottlenecks in AI Infrastructure
Chiplet Marketplace USA Overview Atomica has launched its 'AI Photonic Integration Platform' to address critical integration bottlenecks within AI infrastructure. This platform integrates advanced microfabrication technologies, including... -
Atomica Unveils AI Photonic Integration Platform to Resolve Optics-to-Packaging Bottlenecks in AI Hardware
The Data Center Engineer USA Overview Atomica has launched its 'AI Photonic Integration Platform' to address integration bottlenecks across photonics, electronics, memory, thermal structures, and package-level interfaces in AI infrastruc... -
Marvell Expands Photonic Fabric to Enable Disaggregated HBM Memory Pooling for Multi-Rack AI Systems via Optical Interconnects
Converge Digest USA Overview Marvell announced the expansion of its Photonic Fabric architecture to leverage optical technology for disaggregating and pooling memory across multi-rack AI systems. This innovative approach aims to overcome... -
AI Chip Race Shifts to Advanced Packaging as 130M Accelerators Ship; TSMC’s CoWoS Dominates, Intel Pursues Alternatives
The Korea Economic Daily South Korea Overview The competitive landscape in the AI semiconductor market is shifting from process nodes to advanced packaging, with over 130 million AI accelerators projected to ship with advanced-packaged o... -
Marvell Unveils Photonic Fabric Products Post-Celestial AI Acquisition, Fortifying AI Memory Infrastructure
Technologies.org USA Overview Following its acquisition of Celestial AI in February 2026, Marvell has launched new AI memory infrastructure products, including Photonic Fabric memory modules, NICs, and chiplets. These offerings aim to bo... -
Optical Computing Redefines AI’s Physical Limits; China Accelerates Industrialization with Key Innovations
LINIOBATE | Power Next Gen Photon China Overview Optical computing is rapidly advancing to redefine the physical limits of AI computing by overcoming the 'power wall' and 'memory wall' of electronic chips. Lightmatter's photonic AI accel... -
Lumentum CEO Flags Indium Phosphide Wafer Shortage; US Regulators Consider Banning Chinese Optical Transceivers, Potentially Benefiting Coherent and Other US Firms
Morningstar USA Overview Lumentum Holdings' CEO has warned that indium phosphide wafers, crucial for silicon photonics, could face a more severe supply crunch than memory semiconductors. Proactively, Lumentum has deposited $87 million wi... -
US to Invest $874 Million in AI Computing Supply Chain, Prioritizing Photonics, Memory, and Advanced Packaging for Next-Gen Chips
DataTrack USA Overview The U.S. Department of Commerce announced up to $874 million in federal incentives under the CHIPS and Science Act, allocated to seven companies, to accelerate semiconductor R&D for next-generation computing an... -
NVIDIA and SK Group Forge $500 Billion AI Alliance for 2GW Data Centers and HBM Supply
MLQ.ai International Overview NVIDIA and South Korea's SK Group have forged a $500 billion strategic AI partnership focused on co-developing a 2-gigawatt (GW) next-generation AI data center and ensuring a long-term supply of high-bandwid...
