Outgassing– tag –
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Dow Launches DOWSIL TC-3120 Thermal Gel with 12 W/m·K Conductivity for AI Networking and 800G/1.6T Optical Modules
Lightwave USA Overview Dow has introduced DOWSIL TC-3120 Thermal Gel, a new silicone-based thermal interface material (TIM) designed for high-speed networking equipment, optical modules, and other electronics facing intense thermal-manag... -
Yousan New Materials Unveils High-Performance Non-Silicone Thermal Interface Pads for AI Chips and Servers
Yousan New Materials China Overview Yousan New Materials has launched a new line of non-silicone thermal interface pads with thermal conductivities ranging from 2.0 to 10.0 W/m·K, specifically engineered for AI chips, servers, and high-p... -
AGC Fluoroproducts Boost Semiconductor and Electronics Performance with High-Temp Release Films and Low-Outgassing Coatings
AGC Chemicals Americas USA Overview AGC's fluoroproducts provide advanced solutions to enhance the performance and reliability of semiconductors and electronics. Fluon® ETFE films offer superior release and cushioning properties at tempe...
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